Shin-etsu Handotai Co., Ltd.

Kazuya Sato

Syuichi Kobayashi

Hiromasa Hashimoto

Junichi Ueno

Yuki Tanaka

Naoki Kamihama

Hideo Kudo

Takuya Sasaki

Tsuyoshi Nishizawa

Hirotaka Horie

Kenji Iha

Toshinari Kinjo

Ayumu Sato

A method for selecting a template assembly includes: preparing a template assembly in which a template is concentrically attached on a base ring or a base plate having a larger outer diameter than the template, the template having a back pad to hold a workpiece back surface and a retainer ring positioned on the back pad and to hold an edge portion of the workpiece; non-destructively measuring a height position distribution of the retainer ring and the back pad on the template side of the template assembly, where an outer peripheral edge surface of the base ring or the base plate serves as a reference surface; calculating a flatness of the retainer ring and an average amount of step differences between the retainer ring and the back pad from the measured height position distribution; and selecting the template assembly based on the flatness and the average amount of step differences.

Method for selecting template assembly, method for polishing workpiece, and template assembly

The present invention provides a method for polishing a wafer including, after unloading and before loading to hold a next wafer to be polished: measurement to measure a depth PDof a concave portion of a template after taking out a polished wafer; calculation to calculate a difference &#x394;PD between the measured depth PDof the concave portion and a depth PDof the concave portion of the template before being used for polishing; and adjustment to adjust polishing conditions for a next wafer to be polished in accordance with the calculated difference &#x394;PD. Consequently, there are provided the method for polishing a wafer and a polishing apparatus which enable adjusting a fluctuation in flatness of each wafer caused due to a fluctuation in numerical value of a pocket depth of a template.

Method for polishing wafer and polishing apparatus

A method for evaluating surface defects of a substrate to be bonded: preparing a mirror-polished silicon single crystal substrate; inspecting surface defects on the mirror-polished silicon single crystal substrate; depositing a polycrystalline silicon layer on a surface of the silicon single crystal substrate subjected to the defect inspection; performing mirror edge polishing to the silicon single crystal substrate having the polycrystalline silicon layer deposited thereon; polishing a surface of the polycrystalline silicon layer; inspecting surface defects on the polished polycrystalline silicon layer; and comparing coordinates of defects detected at the step of inspecting the surface defects on the silicon single crystal substrate with counterparts detected at the step of inspecting the surface defects on the polycrystalline silicone layer and determining quality of the silicon single crystal substrate having the polycrystalline silicon layer as a substrate to be bonded on the basis of presence/absence of defects present at the same position.

Method for evaluating surface defects of substrate to be bonded

The present invention provides a method for evaluating a polishing pad by which a life of a polishing pad to polish a wafer is evaluated, the method being characterized in that a quantity of polishing residues deposited on the polishing pad is measured, and the life of the polishing pad is evaluated based on a measurement value provided by the measurement. Consequently, it is possible to provide the method for evaluating a polishing pad and the method for polishing a wafer that enable immediately evaluating the life of the polishing pad and also enable suppressing a reduction in productivity and a yield ratio at the time of polishing the wafer.

Method for evaluating polishing pad and method for polishing wafer

A method of producing a carrier for use in a double-side polishing apparatus, the method including engaging an insert with a holding hole formed in a carrier body and sticking the insert to the holding hole, the carrier body being configured to be disposed between upper and lower turn tables to which polishing pads are attached of the double-side polishing apparatus, the holding hole being configured to hold a wafer during polishing, the insert being configured to contact an edge of the wafer to be held, the method including: performing a lapping process and a polishing process on the insert; engaging the insert subjected to the lapping process and the polishing process with the holding hole of the carrier body; and sticking and drying the engaged insert while applying a load to the insert in a direction perpendicular to main surfaces of the carrier body.

Method of producing carrier for use in double-side polishing apparatus and method of double-side polishing wafers

The present invention provides a method for producing a silicon wafer including a step of, after growing the oxide film on one surface of a raw material silicon wafer by chemical-vapor deposition, performing double-side polishing of the raw material silicon wafer in such a manner that a suede polishing pad or a velour polishing pad with an asker-C rubber hardness of 50&#xb0; or more but less than 90&#xb0; is used for the oxide-film surface.

Method for producing silicon wafer

A carrier for a double-side polishing apparatus comprising at least: a metallic carrier base that is arranged between upper and lower turn tables having polishing pads attached thereto and has a holding hole formed therein to hold a wafer sandwiched between the upper and lower turn tables at the time of polishing; and a ring-like resin insert that is arranged along an inner peripheral portion of the holding hole of the carrier base and is in contact with a peripheral portion of the held wafer, wherein an inner peripheral end portion of the holding hole of the carrier base has an upwardly opening tapered surface, an outer peripheral portion of the ring-like insert has a reverse tapered surface with respect to the tapered surface of the holding hole of the carrier base, and the resin insert is fitted in the holding hole of the carrier base through the tapered surface.

Carrier for a double-side polishing apparatus, double-side polishing apparatus using this carrier, and double-side polishing method

The present invention provides method of double-side polishing a wafer, including: simultaneously polishing both surfaces of the wafer by holding the wafer in a holding hole of a carrier, interposing the held wafer between upper and lower turn tables to which polishing pads are attached, rotating the carrier about an axis of the carrier and revolving the carrier; and repeating the polishing in a batch manner, wherein a direction in which the carrier is revolved is reversed every polishing batch while repeating the polishing in a batch manner. The method enables wafers with high flatness to be stably obtained while inhibiting reduction in productivity due to dressing.

Method of double-side polishing wafer

A double-side polishing apparatus including at least: upper and lower turn tables each having a polishing pad attached thereto; a carrier having a holding hole formed therein for holding a wafer between the upper and lower turn tables; a sensor for detecting a thickness of the wafer during polishing, the sensor being disposed in a through-hole provided at the upper turn table in a direction of an upper-turn-table rotation axis; and a sensor holder for holding the sensor, wherein a material of the sensor holder is quartz. As a result, there is provided a double-side polishing apparatus that can polish a wafer while the difference from the target wafer thickness is reduced by surely inhibiting deformation of the sensor holder due to the influence of heat generated during the polishing of the wafer.

Double-side polishing apparatus

A carrier for a double-side polishing apparatus, including at least: a carrier base placed between upper and lower turn tables, the carrier base having a holding hole therein, the holding hole holds the wafer sandwiched between the upper and lower turn tables. A ring-shaped resin ring disposed along an inner circumference of the holding hole, the resin ring protecting a chamfered portion by making contact with the chamfered portion of the held wafer, wherein the resin ring has a concave groove on an inner circumference thereof, upper and lower tapered surfaces are formed in the concave groove. A double-side polishing apparatus using the carrier and a double-side polishing method that can reduce the generation of taper in a polished surface and improve the flatness while suppressing the generation of an outer peripheral sag of the wafer.

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Nasushiobara, Japan

Kazuya Sato