Mitsubishi Electric Corporation

Kazuyasu Sakamoto

Masaki Kato

Masahiko Fujita

Takuya Oga

Dai Nakajima

Yuji Shirakata

Daisuke Nakashima

Tsuyoshi Sugihara

Tsuyoshi Jida

Gen Tada

The rotary electric machine main body includes: a stator; a rotor that includes a rotating shaft and that is rotatable relative to the stator; and a supporting body that supports the stator and the rotor. The controlling apparatus includes a power circuit portion that is disposed around the rotating shaft, and that converts electric power that is received from the rotary electric machine main body or electric power that is supplied to the rotary electric machine main body between alternating current and direct current. The power circuit portion includes: a power module; and an electric power interconnecting part that includes a conductor that is connected to a terminal of the power module. The electric power interconnecting part is disposed so as to avoid overlapping with a region of the power module when the power circuit portion is viewed in an axial direction of the rotating shaft.

Rotary electric machine having non-overlapping power interconnecting part

A semiconductor device is provided, in which a first lead () is joined with the bottom electrode () of a MOS-FET () with first solder (), the top electrode () of the MOS-FET is joined with an internal lead () with second solder (), the internal lead is joined with a projection () of a second lead with third solder (), and the first lead, second lead, MOS-FET and internal lead are integrally molded using sealing resin (), wherein the first solder and second solder include support members () and (), respectively, located thereinside and positions of the internal lead and MOS-FET are stabilized by self-alignment.

Semiconductor device

The invention is to provide a semiconductor apparatus configured to position a semiconductor device reliably and easily without having a protruding portion formed in the bottom surface of the semiconductor device in the semiconductor apparatus. A semiconductor apparatus is fabricated by attaching a semiconductor device of a surface mount package type and a wiring member to a heat sink. A fitting portion in which the semiconductor device is fit is provided to the wiring member, so that the semiconductor device is positioned by fitting the semiconductor device into the fitting portion provided to the wiring member. According to the semiconductor apparatus of the invention, it becomes possible to position the semiconductor device at a high degree of accuracy.

Semicondutor device package placed within fitting portion of wiring member and attached to heat sink

A dynamoelectric machine main body, power circuit modules and a field circuit module, and a control apparatus that has a heatsink that is prepared by die casting, and that is mounted integrally onto the dynamoelectric machine main body are included, the heatsink including a plurality of convex heat receiving portions that are disposed so as to project from a front surface of a base plate, and that have heat receiving surfaces, the power circuit modules and the field circuit module including seal main body portions that are constituted by an electrically insulating resin that seal switching elements so as to expose bottom surfaces of element heat radiating portions on reference surfaces that have a surface shape that corresponds to a shape of the heat receiving surfaces, and electrical insulation supporting layers being interposed between the bottom surfaces of the heat receiving surfaces and the element heat radiating portions.

Growing community of inventors

Chiyoda-ku, Japan

Kazuyasu Sakamoto