Lucent Technologies Inc.

Kazuyoshi Ueno

Vincent Michael Donnelly, Jr

The present invention is directed to a device that has wires on at least two levels. The wires are either copper or a metal containing copper. At lease one via plug formed of copper or a metal containing copper is formed which electrically connects at least one wire on the first level with at least one wire on the second level. The device is fabricated under conditions that remove oxides and other metal that form on the exposed surface of the first level of metal during processing prior to the via plug being formed. The resulting interconnect between the first level of metal and the via plus is substantially non-oxidized copper or copper-containing metal.

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Kanagawa, Japan

Kazuyoshi Ueno