Tokyo Electron Limited

Kazuyoshi Eshima

Michitaka Amiya

Takayuki Toshima

Hiroshi Tanaka

Issei Ueda

Naoki Shindo

Hideaki Sato

Koji Tanaka

Osamu Kuroda

Takami Satoh

Satoshi Morita

Junya Minamida

Kotaro Tsurusaki

Hiroshi Komiya

Kazuki Kosai

Hiromi Hara

Masahiro Yoshida

Tsukasa Watanabe

Yasuhiro Chouno

Hisakazu Nakayama

Hirozumi Hoshino

Keisuke Sasaki

Toshihiko Nishida

Akihiro Nakamura

A flow-rate regulator device for controlling a flow rate of a liquid includes a first flow-rate regulator component positioned on an upstream side of a liquid line, and a second flow-rate regulator component positioned on a downstream side of the liquid line and connected in series to the first flow-rate regulator component. The first flow-rate regulator component adjusts a degree of opening such that a flow rate of liquid flowing through the liquid line is set a specified number of times greater than a target flow rate when the second flow-rate regulator component has a full opening, and the second flow-rate regulator component adjusts a degree of opening such that the flow rate of the liquid flowing through the liquid line is to be at the target flow rate when the first flow-rate regulator component is adjusted to have the degree of opening.

Flow-rate regulator device, diluted chemical-liquid supply device, liquid processing apparatus and its operating system

A liquid processing apparatusincludes a pure water supply source; a pure water flow rate control opening/closing valve; a sulfuric acid supply unit; a sulfuric acid supply opening/closing valve; mixing tanksandconfigured to mix pure water and sulfuric acid to produce a mixed chemical liquid and connected to a circulation linehaving a circulation pump; a liquid processing unitconfigured to perform a liquid process on a substrate W with the mixed chemical liquid. A controllercontrols a pure water supply opening/closing valve, the sulfuric acid supply opening/closing valve, and the circulation pump, such that operation of the circulation pumpis started after starting supply of the pure water to the mixing tanksand, and then, supply of sulfuric acid to the mixing tanksandis started.

Liquid processing apparatus, liquid processing method, and storage medium that stores computer program for implementing liquid processing method

Provided is a substrate processing apparatus wherein, even if a trouble occurs, it is bound to continue a process for the substrate without stopping the substrate processing apparatus entirely. The substrate processing apparatus according to the present disclosure includes first and second substrate conveying devices configured to convey wafers, and first and second processing blocks provided on the right and left sides of the substrate conveying device and having processing unit arrays each configured to perform the same process. Processing unit arrays on one side and processing unit arrays on the other side are respectively connected to a processing liquid supply system commonly provided with them. And, when any one of substrate conveying devices, processing liquid supply systems has a problem, the process for the wafer can be performed in the processing unit array to which the substrate conveying device and the processing liquid supply system under normal operation belong.

Substrate processing apparatus

Disclosed is a cleaning apparatus capable of cleaning a holding unit of a holding member that holds a substrate. The cleaning apparatus is configured to prevent a cleaning liquid from adhering to a rear-end unit of the holding member where a drying is difficult to be done, while a cleaning process is performed by spraying the cleaning liquid to the holding unit. Also disclosed are a substrate processing system that incorporates the cleaning apparatus, a cleaning method based on the cleaning apparatus, a program to perform the cleaning method, and a storage medium to store the program. The cleaning apparatus is equipped with a cleaning unit that cleans the holding unit by spraying the cleaning liquid to the holding unit, and a cover unit that covers the rear-end unit by making a back-and-forth operation with respect to the holding member.

Cleaning apparatus, substrate processing system, cleaning method, program and storage medium

An ultrasonic cleaning apparatus according to the present invention comprises a plurality of cleaning tanks configured to store a cleaning liquid, an object-to-be-processed holder capable of being inserted into each cleaning tank, the object-to-be-processed holder being configured to hold an object to be processed and to immerse the object to be processed into the cleaning liquid, a vibrator disposed on each cleaning tank, a single ultrasonic oscillator configured to make each vibrator ultrasonically vibrate, an output switch interposed between the ultrasonic oscillator and the vibrator of each respective cleaning tank, the output switch being configured to switch the vibrator that is connected to the ultrasonic oscillator, and a control device configured to control the ultrasonic oscillator and the output switch, wherein the control device controls the ultrasonic oscillator and the output switch such that a timing at which the vibrator of one of the cleaning tanks is made to ultrasonically vibrate, and a timing at which the vibrator of another cleaning tank is made to ultrasonically vibrate are not overlapped with each other.

Ultrasonic cleaning apparatus, ultrasonic cleaning method, and storage medium storing computer program for executing ultrasonic cleaning method

Disclosed are a liquid heating unit capable of monitoring the temperature of the liquid storage tank or pipe in which liquid is heated by transmission of the radiated light, a liquid processing apparatus including the same, and a liquid processing method. The liquid heating unit includes: a lamp heater radiating light; a cylindrical member made of material transmitting the radiated light and having a cylindrical shape in which the lamp heater is able to be inserted and penetrated into an internal space thereof; a liquid pipe placed along an outer periphery of the cylindrical member and configured to heat liquid flowing therein using the radiated light; a reflection plate that covers the liquid pipe from the outside and reflects the radiated light; and a first temperature sensor attached to an outer surface of the reflection plate.

Liquid heating unit, liquid processing apparatus including the same, and liquid processing method

A plurality of process liquid supply nozzlesare arranged at different levels on right and left sides of a semiconductor wafer W in a process bath. A discharge port of each of the nozzlesis directed toward the semiconductor wafer W. In accordance with a predetermined procedure, a process liquid is discharged from one or more nozzlesselected from the plurality of nozzles. In order to perform a chemical liquid treatment, a chemical liquid is discharged from the lowermost nozzle, for example, and thereafter, the nozzleson the upper levels sequentially discharge the chemical liquid. In order to perform a rinse liquid treatment by replacing the chemical liquid in the process bathwith a rinse liquid, the rinse liquid is discharged from the lowermost nozzleat first, for example. Thereafter, the rinse liquid is discharged from all the nozzles. In this manner, efficiency and uniformity in the liquid treatment can be improved.

Liquid treatment method and storage system

An apparatus and method of replacing a liquid of a circulation line in a substrate liquid processing apparatus of a single-wafer type, which can replace the liquid more efficiently, by relating the replacing method with a process-liquid replenishing method. A substrate liquid processing apparatus of a single-wafer type includes: a circulation line through which a process liquid is circulated; a tank disposed in the circulation line; a liquid level sensor disposed in the tank; a liquid replenish part configured to replenish the tank with a new process liquid, based on an output of the liquid level sensor; and a liquid-replacement control part configured to stop the operation of the liquid replenish part based on a predetermined replenish stop condition that is set cooperatively with a predetermined liquid disposal condition, and to discard all the process liquid in the tank based on the predetermined liquid disposal condition.

Method of replacing liquid of circulation line in substrate liquid processing apparatus of single-wafer type

Provided is a liquid processing apparatus for a substrate, including a plurality of substrate processing units configured to process the substrate using a processing liquid, a processing liquid generating unit configured to dissolve a gas into a solvent to generate the processing liquid with a predetermined concentration where the processing liquid being supplied to one of the plurality of substrate processing units or being supplied to two or more of the plurality of substrate processing units simultaneously, and a control unit configured to control the plurality of substrate processing units. Also provided are a method for generating the processing liquid and a recording medium storing a program for generating the processing liquid. The liquid processing apparatus generates a processing liquid having a predetermined concentration regardless of the flow rate of the processing liquid used simultaneously.

Liquid processing apparatus for substrate, method for generating processing liquid, and computer readable recording medium storing program for generating processing liquid therein

A process liquid supply system includes a pure water supply source connected to a process vessel through a supply pipe; a chemical liquid tank that stores a chemical liquid and supplies the chemical liquid stored therein to the supply pipe; and a compressed gas supply source connected to the chemical liquid tank through a compressed gas supply pipe. A pressure adjusting part is disposed on the compressed gas supply pipe at a position between the compressed gas supply source and the chemical liquid tank. The pressure adjusting part is controlled so that the pressure of the compressed gas supplied from the compressed gas supply source to the chemical liquid tank is gradually or stepwise increased after the supply of the chemical liquid from the chemical liquid tank to the supply pipe is started so that the concentration of the processing liquid remains at desired level.

Process liquid supply system, process liquid supply method, and storage medium

The present invention provides a substrate cleaning method capable of reducing non-uniformity of a removal efficiency of particles between lots with a simple procedure. The substrate cleaning method comprises: a step of supplying a gas into a cleaning tank, while an irradiation of ultrasonic waves to the cleaning liquid in the cleaning tank is being stopped, so as to increase a dissolved gas concentration of the gas dissolved in the cleaning liquid in the cleaning tank to a saturated concentration; and a step of irradiating ultrasonic waves to the cleaning liquid in the cleaning tank so as to clean a substrate immersed in the cleaning liquid in the cleaning tank. In the step of increasing the dissolved gas concentration to the saturated concentration, the gas is supplied to the cleaning tank so as to increase the dissolved gas concentration of the cleaning liquid in the cleaning tank to the saturated concentration. In addition, in the step of increasing the dissolved gas concentration to the saturated concentration, the irradiation of the ultrasonic waves to the cleaning liquid in the cleaning tank is stopped.

Substrate cleaning method and substrate cleaning apparatus

A cleaning apparatus includes a cleaning tank () which stores a process liquid used for cleaning a target object (W), a target object holding mechanism () which holds the target object (W) in the cleaning tank (), and a process liquid supply mechanism () which supplies the process liquid to the cleaning tank (). The target object (W) is immersed in the process liquid in the cleaning tank (), and is cleaned while letting the process liquid overflow from the cleaning tank (), thereby cleaning the target object (W). The cleaning apparatus further includes a cover () which covers a liquid surface in the cleaning tank (), a support member () which supports the cover (), and a follow-up mechanism () which moves the cover () such that the cover () follows the liquid surface while the cover () is supported by the support member ().

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Koshi, Japan

Kazuyoshi Eshima