Promerus, Lcc

Sumitomo Bakelite Company Limited

Merck Patent Gmbh

Kazuyoshi Fujita

Larry Funderburk Rhodes

Steven J Smith

Edmund Elce

Pramod Kandanarachchi

Andrew Bell

Hendra Ng

Pawel Miskiewicz

Toby Cull

Brian F Knapp

Keitaro Seto

Miguel Carrasco-Orozco

Cheryl Burns

Piotr Wierzchowiec

David Christoph Müller

Atsushi Izumi

Hiromichi Sugiyama

David Christoph Mueller

Makoto Horii

Hiromi Oki

Yukiharu Ono

Yohko Sano

Takashi Enoki

Takahiro Harada

Hugh A Burgoon

Yumiko Yamanoi

Sumitoshi Asakuma

Mihoko Matsutani

Mari Ueda

Nanae Kawate

Steven Smith

Ng Hendra

The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are capable of controlling the adhesiveness by radiation.

Photosensitive compositions and applications thereof

Embodiments in accordance with the present invention provide for the use of polycycloolefins in electronic devices and more specifically to the use of such polycycloolefins as gate insulator layers used in the fabrication of electronic devices, the electronic devices that encompass such polycycloolefin gate insulator and processes for preparing such polycycloolefin gate insulator layers and electronic devices encompassing such layers.

Gate insulator layer for organic electronic devices

Embodiments in accordance with the present invention provide for the use of polycycloolefins in electronic devices and more specifically to the use of such polycycloolefins as interlayers applied to fluoropolymer layers used in the fabrication of electronic devices, the electronic devices that encompass such polycycloolefin interlayers and processes for preparing such polycycloolefin interlayers and electronic devices.

Interlayer for electronic devices

The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are resistant to thermo-oxidative chain degradation.

Embodiments in accordance with the present invention encompass water soluble polycyclic vinyl addition polymers having a norbornene type repeat unit derived from a norbornene type of monomer that encompasses a saccharide functional moiety. Embodiments in accordance with the present invention also encompass low and high molecular weight polymers with low catalyst loading.

Water soluble norbornene-type polymers and photoimageable compositions thereof

This invention discloses and claims a series of polycyclic monomers and polymers useful in the production of optical waveguides. The polymers of the invention comprise one or more repeating units represented by the formula (IV): Wherein m, X, Rand Rare as defined herein. The films formed from the polymers of this invention exhibit significant changes in refractive index (greater than or equal to 0.5%) after exposure to suitable actinic or thermal energy thereby having superior optical transmission performance, which is of importance for modern optical applications such as wave guiding and optical data storage.

Norbornene-type formate monomers and polymers and optical waveguides formed therefrom

Embodiments in accordance with the present invention provide for non-self imageable norbornene-type polymers useful for immersion lithographic processes, methods of making such polymers, compositions employing such polymers and immersion lithographic processes that make use of such compositions. More specifically the embodiments of the present invention are related to norbornene-type polymers useful for forming top-coat layers for overlying photoresist layers in immersion lithographic process and the process thereof.

Norbornene-type polymers, compositions thereof and lithographic process using such compositions

A polymer and composition useful in forming an insulating film provided with a low permittivity, a high heat resistance, and a high mechanical strength and an insulating film obtained from these and an electronic device having the same are provided. The polymer for forming an insulating film according to the present invention is characterized by being obtained by polymerizing a reactive compound represented by Formula (1). The insulating film according to the present invention is formed using a composition for forming an insulating film including that polymer, has molecular spaces having an average space size of 0.7 nm to 5 nm, and has a permittivity of 2.3 or less. The electronic device according to the present invention has the insulating film. (wherein R, R, and Rare the same or different from each other and respectively represent an organic group having a ring structure; X and Y are the same or different from each other and respectively represent an aromatic organic group having a reactive group; and n represents 0 or 1).

Polymer for forming insulating film, composition for forming insulating film, insulating film, and electronic device having same

An organic insulating material includes a prepolymer of a cage structure compound having a polymerizable unsaturated bond-containing group and a cage structure with an adamantane structure as the minimal unit. The prepolymer has a number-average molecular weight of between 2,000 and 500,000 based on polystyrene and measured by gel permeation chromatography. The prepolymer includes unsaturated bonds produced by reaction between the polymerizable unsaturated bonds and the unreacted polymerizable unsaturated bonds. The prepolymer has a residue rate of unreacted polymerizable unsaturated bonds of between 20% and 80%.

Organic insulating material, varnish for resin film using the same, resin film and semiconductor device

Disclosed is a resin composition comprising a benzoxazole resin precursor having a first repeating unit obtained by reacting a bisaminophenol compound and a dicarboxylic acid compound, and a cross-linking agent wherein at least one of the bisaminophenol compound and the dicarboxylic acid compound has a diamondoid structure. The benzoxazole resin precursor further comprises a second repeating unit obtained by reacting a bisaminophenol compound not having a diamondoid structure and a dicarboxylic acid compound not having a diamondoid structure. Also disclosed is a resin film comprising the resin composition.

Resin composition, varnish, resin film and semiconductor device

A resin composition is provided comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), Ris a single bond or has a structure represented by formula (2); Rto Rare respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and 'X' is any of &#x2014;O&#x2014;, &#x2014;NHCO&#x2014;, &#x2014;CONH&#x2014;, &#x2014;COO&#x2014; and &#x2014;OCO&#x2014;; further, wherein in formula (2), 'Ar' is an aromatic group; &#x201c;Y&#x201d; is any of a single bond, &#x2014;O&#x2014;, &#x2014;S&#x2014;, &#x2014;OCO&#x2014; and &#x2014;COO&#x2014;; &#x201c;q&#x201d; is an integer of 1 or more; Ris hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when &#x201c;q&#x201d; is an integer of 2 or more; at least one of Rto Ris the group having an alicyclic structure when Ris a single bond; at least one of Rto Ris the group having an alicyclic structure when Rhas the structure represented by formula (2); and &#x201c;*&#x201d; and &#x201c;**&#x201d; represent a position to be bonded to a different chemical structure.

Resin composition, varnish, resin film and semiconductor device using the same

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Tokyo, Japan

Kazuyoshi Fujita