Denso Corporation

Kazuya Takeuchi

Ryota Tanabe

Tetsuya Matsuoka

Yuu Yamahira

Hiromi Ichijo

Hiromi Ichijyo

Masayoshi Nishihata

Naoki Hirasawa

Tatsuya Murakami

Koji Asagara

Toshiyuki Kouno

Xiaolin Guo

Masanori Sakata

Yuuya Hashimoto

Yuuichi Handa

Mamoru Kuwahara

Makoto Okamura

Bahman Hossini Soltani

Tomohiro Shimazu

Yuta Hashimoto

Taijiro Momose

Shingo Oono

Yuuta Hashimoto

Hiroki Matsuzawa

Kenji Shibata

Yoshihito Takahashi

Kenichi Hasegawa

Akihiro Ohi

Takuya Oizumi

A power converter includes semiconductor modules, a capacitor, a circuit board, a casing, a busbar and a shield layer. The capacitor is electrically connected to the semiconductor modules. The casing accommodates the circuit board, the semiconductor modules and the capacitor. The busbar has an input terminal portion, an output terminal portion and an electric pathway connecting the input terminal portion and the output terminal portion. The electric pathway is connected to at least one of electronic components including the semiconductor modules and the capacitor. The busbar has a built-in portion incorporated into the casing. The shield layer is electrically conductive and provided on an inner surface or an outer surface of the casing such that the shield layer covers the built-in portion.

Power converter

A power conversion device includes a semiconductor module, a cooling device, a case, which accommodates the semiconductor module and the cooling device, a connector, which is connected to an inlet pipe, which is a refrigerant flow pipe of the cooling device, and a sealing member, which seals between the inlet pipe and the connector. The connector includes a pipe portion, which communicates with the inlet pipe, and a flange portion, which is secured to the case. The pipe portion and the flange portion are joined to each other with the pipe portion located in an insertion hole of the flange portion.

Power conversion device

A power converter includes a control circuit executing feedback control of a first inverter based on a detected value of a first sensor adapted to a first rotating electrical machine. The first sensor detects a current of a first busbar adapted to the first rotating electrical machine. The first busbar connects the first inverter and the first rotating electrical machine. A second busbar adapted to a second rotating electrical machine connects a second inverter and the second rotating electrical machine. The second busbar is arranged to be apart from the first sensor interposed with a converter busbar between the second busbar and the first sensor. A current of the converter flows through the converter busbar.

A power converter includes an inverter, a converter, an electrical-machine busbar, an electrical-machine sensor, an electrical-machine-sensor housing, a converter, a converter busbar, a converter-sensor housing. The inverter supplies a three-phase alternating current to a rotating electrical machine. The converter converts a voltage between a direct current power supply and the inverter. The electrical-machine busbar passes a current between the inverter and the rotating electrical machine. The electrical-machine sensor detects the current flowing through the electrical-machine busbar based on a magnetic field. The electrical-machine-sensor housing accommodates the electrical-machine sensor and the electrical-machine busbar together. The converter sensor detects the current flowing through the converter based on a magnetic field. The converter-sensor housing is disposed apart from the electrical-machine-sensor housing, and accommodates the converter sensor and the converter busbar together.

A heat exchanger body that includes a circulation path through which a coolant is circulated and performs heat exchange between the coolant flowing through the circulation path and an electronic component; a circulation pump that supplies the coolant to the heat exchanger body; an accumulation determination unit that determines whether a foreign matter accumulation condition is fulfilled that is satisfied when foreign matter is expected to be accumulated in at least a part of the circulation path; and a process execution unit that in response to the foreign matter accumulation condition being satisfied, executes a foreign matter cleaning process of removing the foreign matter accumulated in the circulation path and cleaning the circulation path. In the foreign matter cleaning process, the process execution unit reduces an amount of coolant supplied from the circulation pump so that the coolant has a superheating degree in a nucleate boiling region.

Heat exchanger

A first module includes a first switch having a first electrode and a second electrode; a second switch having a third electrode and a fourth electrode; a second internal bus bar connecting the second electrode with the third electrode; and a first resin member encapsulating those components. A second module with includes a third switch having a fifth electrode and a sixth electrode; a fourth switch having a seventh electrode and an eighth electrode; a fifth internal bus bar connecting the sixth electrode with the seventh electrode; and a second resin member encapsulating those components. At least one of a first terminal of the second internal bus bar exposed from the first resin member and a second terminal of the fifth internal bus bar exposed from the second resin member extends toward the other and are directly joined with each other.

Power conversion apparatus

First switches include first electrodes, which are mutually connected with each other via a first internal bus bar, and second electrodes, which are mutually connected with each other via a second internal bus bar. A first resin member encapsulates the first switches and the first and second internal bus bars. Second switches include third electrodes, which are mutually connected with each other via a third internal bus bar, and fourth electrodes, which are mutually connected with each other via a fourth internal bus bar. A second resin member that encapsulates the second switches and the third and fourth internal bus bars. The second module is arranged alongside with the first module. The second internal bus bar and the third internal bus bar are partially exposed from the first resin member and the second resin member, respectively, and are directly joined with each other.

A capacitor module includes a capacitor element, a plurality of connection terminals for electrically connecting the capacitor element to a semiconductor module and a power supply that are another equipment, and an exterior coating that includes a resin film having electrical insulating property and wraps the capacitor element except the plurality of connection terminals.

Capacitor module and power conversion apparatus

A power conversion device includes a connector and a sealing member. The connector is connected to a lead-in pipe of a cooling device on the outside of a case. The sealing member makes a watertight seal between a refrigerant flow pipe, which is the lead-in pipe, and the connector. The sealing member includes a connector-side tubular portion, a first watertight seal projection, and a second watertight seal projection. The connector-side tubular portion is located between an inner peripheral surface of the connector and an outer peripheral surface of the lead-in pipe. The first watertight seal projection projects radially outward in an annular shape from the connector-side tubular portion toward the inner peripheral surface of the connector. The second watertight seal projection projects radially inward in an annular shape from the connector-side tubular portion toward the outer peripheral surface of the lead-in pipe.

In an electronic component cooling device, a cooler cools an electronic component, a coolant temperature acquisition unit acquires a temperature of a coolant, a coolant flow rate acquisition unit acquires the flow rate of the coolant, a heat loss estimation unit estimates a heat loss from the electronic component, and a loss threshold calculation unit calculates an upper limit threshold of the heat loss from the electronic component based on the coolant temperature and the coolant flow rate. A coolant flow rate control unit controls the flow rate of the coolant and is configured to, in response to an estimated heat loss which is the heat loss from the electronic component that has been estimated by the heat loss estimation unit exceeding the upper limit threshold, increase the flow rate of the coolant circulating through the cooler.

Electronic component cooling device

A power conversion apparatus includes an electric component, a housing, and a flow channel formation unit. The electric component configures at least a part of a power conversion circuit. The housing stores the electric component, and the electric component is fixed to the housing. The flow channel formation unit forms a refrigerant flow channel through which a refrigerant flows, and is thermally connected to the electric component. The flow channel formation unit is a member different from the housing, and an elastically deformable spacer is provided between the flow channel formation unit and the housing.

To provide a semiconductor device capable of effectively releasing heat from a semiconductor element, the semiconductor device includes a semiconductor element, a heat sink connected thermally to the semiconductor element and a coolant flow channel formed facing the heat sink. The heat sink is integrally composed of multiple cooling fins projecting toward the coolant flow channel. A linear base of each of the multiple cooling fins inclines relative to a direction in which a coolant is supplied through the coolant flow channel. An inclination of a linear base of each of the cooling fins arranged adjacent to each other in the direction relative to the coolant flow direction is substantially opposite from each other.

Semiconductor device

In an electric power conversion apparatus, a semiconductor module-cooler unit includes a semiconductor module and a cooler that has cooling pipes stacked with the semiconductor module in a stacking direction. A flow path forming component includes an electronic component main body and has an in-component flow path formed therein. A case receives both the semiconductor module-cooler unit and the flow path forming component therein. A pressure-applying member is arranged in the case to apply pressure to the semiconductor module-cooler unit from a rear side toward a front side in the stacking direction. Moreover, the flow path forming component is fixed to the case. The pressure-applying member, the semiconductor module-cooler unit and the flow path forming component are arranged in alignment with each other in the stacking direction. An in-cooler flow path formed in the cooler and the in-component flow path are fluidically connected with each other in the stacking direction.

Electric power conversion apparatus

A power conversion device includes a semiconductor stack, a reactor, and a capacitor. The semiconductor stack includes a plurality of semiconductor modules stacked on one another in a stacking direction. Each semiconductor module includes a semiconductor element. The reactor constitutes a boost circuit that boosts a direct-current voltage. The capacitor is electrically connected to the plurality of semiconductor modules. The semiconductor stack, the reactor, and the capacitor each include a coolant flow passage, and the reactor and the capacitor are located adjacent to each other.

Power conversion device with a coolant passage

An electrical power conversion apparatus is provided which includes a semiconductor module and a plurality of cooling pipes. Each of the cooling pipes has an electrical conductivity and a cooling medium flow path formed therein. Each of the cooling pipes is equipped with a flow path extension forming portion which protrudes above a module body in at least one of height-wise directions and in which a portion of the cooling medium flow path is formed. The flow path extension forming portion overlaps at least either of the power terminals or the control terminals in a stacking direction of the cooling pipes. This enhances the efficiency in decreasing the inductance of the power terminals and/or the control terminals, improves the productivity of the electrical power conversion apparatus, and enables the size of the electrical power conversion apparatus to be reduced.

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Kariya, Japan

Kazuya Takeuchi