Tdk Corporation

Kazuyuki Hasebe

Akitoshi Yoshii

Toshihiro Iguchi

Akira Goshima

Masaaki Togashi

Katsumi Kobayashi

Sunao Masuda

Takashi Komatsu

Kayou Kusano

Makoto Takahashi

Norihisa Ando

Naruki Kataoka

Takaki Shinkawa

Yuusaku Horie

Keiko Kubo

Kazunori Ito

Hiroki Saitoh

A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed.

Ceramic electronic component with metal terminals

A ceramic electronic component comprising; including a chip component of approximately rectangular parallelepiped, a first metal terminal portion having a first flat plate portion facing a first end face, at least a pair of first fitting arm portions connected to the first flat plate portion, having a first engagement projection engaging with a first wraparound portion holding the first wraparound portion in between, and a first mounting portion connected to the first flat plate portion and extending approximately parallel to one side face, and a second metal terminal portion having a second flat plate portion facing the second end face, at least a pair of second fitting arm portions connected to the second flat plate portion, having a second engagement projection engaging with a second wraparound portion, holding the second wraparound portion in between, and a second mounting portion extending approximately parallel to one side face.

Ceramic electronic component

A multilayer ceramic capacitor has an element body formed by alternately laminating a plurality of dielectric layers and a plurality of inner electrodes. On a substrate having a mounting surface provided with at least two lands, the multilayer ceramic capacitor is mounted such that the inner electrodes are parallel to the mounting surface. A multilayer ceramic capacitor mounting structure satisfies T/T&#x3e;0.1 and 300&#x2266;&#x3b5;&#x2266;2800, where T is the height of the multilayer ceramic capacitor, Tis the outer covering thickness of the element body, and &#x3b5;is the relative permittivity of the dielectric layers, and 0.6&#x2266;W/W&#x2266;1.0, where W is the width of the multilayer ceramic capacitor, and Wis the size of the land in a direction corresponding to the width of the multilayer ceramic capacitor.

Multilayer ceramic capacitor mounting structure and multilayer ceramic capacitor

A multilayer capacitor is provided with improved reliability and reduced ESL. In a width direction, a second principal-surface electrode portion is greater than a first principal-surface electrode portion, and a fifth principal-surface electrode portion is greater than a fourth principal-surface electrode portion. When viewed from a lamination direction, an outer edge of the second principal-surface electrode portion at the other end side is arranged near the other end side more than outer edge of the fifth principal-surface electrode portion at one end side. First lead portions are connected to the second principal-surface electrode portion, and second lead portions are connected to the fifth principal-surface electrode portion. Thus, portions of the second principal-surface electrode portion greater than the first principal-surface electrode portion and portions of the fifth principal-surface electrode portion greater than the fourth principal-surface electrode portion function as current paths between the first lead portions and the second lead portions.

Multilayer capacitor having reduced equivalent series inductance

A multilayer capacitor is provided with improved adhesiveness of layers of an element body and improved reliability. Outer edge of a second principal-surface electrode portion are respectively separated from an end surface and lateral surfaces, and are respectively arranged so as to surround the forefront portion of a third principal-surface electrode portion at one end side when viewed from a lamination direction. Outer edges of a fourth principal-surface electrode portion are respectively separated from an end surface and lateral surfaces, and are arranged so as to surround the forefront portion of a first principal-surface electrode portion in the width direction at the other end side when viewed from the lamination direction.

Multilayer capacitor with improved adhesiveness between the layers

A ceramic electronic component has a chip element body having a conductor arranged inside, external electrodes, and a discrimination layer. The chip element body has first and second end faces facing each other, first and second side faces being perpendicular to the first and second end faces and facing each other, and third and fourth side faces being perpendicular to the first and second end faces and to the first and second side faces and facing each other. The external electrodes are formed on the first and second end faces, respectively, of the chip element body. The discrimination layer is provided on at least one side face out of the first side face and the second side face in the chip element body. The chip element body is comprised of a first ceramic. The discrimination layer is comprised of a second ceramic different from the first ceramic and has a color different from that of the third and fourth side faces.

Ceramic electronic component, manufacturing method of ceramic electronic component, and packaging method of ceramic electronic components

A ceramic green sheet structure has a ceramic green sheet including at least a ceramic material and a resin and a conductive layer formed on the ceramic green sheet. An electrode non-formed area has a porosity equal to or greater than 17%, and preferably, equal to or less than 25%. Moreover, an electrode formed area where the conductive layer is formed may have a smaller porosity than the electrode non-formed area where no conductive layer is formed.

Ceramic green sheet structure and method for manufacturing laminated ceramic electronic component

A ceramic electronic component includes a ceramic body and an internal electrode layers disposed within the ceramic body. The ceramic body is covered with a diffusion layer, wherein said diffusion layer is an oxide layer into which at least a part of elements contained in the ceramic body are diffused and is located closer to a surface of the ceramic body than an outermost internal electrode layer.

A laminated ceramic capacitor C has a plurality of internal electrodes embedded in a dielectric base substance in a stratified manner, the internal electrodes are caused to conduct to a pair of terminal electrodes provided on an outer surface of the dielectric base substance, and the terminal electrode has an outermost layer containing Sn as a main component. There is provided a step of setting the laminated ceramic capacitor in a temperature environment which is not less than 125&#xb0; C. and not more than 180&#xb0; C. and applying a direct-current voltage between the terminal electrodes in order to measure a direct-current insulation resistance. The step of applying the direct-current voltage includes a first step and a second step. A direct-current voltage V(V/&#x3bc;m) which falls within a range of 20 to 40 (V/&#x3bc;m) is applied at the first step, and a direct-current voltage V(V) with a rated voltage being taken into consideration is applied at the second step after termination of the first step.

Growing community of inventors

Tokyo, Japan

Kazuyuki Hasebe