Hitachi High-tech Instruments Company, Ltd.

Sanyo Electric Co., Ltd.

Kazuyoshi Oyama

Akihiro Kawai

Tsutomu Yanagida

Makio Kameda

Kazuyoshi Ieizumi

Akio Watanabe

Tetsuji Ono

Yoshinao Usui

Masami Iizuka

Hideaki Fukushima

Hisayoshi Kashitani

Koichi Izuhara

Katsuyuki Seto

Yoshiharu Fukushima

Yoshihiro Onoguchi

Hiroomi Kobayashi

Yutaka Mitsumochi

Akira Aoki

Masayuki Mohara

Isao Takahira

Takuya Imoto

Kazuhiro Nagao

Shigeru Kageyama

Shuji Nushiyama

Hiroshi Ikeda

Shigeru Kuribara

A component feeder capable of enhancing productivity is provided by that the component feeder includes a tape feeding device intermittently feeding a component housing tape constituted of a carrier tape having component housing parts formed with predetermined interval to contain respective electronic components, and a cover tape covering the component housing parts to prevent the components from jumping out from the component housing parts while the component housing tape wound on a housing tape reel is sequentially fed to a component extracting position, and an electronic component exposing device exposing the electronic components in the component housing parts to be allowed to be extracted, wherein the tape feeding device is constituted of a first feeding device and a second feeding device, and the electronic component exposing device is provided between the first feeding device and the second feeding device.

Component feeder

The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.

Electronic component mounting apparatus

There is a need for providing an electronic component mounting apparatus, a component supply apparatus, and an electronic component mounting method capable of reducing inadvertent insertion of component supply tape and ensuring high reliability or capable of reducing wrong insertion of component supply tape, supplying new electronic component tape, and ensuring a high operation rate. Supply tape is inserted into an insertion entry of a component supply apparatus. An electronic component mounted on the supply tape is absorbed and is mounted on a printed board. Information about the electronic component mounted on the supply tape is read. Based on the read information, the component supply apparatus for inserting the supply tape is selected. The insertion entry is opened while it is closed when no supply tape is mounted.

A method of mounting electronic components on a printed board includes providing a storage tape including a first portion and a second portion that are connected by a connection tape and containing electronic components stored therein, advancing the storage tape so that an electronic component is advanced to a component pickup position where electronic components are picked up by a suction nozzle, picking up the advanced electronic component at the component pickup position by the suction nozzle, and mounting the picked up electronic component on a printed board. The advancing of the storage tape, the picking up of the electronic component and the mounting of the electronic component are repeated, and the component pickup position is adjusted when the second portion of the storage tape is advanced to the component pickup position.

Electronic component mounting method

The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources. The component feeding device is provided on only one side of the carrying device, and the suction nozzles provided on each of the mounting heads pick up electronic components from the component feeding device and mount the electronic components on a printed board by moving the mounting heads provided on both the beams between the printed board on the carrying device and the component feeding device by driving the drive sources respectively.

The invention provides a component feeding device where heat generation of a drive circuit is minimized and a printed board mounted with this drive circuit is miniaturized by forming an inexpensive structure using a single microcomputer and by energizing each of the servomotors only when necessary. In a component feeding unit of a dual lane type, a CPU in a microcomputer controls a start of driving of one of servomotors by energizing the servomotor through a drive circuit based on a component feeding signal for one lane outputted from a CPU of an electronic component mounting apparatus, and the CPU in the microcomputer controls one of the servomotors so that the servomotor is not energized when a component feeding signal for another lane is inputted before a predetermine time passes after a delay timer starts timekeeping when receiving a detection signal about rotation of the servomotor by a predetermined amount from an encoder detecting a rotation amount of the servomotor.

Electronic component feeding device

The invention is directed to performing of an effective checking and aligning operation of component pick-up positions at component feeding units used for manufacturing by performing the operation sequentially at a time. A board recognition camera takes an image of a feeding position of a component feeding unit and the image is displayed being superimposed over a graphic image of a suction nozzle on a CRT. When an operator operates a trackball to move a cursor to an 'execute visual alignment' menu and clicks a left button there, the stored image (memory image) becomes movable freely in any direction according to a trackball operation. The stored image (memory image) is moved to match a cross line and an outline of a graphic suction nozzle (component pick-up position) for visual alignment with a component feeding position. Then, the operator clicks both right and left buttons of the trackball to store an alignment value of the position in a RAM.

An electronic component mounting apparatus is configured to adjust a positional relationship between two axes when an error occurs in the positional relationship between the axes when a beam is moved by two drive sources. According to movement of the beam for component picking and mounting operations, linear scale signals from linear scale reading heads are inputted to a Ydriver and a Ydriver, respectively. Each of the Ydriver and the Ydriver calculates a difference between positions of the drive axes of the beam and controls a moving member of a linear motor based on the difference so as to increase thrust of one drive axis when the one drive axis is in a more backward position than another drive axis and to reduce the thrust of one drive axis when the one drive axis in a more forward position than another drive axis.

When both first and second preferred nozzles are set up as valid, and both nozzles are stored in a nozzle stocker, the replacement with the recommended nozzle stored in the stocker is made and a CPU controls the operation based on control data. When both are set up as valid, but only the second preferred nozzle, not the first preferred nozzle, is stored in the stocker, the CPU 20 recognizes which nozzle is available by using nozzle positioning data stored in a RAM, and then the replacement with an alternative nozzle is made, and the CPU controls the operation according to the control data of the alternative nozzle.

Electric component mounting apparatus

There are provided a method and device for correcting a camera position, and a dummy component for use in camera position correction. A board-sensing camera for sensing a position of a circuit board is caused to take an image of a dummy component in an attitude-fixed state in a first coordinate system peculiar to a board-sensing camera. A component-sensing camera for sensing a position of an electronic component to be mounted on the circuit board is caused to take an image of the dummy component in an attitude-fixed state in a second coordinate system peculiar to a component-sensing camera. An amount of deviation of a center of the dummy component from a sensing center of the board-sensing camera and an amount of deviation of the center of the dummy component from a sensing center of the component-sensing camera are calculated from results of the taking of the image of the dummy component by the board-sensing camera and results of the taking of the image of the dummy component by the component-sensing camera. At least one of the first coordinate system and the second coordinate system is corrected based on the calculated amounts of deviation of the center of the dummy component.

Camera position-correcting method and system and dummy component for use in camera position correction

A pallet-storing block of an electronic component-mounting apparatus stores a plurality of pallets each carrying thereon a tray containing a large number of electronic components. A desired pallet selected from the pallets is moved along a transfer path, in a manner such that the desired pallet is advanced to be introduced into a pickup area which extends to cover almost all of the transfer path or withdrawn from the pickup area into the pallet-storing block. Desired electronic components are sequentially picked up from the desired pallet introduced into the pickup area and mounted on a circuit board. The desired pallet is moved to a desired position within the pickup area.

Electronic component-mounting apparatus and component-feeding device therefor

There are provided a component suction site-teaching system and method for an electronic component-mounting apparatus including a vacuum nozzle having a nozzle end face for picking up an electronic component thereat by vacuum. The vacuum nozzle is moved in directions of X axis and Y axis. An image of the electronic component set at a pickup position is taken. A graphical image of the nozzle end face of the vacuum nozzle is created from shape data of the vacuum nozzle. The image of the electronic component taken by the image taking means and the graphical image of the nozzle end face created by the image creating means, are displayed on a screen such that the graphical image of the nozzle end face is superimposed on the image of the electronic component. The image of the electronic component and the graphical image of the nozzle end face are moved relative to each other on the screen of the display means, thereby effecting alignment of the graphical image of the nozzle end face with an image of a predetermined site of the electronic component. A location of the predetermined site of the electronic component the image of which has been aligned with the graphical image of the nozzle end face by the image control means, is taught to nozzle moving means for moving the vacuum nozzle, as a location of a suction site of the electronic component to be sucked by the vacuum nozzle.

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Ashikaga, Japan

Kazuyoshi Oyama