Ebara Corporation

Nihon Micro Coating Co., Ltd.

Q.p. Corporation

Kazuyuki Inoue

Kenya Ito

Masaya Seki

Kenji Yamaguchi

Tamami Takahashi

Mitsuhiko Shirakashi

Jun Watanabe

Jun Tamura

Hideaki Takahashi

Ryoji Tanaka

Hideaki Kobayashi

Satoru Sato

Toshiharu Tanaka

Ryo Sasahara

Nanako Abe

Kenji Kato

Souichi Asakawa

Kayo Sugiura

Minori Kayanuma

Takayuki Watanabe

A substrate processing apparatus includes first and second polishing units for polishing a peripheral portion of a substrate, a primary cleaning unit for cleaning the substrate, a secondary cleaning and drying unit for drying the substrate cleaned in the primary cleaning unit, and a measurement unit for measuring the peripheral portion of the substrate. The measurement unit includes a mechanism for measurement required for polishing in the first and second polishing units, such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.

Substrate processing apparatus

A method for producing an improved dried egg white includes preparing a dried egg white by drying a liquid egg white so that the dried egg white after drying has a pH of 9 or more, and dissipating carbon dioxide contained in the dried egg white, wherein, by dissipating carbon dioxide contained in the dried egg white, the pH of the dried egg white is increased to 0.01 to 1 to obtain a pH of 9.5 or more and carbon dioxide concentration in a sealed 250 ml vial is decreased to 1% or less, when 25 g of the improved dried egg white is stored in the vial at 75&#xb0; C. for 24 hours.

Dried egg white, production method therefor, and food containing improved dried egg white

A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.

Device for polishing peripheral edge of semiconductor wafer

Growing community of inventors

Tokyo, Japan

Kazuyuki Inoue