Kabushiki Kaisha Toyota Jidoshokki

Kabushiki Toyota Jidoshokki

Kazuyoshi Kontani

Toshiaki Nagase

Jun Ishikawa

Hiroyuki Onishi

Naohito Kanie

Toshinari Fukatsu

Naoki Higashikawa

Hiroyuki Kobayashi

Takashi Nagashima

Naoto Kato

Koichi Akagawa

Naotaka Matsumoto

Atsushi Dojiri

Takuya Higashi

Toshiaki Fukatsu

Kenichiro Ito

Takahiro Nakamura

An inverter includes a power substrate mounting power element groups arranged apart from each other, each power element group constituted by power elements arranged, a control substrate disposed apart from the power substrate in a plate thickness direction of the power substrate and mounting an electronic component for controlling the power elements, a capacitor substrate disposed between the power substrate and the control substrate and mounting capacitors, a release member fixed to the power substrate, and a spacer electrically connecting the power substrate and the capacitor substrate. The spacer includes a body portion disposed between two adjacent power element groups of the power element groups and a heat transfer portion disposed outside the power element groups in a direction in which the power elements are arranged and provided at a position not overlapping with the capacitors as viewed in a plate thickness direction of the capacitor substrate.

Inverter

An inverter unit includes a first temperature detector that detects a first temperature of at least one of semiconductor elements and a periphery of the semiconductor elements, current detectors that detect a current of a motor, and a controller that switches a modulation mode of the motor to a two-phase modulation mode or a three-phase modulation mode on the basis of a detection result of the first temperature by the first temperature detector and detection results of the current by the current detectors.

Inverter unit

A connecting terminal includes an external terminal connecting portion, having an end surface to connect an external terminal thereto and located at a second principal surface side of a second circuit board faces, and a substrate-fixed portion which is securely connected to a first circuit board. A seal attachment portion is provided on a portion of the external terminal connecting portion including the end surface to attach thereto a seal member to seal a gap between the portion and the case. The connecting terminal includes a reduced sectional area portion having a sectional area smaller than an area of the top end surface in a region close to a plurality of electronic components arranged on the second circuit board on the external terminal connecting portion. The reduced sectional area portion is provided from the seal attachment portion to an end in the opposite side of the end surface.

Semiconductor device having a first circuit board mounted with a plurality of semiconductor elements and a second circuit board mounted with a plurality of electronic components

A plurality of arm elements is arrayed along a first direction of a substrate. Each arm element includes a plurality of semiconductor elements connected in parallel. Each arm element is configured such that a plurality of semiconductor elements is arrayed along a second direction of the substrate which is perpendicular to the first direction and separated into a first element group and a second element group. The substrate includes a first region where the semiconductor element included in the first element group is arranged and a second region where the semiconductor element included in the second element group is arranged, and the first region and the second region are separated along the second direction. An input electrode unit and an output electrode unit are arranged along the first direction in a region provided between the first region and the second region on the substrate.

Semiconductor device having a substrate and input and output electrode units

An electronic device includes a support that is coupled to a coupled subject and includes a support portion, a substrate supported by the support portion, a current sensor including a signal terminal, wherein the current sensor is connected to the substrate in a manner allowing for a signal to be sent to the substrate through the signal terminal, and a fastener fastening the current sensor to the support portion and the substrate. The current sensor is suspended from the substrate. The support portion is arranged between the substrate and the current sensor.

Electronic device

A substrate spacing member includes a spacer portion which is disposed between the two substrates in contact with both edge portions thereof to keep a distance between the two substrates constant, spacer member holding portions which hold the spacer members, a frame body portion that connects the spacer member holding portions to each other, a branch portion which extends toward a predetermined position between the two substrates from the frame body portion or the spacer member holding portions, and electrode holding portions which are provided at the branch portions, and hold electrodes at the predetermined positions.

Substrate spacing member and inverter device

An inverter unit includes a first circuit board and a second circuit board arranged at a predetermined space so as to face each other. Each of the first circuit board and the second circuit board has a main circuit forming area. A plurality of power devices are mounted in the main circuit forming area of the first circuit board and form a main circuit. A plurality of capacitors are electrically connected to the plurality of the power devices and mounted in the main circuit forming area of the second circuit board. A control circuit controls the operation of the main circuit. The second circuit board includes a control circuit forming area separated from the main circuit forming area. The control circuit includes a first control circuit formed in the control circuit forming area of the second circuit board.

A semiconductor unit includes a semiconductor chip, a ceramic substrate having a circuit pattern on which the semiconductor chip is mounted, and a temperature sensor for detecting a temperature. The semiconductor unit further includes a pressing member for retaining the temperature sensor by pressing against the ceramic substrate.

Semiconductor unit

An electronic unit includes a first circuit board having a power semiconductor device and an electrolytic capacitor and a second circuit board having an electronic component to control the power semiconductor device. The second circuit board is arranged perpendicular to the first circuit board and along the surface of the electrolytic capacitor. The electronic unit further includes a connecting member being jointed at one end thereof to the first circuit board and jointed at the other end thereof to the second circuit board for electrical connection between the first and second circuit boards.

Electronic unit

A power converter includes a base plate having thereon a switching device, and positive and negative conductors respectively including main portions disposed parallel to the base plate. One of the main portions is placed over the other of the main portions. The main portions are disposed adjacent to and parallel to each other. The main portions are insulated from each other. The power converter includes a capacitor having positive and negative terminals electrically connected to the respective main portions of the positive and negative conductors. Each of the positive and negative conductors includes a side portion extending from the main portion toward the base plate, and a terminal portion extending from the side portion and joined to the base plate. The side portion is formed with a cutout extending from the end adjacent to the base plate to the opposite end connected to the main portion.

Power converter

A power converter apparatus that includes a substrate, plate-like positive and negative interconnection members, capacitors, and a cover is disclosed. Pairs of groups of switching elements are mounted on the substrate. The cover is arranged over the substrate to encompass the switching elements, the positive interconnection member, the negative interconnection member, and the capacitor. The positive interconnection member and the negative interconnection member each have a terminal portion that is joined to a circuit pattern on the substrate by ultrasonic bonding.

Power converter apparatus

A power converter apparatus that includes a substrate, plate-like positive and negative interconnection members, and capacitors is disclosed. Pairs of groups of switching elements are mounted on the substrate. Each of the positive interconnection member and the negative interconnection member has a terminal portion. The terminal portion has a joint portion that is electrically joined to a circuit pattern on the substrate. The switching elements are arranged in the same number on both sides of the joint portion of at least the positive interconnection member of the positive and negative interconnection members.

A power converter apparatus includes a substrateon which switching elements Q, Qto Qare mounted, positive and negative terminal interconnection membersmounted on the substrate, and a capacitorhaving a positive terminalconnected to the main body of the positive terminal interconnection memberand a negative terminalconnected to the main body of the negative terminal interconnection member. The interconnection members each have a plate-like main bodythat is located above and parallel to the substrate. The main bodies of the interconnection members are stacked to be close to each other while being electrically insulated from each other. Each of the positive terminal interconnection member and the negative terminal interconnection member further includes a plate-like extensionthat extends from the corresponding main body toward the substrate, and a terminal portionthat extends from the extension and is joined to the substrate. The extensions extend to positions closest to the substrate, while being parallel to and close to each other.

A structure for mounting a heat-generating component includes a circuit board on which a heat-generating component is mounted, a base on which the circuit board is disposed upright, a cover having thermal conductivity, a heat-conductive member electrically isolated from the heat-generating component and a heat transfer plate. The heat transfer plate is attached to the circuit board so as to extend in the sliding direction of the cover to cover a surface of the heat-conductive member. The cover presses the heat transfer plate by an inner surface thereof against the heat-conductive member in a direction perpendicular to the heat-conductive member so that the heat-generating component is thermally connected to the inner surface of the cover through the heat-conductive member and the heat transfer plate.

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Kariya, Japan

Kazuyoshi Kontani