Hitachi Metals, Ltd.

Samsung Electronics Co., Ltd.

Adeka Corporation

Ricoh Company, Ltd.

Proterial, Ltd.

Kazuya Saito

Yuji Arai

Akira Suzuki

Toshihiko Shimokawa

Masaaki Yoshikawa

Naoki Iwaya

Yutaka Ikebuchi

Yoshiki Yamaguchi

Hiromasa Takagi

Tadashi Ogawa

Takayuki Seki

Masahiko Satoh

Ryuuichi Mimbu

Satoshi Ueno

Shuntaroh Tamaki

Younjoung Cho

Yutaro Aoki

Hiroyuki Uchiuzou

Koichi Sakamaki

Seungmin Ryu

Gyuhee Park

Yoshiki Manabe

Wakana Fuse

Younsoo Kim

Kousuke Kuwabara

Gang Han

Takanori Koide

Jaewoon Kim

Shiho Fukumoto

Kazuki Harano

Yousuke Nakano

Norihide Fukuzawa

Jun Fukuoka

Tomoyuki Hata

Hiroaki Sogame

Kouichi Sakamaki

Kiyomi Nakamura

An organometallic compound and a method of manufacturing an integrated circuit (IC) device, the organometallic compound being represented by Formula (I),

Organometallic compound and method of manufacturing integrated circuit using the same

An organometallic adduct compound and a method of manufacturing an integrated circuit (IC) device, the organometallic adduct compound being represented by General formula (I):

Organometallic adduct compound and method of manufacturing integrated circuit using the same

Provided are a laminate shaped article made of a maraging steel and having excellent toughness, a method for manufacturing the same, and a metal powder for laminate shaping. The laminate shaped article is made of a maraging steel comprising 0.1-5.0 mass % of Ti. When sis is performed on concentration distribution of Ti in a cross section parallel to a lamination direction of the above laminate shaped article, a length of a linear Ti-rich portion having a Ti concentration B of (1.5&#xd7;A) or more with respect to an average Ti concentration A in the cross section is 15 &#x3bc;m or less. In addition, the method for manufacturing the laminate shaped article uses a metal powder made of a maraging steel comprising 0.1-5.0 mass % of Ti, and a heat source output is set to 50-330 W and a scanning speed is set to 480-3000 mm/sec during the laminate shaping.

Laminate shaped article, method for manufacturing the same, and metal powder for laminate shaping

Provided is a Cr alloy target material with which formation of craters on the surface of the Cr alloy target material during film formation can be limited and the adhesion of droplets on the material being treated can be limited. The Cr alloy target material is represented by an atom ratio composition formula of CrM1M2, wherein 0.1&#x2264;x&#x2264;21.0, 0.1&#x2264;y&#x2264;23.0, M1 is at least one kind of element selected from Ti and V, and M2 is at least one kind of element selected from Mo, Mn, B, W, Nb and Ta, with the balance being unavoidable impurities. The Cr alloy target material contains 10-1000 mass ppm of oxygen as an unavoidable impurity.

Cr alloy target material

Provided is a Fe&#x2014;Co-based alloy sputtering target material having a composition represented as an atomic ratio by the compositional formula: (Fe&#x2014;Co)&#x2014;Ta&#x2014;Nb-M, wherein 0&#x3c;a&#x2266;80, 0&#x2266;b&#x2266;10, 0&#x2266;c&#x2266;15, 5&#x2266;b+c&#x2266;15, 2&#x2266;d&#x2266;20, 15&#x2266;b+c+d&#x2266;25, and M represents one or more elements selected from the group consisting of Mo, Cr and W, with the balance consisting of unavoidable impurities, wherein the sputtering target material has a bending fracture strain &#x3b5;at 300&#xb0; C. of 0.4% or more.

Fe-Co-based alloy sputtering target material, and method of producing same

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Tokyo, Japan

Kazuya Saito