Okuno Chemical Industries Co., Ltd.

Kazuyoshi Okuno

Eiichi Torikai

Shigemitsu Kawagishi

Kuniaki Otsuka

Noriko Hattori

Mitsuaki Tadakoshi

A process for electroless gold plating using plating solution comprizing cyanoaurate, alkaline cyanide, reducing agent, alkaline hydroxide, crystal condition controlling agent and stabilizer characterized in that an aldehyde or a ketone compound is added together with replenished gold salt, and hydrogen peroxide is also added, if necessary.

Process for electroless gold plating

An electroless palladium plating composition which comprises (1) 0.001-0.1 mol/l of a palladium compound, (2) 0.01-1 mol/l of a hypophosphite compound, (3) 0.01-5 mol/l of at least one member selected from the group consisting of ammonia and alkylamine compounds, (4) 0.01-20 mg/l of high-molecular weight polyethyleneimine having molecular weight of 300 to 100000 and (5) 0.01-10 g/l of an aliphatic alkyenylamine, and which is used at a pH in the range of 5-10.

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Ashiya, Japan

Kazuyoshi Okuno