Murata Manufacturing Co., Ltd.

Kazuyoshi Uchiyama

Masahiko Kawaguchi

Naoki Iida

Katsuji Matsuta

Toshiya Sasaki

Keishiro Amaya

Eita Tamezawa

Katsuhiro Misaki

Keisuke Iwasaki

Keishirou Amaya

A laminated coil includes a laminated body insulating layers and coil patterns are integrally stacked in a desired order, a coil formed by connecting the coil patterns, a pair of external electrodes provided at opposite ends of the laminated body, and an insulating film provided on an outer peripheral surface of the laminated body. At least one of the coil patterns is in contact with an outer peripheral edge of the corresponding insulating layer at least a part of an outer peripheral edge of the coil pattern, but is not in contact with corners of the insulating layer in a manner such that the at least one coil-pattern is absent at portions of the corresponding insulating layer near the corners of the corresponding insulating layer.

Laminated coil

A small size electronic component has a small direct current resistance value of a conductor pattern and minimal dimensional irregularity of a conductor pattern. In order to form such a component, a photosensitive conductive paste applied on a ceramic substrate and is then exposed through a photo mask and developed so as to form a lower conductor pattern layer of a coil conductor pattern. Then an insulating paste is applied on the ceramic substrate so as to cover the lower conductor pattern layer and the insulating paste is removed with a solvent until at least the upper surface of the lower conductor pattern layer is exposed so as to form an inter-line insulating layer. Furthermore, after applying a photosensitive conductive paste as a film, the exposure and development operation is conducted again while using the photo mask so as to form an upper conductor pattern layer on the lower conductor pattern layer.

Method of manufacturing an electronic component including an inter-line insulating layer and a conductor pattern

A variable inductor includes two substantially meandering coils with trimming electrodes disposed therebetween on an insulating substrate. The trimming electrodes are located outside the region where the coils are provided. The two coils and the trimming electrodes are electrically connected. The trimming electrodes are exposed to a laser beam and thus, are trimmed one by one so as to vary the inductance.

Variable inductor and method

A small size electronic component has a small direct current resistance value of conductor pattern and minimal dimensional irregularity of a conductor pattern. In order to form such a component, a photosensitive conductive paste applied on a ceramic substrate and is then exposed through a photo mask and developed so as to form a lower conductor pattern layer of a coil conductor pattern. Then an insulating paste is applied on the ceramic substrate so as to cover the lower conductor pattern layer and the insulating paste is removed with a solvent until at least the upper surface of the lower conductor pattern layer is exposed so as to form an inter-line insulating layer. Furthermore, after applying a photosensitive conductive paste as a film, the exposure and development operation is conducted again while using the photo mask so as to form an upper conductor pattern layer on the lower conductor pattern layer.

Electronic component having a coil conductor with photosensitive conductive paste

Variable inductor

A method of manufacturing an electronic component provides a wide area which can be used for forming elements on the surface of a mother substrate and effectively produces an electronic component having excellent performance characteristics. At least a portion of the mother substrate is cut by using a blade having a shape in which a portion thereof butted against the boundary (shoulder) between the electrode arrangement surface and the cut end surface of the mother substrate or a portion which becomes the boundary (shoulder) is inclined at a predetermined angle to form an inclined surface at the boundary (shoulder) or the portion which becomes the boundary (shoulder) so as to expose a part of an electrode at the inclined surface.

Electronic component and method of manufacturing same

A variable inductor device has at least two coils. The at least two coils are disposed on an insulating substrate with an inductance adjusting element located therebetween. The inductance adjusting element is electrically connected at one end to a tap center electrode. The at least two coils are electrically connected to each other via the inductance adjusting element. The inductance adjusting element is grooved and horizontal paths of the inductance adjusting element are sequentially disconnected one by one by, for example, a laser beam. The inductances are thus varied. It is therefore possible to provide a variable inductor device in which the area required for mounting the device on a printed circuit board is decreased and the inductances are stably adjusted while keeping the inductances balanced.

Variable inductor device

A method of manufacturing an electronic component includes forming a slit in a connecting electrode located on the surface of a mother substrate such that the slit extends in a direction intersecting a cutting line, and cutting the mother substrate along the cutting line while cutting the connecting electrode having the slit. The connecting electrode is thereby reliably exposed on two opposing cut surfaces, and the reliability of external connection of the electronic component is improved.

Method of manufacturing electronic components

In an electronic component such as a multilayer ceramic capacitor having an external electrode which is formed on an outer surface of an element body provided with an internal electrode, an inner layer is formed by baking silver paste, for example, on only an end surface of the element body to be connected to the internal electrode, in order to provide a sufficient thickness to the external electrode for reducing dc resistance while avoiding a bad influence exerted by wet plating. An outer layer is formed by dry plating to cover the inner layer and an end portion of the element body. The outer layer is formed by a first layer of a nickel alloy, for example, and a second layer of silver, for example.

Growing community of inventors

Takefu, Japan

Kazuyoshi Uchiyama