Hitachi, Ltd.

Renesas Technology Corp.

Kazuya Ooji

Kunihiko Nishi

Makoto Kitano

Ichiro Anjoh

Junichi Saeki

Shuji Eguchi

Isamu Yoshida

Shigeharu Tsunoda

Nae Yoneda

Michiharu Honda

Kenichi Otsuka

A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

Semiconductor devices and methods of making the devices

A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold, which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame

Method of manufacturing a semiconductor device having a ball grid array

Semiconductor device having a ball grid array package structure using a

Growing community of inventors

Kamakura, Japan

Kazuya Ooji