Adeka Corporation

Dic Corporation

Kazuyuki Itano

Hirokatsu Shinano

Hiroya Fukunaga

Masatomi Irisawa

Satoshi Yanagisawa

Mineki Hasegawa

Takahiro Otsuka

Tatsunori Kobayashi

Rieko Hamada

Hiroya Fukunga

A curing resin composition that cures in two stages: photo cure and thermal cure, hardly contaminates a liquid or liquid crystals when in contact with, and provides high adhesive strength, particularly a curing composition that photocures sufficiently even when shadowed by TFT wires, a black matrix, etc. in photocuring; and a sealant, a sealant for ODF (one-drop-fill), and an LCD containing the curing resin composition. The curing resin composition contains (A) an oxime ester radical initiator represented by general formula (I), where symbols are as defined in the description, (B) a radical curing resin, (C) a latent epoxy curing agent, and (D) an epoxy resin 

Curing resin composition

A sealant for a one drop fill process is characterized by curing through two steps consisting of photocure using visible light from which 400 nm or shorter wavelengths are cut off and thermal cure and, when in contact with a liquid crystal composition, is less contaminating to the liquid crystal composition with a photo radical initiator, and exhibits high adhesive strength to a substrate. The sealant contains (1) a titanocene photo radical initiator, (2) a photocuring resin, (3) a latent epoxy curing agent and, if necessary, (4) a monomer having at least two glycidyl ether groups per molecule as a thermosetting resin.

Sealant for one-drop fill process

A sealant for a one drop fill process of the invention contains the following components (1), (2), (3), and (4): (1) a curing agent composed of a reaction product produced by reacting an acid compound and a polyamine containing, within its molecule, at least one active hydrogen and at least two nitrogen atoms; (2) a heat-curable resin; (3) an acylphosphine-based photoinitiator; and (4) a photo-curable resin. A heat-curable resin containing a bisphenol A propylene oxide-modified epoxy resin is preferably used as the heat-curable resin (2), and a photo-curable resin containing a bisphenol A acrylate-modified resin is preferably used as the photo-curable resin (4).

Sealant for one drop fill process containing photo-curable resin and heat-curable resin

A trifunctional (meth)acrylate compound of general formula (I) is provided The compound is capable of retaining a liquid crystal phase at or below 30 &#xb0; C. Polymerizable compositions containing a compound of formula (I) are also provided.

Trifunctional (meth)acrylate compound and polymerizable composition containing same

A polymerizable compound represented by general formula (1) of the invention has good solvent solubility and excellent alignment control properties and optical characteristics.  In formula (1), Mand Mare each hydrogen or methyl; Xand Xare each a single bond, or an optionally branched C1-10 alkylene, alkyleneoxy or alkyleneoxycarbonyloxy; Xis optionally branched C1-10 alkylene; Yand Yare each an ester linkage, etc.; and rings A, B, C, and D are each a cyclic structure, such as 2,6-naphthlene.

Growing community of inventors

Tokyo, Japan

Kazuyuki Itano