Tokyo Electron Limited

Kazuyoshi Namba

Akira Yonemizu

Takanori Miyazaki

Akira Ishihara

In order to perform scrub cleaning of a substrate, two different scrub headsandare employed. The scrub headis superior to the scrub headin terms of a capability of removing contamination. The scrub headhas a low level of adhesion to the contamination as compared with the scrub head. The scrub headsandare moved such that the scrub headfollows the scrub head. Consequently, it is possible to clean the substrate without re-applying contamination, which has been once removed from a surface of the substrate, to the surface of the substrate again.

Substrate cleaning apparatus and substrate cleaning method

A processing apparatus is provided for cleaning a wafer W. In the apparatus, a carbonated solution in the form of mist is ejected onto the wafer W through a nozzle , so that the film of carbonated solution, i.e., a conductive liquid film is formed on the wafer W. Next, a pure water highly pressurized by a jet pump is ejected on the wafer W for cleaning it. The film of carbonated solution prevents devices built on the wafer W from being broken electrostatically. A liquid passage from a supply source of the carbonated solution up to the nozzle is made of material which does not dissolve its metallic components into the carbonated solution in spite of the contact of the liquid passage with the carbonated solution.

Processing apparatus and processing method

A drive unit,for driving a brush,is provided on a tip of a rotatable arm,The drive unit,includes a motor,for driving the processing member,having a brush,for rotation and an adjustment mechanism,for adjusting a force to urge the processing member,against a wafer W. With no intermediary of a flexible transmitting means, such as a belt, the processing member,is securely joined to the motor,through a shaft,and driven by the motor,directly. The adjustment mechanism,is constituted by an electromagnetic actuator which includes a stationary element,and a movable element,capable of elevating along the stationary element,The motor,is coupled to the armature,The adjustment mechanism,controls the position of the processing member,with respect to the upward and downward direction as well as the force to urge the processing member,against a wafer W.

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Fuchu, Japan

Kazuyoshi Namba