Hitachi High-tech Instruments Company, Ltd.

Sanyo Electric Co., Ltd.

Kazuyoshi Ieizumi

Kazuyoshi Oyama

Akira Aoki

Akihiro Kawai

Akio Watanabe

Makio Kameda

Hisayoshi Kashitani

Tetsuji Ono

Hideaki Fukushima

Yoshiharu Fukushima

Seiji Oonishi

Koiti Izuhara

Shigeru Kuribara

The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.

Electronic component mounting apparatus

An electronic component is mounted on a printed board by a first head and a second head collaboratively. The first head is prioritized to the second head for moving operations. The range which allows the second head to move is defined in consideration with all the positions where the electronic components held by the first head are to be mounted on the printed board such that no collision occurs between the first head in operation and the second head.

Mounting apparatus for electronic components

In a mounting apparatus for electronic components, a command from a host computer is transmitted to a linear motor M via a motion controller and a servo amplifier to thereby drive a mounting head Hor a mounting head H. To prevent collision between the two mounting heads H, H, position information from a linear encoder E is fed back to not only the servo amplifier, but also the motion controller. Once determining that the two mounting heads H, Hcollide, the motion controller applies brake to the mounting heads H, Hto avoid collision therebetween, regardless of the command from the host computer.

There are provided a component suction site-teaching system and method for an electronic component-mounting apparatus including a vacuum nozzle having a nozzle end face for picking up an electronic component thereat by vacuum. The vacuum nozzle is moved in directions of X axis and Y axis. An image of the electronic component set at a pickup position is taken. A graphical image of the nozzle end face of the vacuum nozzle is created from shape data of the vacuum nozzle. The image of the electronic component taken by the image taking means and the graphical image of the nozzle end face created by the image creating means, are displayed on a screen such that the graphical image of the nozzle end face is superimposed on the image of the electronic component. The image of the electronic component and the graphical image of the nozzle end face are moved relative to each other on the screen of the display means, thereby effecting alignment of the graphical image of the nozzle end face with an image of a predetermined site of the electronic component. A location of the predetermined site of the electronic component the image of which has been aligned with the graphical image of the nozzle end face by the image control means, is taught to nozzle moving means for moving the vacuum nozzle, as a location of a suction site of the electronic component to be sucked by the vacuum nozzle.

Component suction site-teaching system and method

Growing community of inventors

Ota, Japan

Kazuyoshi Ieizumi