Sumida Corporation

Mitsubishi Denki Kabushiki Kaisha

Renesas Technology Corp.

Kazuyuki Kikuchi

Satoru Yamada

Mitsugu Kawarai

Tsutomu Otsuka

Tomohiro Kajiyama

Motomi Takahashi

Juichi Ooki

Yoshiyuki Tahara

An electronic component includes; a magnetic-body core having a plate-shaped portion and a core portion which extends from an upper surface of the plate-shaped portion; a winding wire which includes a wound portion wound by a rectangular wire into an Edgewise winding form and two non-wound portions extending from the wound portion to two distal ends, and the core portion is inserted through the wound portion; and a magnetic exterior body which covers at least the wound portion and the core portion. The two non-wound portions are respectively arranged along a bottom surface and at least one of the side surfaces of the plate-shaped portion. Parts of the two non-wound portions arranged along the bottom surface are electrodes.

Electronic component

A coil component including: a magnetic core which is formed by a magnetic material and which has a top surface, a bottom surface facing the top surface and a side surface continuous approximately perpendicularly to the top surface and the bottom surface; a coil which is buried inside the magnetic core and whose end portion protrudes from the side surface of the magnetic core; a flat-shaped terminal which protrudes from the side surface of the magnetic core, is bent toward the bottom surface of the magnetic core and is connected with the end portion of the coil, wherein there is formed an opening portion at a position corresponding to the place which is bent for the flat-shaped terminal from the side surface to the bottom surface of the magnetic core.

Coil component

A semiconductor integrated device has one signal processing IC and one microcomputer unit (MCU). A few terminals of the IC are connected to the corresponding terminals of the MCU. The terminals of the IC that are connected to the corresponding terminals of the MCU are disposed near each other. Similarly, the terminals of the MCU that are connected to the corresponding terminals of the IC are disposed near each other. Moreover, the IC and the MCU are mounted, on a substrate, so that the connected terminals of the IC and MCU face each other.

Semiconductor integrated device

In an image intermediate-frequency processing apparatus, in addition to a first phase locked loop (PLL) for receiving a television broadcast, there is provided a second PLL including a voltage controlled oscillator (VCO), two frequency-dividing units, a reference signal generating unit, a phase-comparing unit, and a filter. When receiving FM broadcast, a stable oscillation output obtained from the VCO is input into an audio intermediate frequency detector, to obtain an audio signal of high quality.

Video intermediate frequency processing apparatus

A video intermediate-frequency signal processing device capable of receiving FM broadcasts, includes a first FM detecting unit for demodulating an intermediate-frequency signal from a sound intermediate-frequency detecting unit using a phase-locked loop, and for furnishing a demodulated FM signal, a second FM detecting unit for detecting or demodulating a reference signal applied to generate a reference DC voltage, a comparator for obtaining a difference between the modulated FM signal from the first FM detecting unit and the reference DC voltage from the second FM detecting unit, and for furnishing, as a sound signal, a signal having a value corresponding to the difference, and a feedback unit for, when receiving FM broadcasts, filtering the output of the comparator, and feeding the filtered output back to a low-pass filter of a phase-locked loop included in a video detecting unit.

Video intermediate-frequency signal processing device capable of receiving FM broadcasts

A digital-to-analog converter includes a ladder circuit and transistors. A control voltage generating circuit is coupled to the transistors in a feedback configuration to control current flowing through the transistors. The control voltage generating circuit includes an operational amplifier coupled to a transistor. Using the control voltage generating circuit, the digital-to-analog converter of the present invention produces an analog output voltage resistant to variation in the DC forward current gain of the transistors.

Growing community of inventors

Tokyo, Japan

Kazuyuki Kikuchi