Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Kazuya Usirokawa

Daisuke Sakurai

Hidenobu Wakita

Norihiko Kawabata

Kiyomi Hagihara

Shinji Yoshino

Provided is an electromechanical hydrogen pump, including: (i) an electrolyte membrane; (ii) an anode electrode layer and an anode diffusion layer that are provided at one side of the electrolyte membrane; (iii) a cathode electrode layer and a cathode diffusion layer that are provided at the other side of the electrolyte membrane; (iv) an anode seal that has openings each surrounding the anode diffusion layer; (v) a cathode seal that has openings each surrounding the cathode diffusion layer; (vi) an anode separator that is placed on an outer side of the anode diffusion layer; and (vii) a cathode separator that is placed on an outer side of the cathode diffusion layer, wherein no spaces are provided between the anode diffusion layer and the anode seal or between the cathode diffusion layer and the cathode seal.

Electrochemical hydrogen pump

In a provided mounting structure, an electronic component such as a semiconductor chip having a fragile film is mounted on a substrate such as a circuit board with higher connection reliability. A junction that connects an electrode terminal () of an electronic component () and an electrode terminal () of a substrate () contains an alloy () and a metal () having a lower modulus of elasticity than the alloy (). The junction has a cross section structure in which the alloy () is surrounded by the metal () having the lower modulus of elasticity.

Mounting structure and manufacturing method for same

A plurality of protruding electrodes of a semiconductor chip are in contact with a plurality of electrodes formed on a semiconductor substrate, via a plurality of solder sections. In this state, the solder sections are melted so as to form a plurality of solder bonding sections joined to the protruding electrodes of the semiconductor chip and the electrodes of the semiconductor substrate. Moreover, a distance between a part of the semiconductor chip and the semiconductor substrate is larger than a distance between the other part of the semiconductor chip and the semiconductor substrate, extending at least some of the solder bonding sections. Thus, the solder bonding sections vary in height. Holes are then formed at least in a solder bonding section having a maximum height out of the solder bonding sections. After that, the solder bonding sections are solidified.

Semiconductor device manufacturing method and semiconductor device

An electronic-component mounted body of the present invention includes an electronic component mounted on a circuit board. The electronic component includes multiple component-side electrode terminals, and the circuit board includes multiple circuit-board side electrode terminals for the component-side electrode terminals. The electronic-component mounted body further includes: multiple protruded electrodes formed respectively on the component-side electrode terminals of the electronic component to electrically connect the electronic component and the circuit board; and a dummy electrode formed on the electronic component and electrically connected to the component-side electrode terminal in a predetermined position out of the component-side electrode terminals. The protruded electrode on the component-side electrode terminal in the predetermined position is higher than the protruded electrode on the component-side electrode terminal in a different position from the predetermined position.

Growing community of inventors

Osaka, Japan

Kazuya Usirokawa