Hitachi, Ltd.

Kazuyoshi Mego

Eiichi Hara

Shigetoshi Hiratsuka

The lead wires extending from heating resistors to a driver IC for the heating resistors are arranged in the space under the driver IC. These lead wires are constructed in that they become narrower in wire width as approaching the driver IC so as to lie within the width of the driver IC, and the lead wires positioned under the driver IC are constructed in that they become broader in wire width as approaching the connecting terminals of the driver IC. Connection of the lead wires and the driver IC is carried out by the face-down bonding using Controlled Collapse Bonding. By providing the construction as mentioned above, a thermal print head of higher density and definition can be obtained.

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Yokohama, Japan

Kazuyoshi Mego