Hitachi, Ltd.

Hitachi Media Electronics Co., Ltd.

Opnext Japan, Inc.

Hitachi Cable, Inc.

Kazuyuki Fukuda

Kimio Tatsuno

Tadaaki Ishikawa

Koji Yoshida

Toshiaki Ishii

Tsutomu Kono

Toshinori Hirataka

Toshimasa Miura

Makoto Shimaoka

Hideyuki Kuwano

Takeshil Kato

Takeshi Kato

Katsuhiko Kimura

Naoki Matsushima

Seiichi Katou

Atsushi Kazama

Tetsuo Kumazawa

Masaya Horino

Yoshiaki Niwa

Yasuhiro Itou

Satoshi Kaneko

Tsuyoshi Tanaka

Satoshi Aoki

Kazuhiro Ito

Toshiya Shiramatsu

Atsushi Takai

Hidenao Saito

Toshio Sugiyama

Ryoji Okada

Hiroshi Naka

Teruhisa Akashi

Satoru Kikuchi

Katsumi Kuroguchi

Hideo Suenaga

Toshiya Yuhara

Hisao Iitsuka

Koichiro Tonehira

Hiromitsu Imamiya

Atsushi Miura

Shigefumi Kito

Shinzo Nishiyama

Eiichi Adachi

Yoshitaka Fujiwara

The invention can obtain an excellent linear property in a focusing direction and a tracking direction and can obtain a stable operation, in an objective lens driving means of an optical pickup. In an optical pickup reading and writing an information with respect to an optical disc by using an objective lens, a movable portion mounting the objective lens thereon is supported by a support member constituted by a pair of flexible printed circuit boards respectively curved in opposite directions in a parallel direction to an optical axis of the objective lens so as to be movable with respect to a fixed portion, in both side surfaces of the movable portion facing with holding the objective lens therebetween.

Objective lens with elastic support structure

An optical device wherein an optical component and a plurality of light emitting elements are mounted on an identical substrate, a level of a surface on which the optical component is mounted is different from that of a surface on which the light emitting elements are mounted by a step provided on the substrate, at least one plane vertical to the surface on which the optical component is mounted and located on a periphery of the substrate is opened, a reflecting surface, a transmitting surface or a diffraction grating surface of the optical component is provided along sides generated by the step provided in the substrate, optical axes of the plurality of light emitting elements of which polarization axes are in parallel with each other intersect with each other on the surface, and an exit light beam of the light emitting elements is emitted from the opened plane.

Optical device, optical pickup and optical disk apparatus

A small-size thin-bodied 3-dimensional matrix switch using a micro mirror array, comprises a collimator array with a plurality of collimators coupled to optical fibers, a mirror array with a plurality of movable mirrors, in which each movable mirror has light from a first collimator of the collimator array optically coupled thereto, a first mirror which has the light from the mirror of the mirror array optically coupled thereto, a second mirror which has the light from the first mirror optically coupled thereto, and a second collimator of the collimator array, which has the light from the second mirror coupled thereto, wherein the light leaving the second mirror passes the first mirror and the mirror array and optically couples to the second collimator.

Optical switch and optical switch system

A beam direction module which can be applied to an optical switch, comprising: a collimator support member; a first mirror substrate including first micro-mirrors, and first windows through which beams can pass; a first electrode substrate including first mirror driving electrodes, and second windows through which beams can pass; a first spacer; a second mirror substrate including second micro-mirrors, and third windows through which beams can pass; a second electrode substrate including second mirror driving electrodes, and fourth windows through which beams can pass; a second spacer; and an inter-mirror spacer, wherein the first electrode substrate, the first spacer, the first mirror substrate, the inter-mirror spacer, the second mirror substrate, the second spacer and the second electrode substrate are stacked successively on the collimator support member and fixed between caps and the collimator support member while pins protruding from the collimator support member are inserted into alignment through-holes formed.

Beam direction module and optical switch using the same

An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by injection using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.

Optical module, method for manufacturing optical module and optical communication apparatus

An optical coupling apparatus having a temperature control element on which a semiconductor light emitting element, a substrate and a lens are mounted, the semiconductor light emitting element being mounted on the substrate, and rays of light from the semiconductor light emitting element being introduced into the lens. A base on which the temperature control element is disposed, a through-hole portion formed in a housing wall portion installed on the base, penetrating through the housing wall portion and having a wall surface portion longer than a thickness of the housing wall portion and an optical fiber communicated with the through-hole portion and receiving converted light from the lens introduced thereto. A length of the substrate in a direction connecting the light emitting element to the optical fiber is within a range from 0.1 to 0.25 with respect to a length of the base sandwiched by the housing walls of the substrate.

Optical coupling apparatus

A smaller and higher performance optical transmitter module is provided, which can improve the reliability and which can be manufactured at lower costs and allow for stable laser transmission of an optical semiconductor element. The optical transmitter module which has an optical semiconductor element, an optical fiber optically coupled to the optical semiconductor element, an inline optical isolator provided for the optical fiber, and a package case containing the optical semiconductor element and the optical fiber, includes a substrate member with one end of the optical fiber on the light incident side fixed thereon to be optically coupled to the optical semiconductor element, a thermoelectric cooler with the substrate member joined to the top surface thereof, and a pipe-like support member projecting from the side face of the package case for fixing the optical isolator.

Optical transmitter module

In an optical coupling apparatus, an optical isolator and an optical fiber are arranged inside a pipe of a side surface of a package. A distal end of the optical fiber is arranged within a range of 3.0 mm from an inner/outer surface of the side surface of the package and a distance from a laser diode to the distal end is within a range from 3.5 to 7.5 mm. Distance from the inner side surface of the package to a Peltier device is within a range of 6.0 mm. A metallize pattern film applied to a terminal substrate of the package and the Peltier device are connected through wiring bonding and a connection position is closer to the optical fiber than a lead terminal provided to the terminal substrate of the package that corresponds to the Peltier device.

An optical communication equipment includes a semiconductor laser element, an image-forming element, an optical fiber and a substrate for mounting the semiconductor laser element, the image-forming element and the optical fiber. An optical output of the semiconductor laser element is adapted to be provided to the optical fiber via the image-forming element. The image-forming element is mounted in a V-groove formed in the substrate and having a substantially &ldquo;V&rdquo;-shaped cross-section. A shortest distance between a light spot of the semiconductor laser element and an optical axis of the image-forming element is 1 mm at most and the image-forming element substantially satisfies the sine condition.

Optical communication equipment and optical communication network equipment

An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by an injection method using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.

Semiconductor laser coupling device and method for assembling the same on circuit board

An optical semiconductor array module comprising an optical semiconductor array device constituted by a plurality of semiconductor laser diode, light-emitting diode elements or a plurality of semiconductor photo diode elements, an electronic device for driving and controlling the optical semiconductor array device, a cube-shaped package case for housing the optical semiconductor array device and the electronic device therein, an optical fiber array optically coupled to the optical semiconductor array device, a supporting member for holding and fixing the optical fiber array to one surface of the cube-shaped package case, and a terminal portion having a plurality of pins for electrically connecting an external circuit board to the electronic device. The terminal portion is formed by extending the terminal portion from at least one of surfaces forming the package case, excluding a surface on which the optical semiconductor array device and the electronic device are mounted and a surface opposite to that surface, and the plurality of pins are mounted in a surface of the terminal portion which crosses at right angles with a surface from which the optical fiber array is taken out, whereby the electronic device is mounted on the external circuit board through the plurality of pins and is electrically connected to the external circuit board.

Optical semiconductor array module, method of fabricating the module,

Growing community of inventors

Chiyoda, Japan

Kazuyuki Fukuda