Lapis Semiconductor Co., Ltd.

Mitsui Engineering and Shipbuilding Company Limited

Kazuya Yamada

Yuichi Yoshida

Kengo Takemasa

Akihiro Takei

Toshihisa Sone

Yasuaki Harada

Gentaro Takasuka

Mazumi Itaya

Hiroshi Kamei

Hiroshi Otake

Yoshimichi Hanai

Tatuo Kato

A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.

Semiconductor device and measurement device

Semiconductor device having an oscillator and an associated integrated circuit

A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.

A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.

Semiconductor device, measurement device, and correction method

Semiconductor device with oscillation frequency error correction

Correcting temperature based oscillation frequency errors in semiconductor device

Semiconductor device and measurement device having an oscillator

A semiconductor device includes a lead frame, an oscillator, an integrated circuit and first bonding wires. The oscillator includes plural terminals separated from each other by a predetermined distance, and that is mounted to an oscillator mounting region formed on a first face of the lead frame. The oscillator mounting region has a narrower width than the distance between the plural terminals. The integrated circuit is mounted to a second face of the lead frame, which is on an opposite side to the first face. The first bonding wires connect the plural terminals of the oscillator to terminals of the integrated circuit.

Incineration flyash is treated by reducing the organic chlorine compounds contained in the flyash. A cylindrical body equipped with a rotating shaft having a screw conveyor and agitating blades for conveying and agitating the flyash is filled to at least a 75 vol % charge so that contact of the flyash with oxygen is made as small as possible. The flyash is subjected to agitation and heat-treatment at 300.degree. C. or higher. The cylindrical body has a feeding port for the waste incineration flyash and a discharging port for the discharge of the treated flyash. The screw conveyor is at the introducing part and has a pitch that is successively reduced toward the agitating part for charging the flyash in the agitating part at a greater vol. % than that which occurs in the introducing part.

Apparatus and process for treating waste incineration flyash

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Yokohama, Japan

Kazuya Yamada