Ngk Insulators, Inc.

Kazuyoshi Inoue

Makoto Miyahara

Takahiro Ishikawa

Masayuki Shinkai

Shuhei Ishikawa

Nobuaki Nakayama

Takao Adachi

A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600&#xb0; and 900&#xb0; C. for 10 minutes.

Heat spreader module

A flexible printed wiring board is provided, including a flexible electrically insulating polyimide substrate, first and second electrically conductive patterns each including conductive strips arranged in parallel with each other on opposed major surfaces, respectively, of the electrically insulating substrate, and first and second flexible electrically insulating polyimide covers cemented to the respective major surfaces of the electrically insulating substrate by first and second electrically insulating adhesive layers by thermocompression bonding such that the first and second conductive patterns are covered with the first and second flexible electrically insulating covers, respectively. The first and second conductive patterns are arranged symmetrically with respect to a geometrical center line or neutral stress line when viewed in the thickness direction of the flexible printed wiring board, or are arranged asymmetrically such that the conductive patterns are deviated toward an inner side of the flexible printed wiring board in a bent condition.

Flexible printed wiring board

Growing community of inventors

Nagoya, Japan

Kazuyoshi Inoue