Nikon Corporation

Koganei Corporation

Kabushiki Kaisha Toshiba

Shimadzu Corporation

Kazuya Okamoto

Isao Sugaya

Soichi Owa

Masato Shibuya

Hiroshi Ooki

Akihiro Goto

Kinya Kato

Toru Takagi

Minoru Fukuda

Hajime Mitsuishi

Hiroshi Nishimura

Naoto Kihara

Junji Ikeda

Akira Watanabe

Yasuaki Tanaka

Wataru Funamizu

Koichi Kamijo

Hidehiro Maeda

Hirokazu Ohki

Joji Inaba

Takahiro Horikoshi

Koichi Teraki

Mamoru Nakasuji

Hiroshi Ohki

Teruaki Okino

Shiro Tsunai

Katsushi Nakano

Atsushi Yamada

Yuji Manabe

Shintaro Kawata

Yoshiaki Nakano

Yukiharu Okubo

Shigeru Aoki

Osamu Saruwatari

Sota Nakanishi

Yutaka Iwasaki

Shinichi Kojima

Masashi Okada

Kunio Tada

Shin-ichi Kojima

Tadayosi Kokubo

Masahisa Higashi

Hideki Okamoto

Eisaku Nakao

Jouji Inaba

A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.

Apparatus for stacking substrates and method for the same

Solenoid valve manifold

An image sensor includes: a first light-receiving unit that: receives a modulated optical signal having being reflected on an image-capturing target and including a modulated component with an intensity modulated at a predetermined modulation frequency; and outputs a first electrical signal; a second light-receiving unit that: receives a reference optical signal with an intensity modulated in synchronization with the modulated optical signal; and outputs a second electrical signal; and a detecting unit that: is provided to a substrate stacked on a substrate including the first light-receiving unit; refers to the second electrical signal; and detects, from the first electrical signal, a third electrical signal corresponding to the modulated component.

Image sensor and image-capturing apparatus

Provided is a light detecting apparatus including: a first photoelectric converting element which outputs a first electrical signal in accordance with an incident light including a modulated light component and a background light component; a filter which outputs a second electrical signal resulting from the modulated light component being reduced in the incident light; and a signal processor which subtracts the second electrical signal from the first electrical signal to reduce a component corresponding to the background light component in the first electrical signal.

Light detecting apparatus, image capturing apparatus and image sensor

A detector comprises a plurality of photoelectric converters to output an electrical signal corresponding to an incident light, and a plurality of filter circuits provided corresponding to each of the plurality of photoelectric converters or to each of a plurality of element groups respectively including a predetermined number of the photoelectric converters of the plurality of photoelectric converters, the plurality of filter circuits attenuating a signal having a predetermined frequency from the electrical signal output from the plurality of photoelectric converters, In the above-described detector, the plurality of photoelectric converters may be provided in a first substrate, and the plurality of filter circuits may be provided in a second substrate laminated on the first substrate.

Detector, detector with lock-in amplifier, substrate, and method for manufacturing a detector

A substrate aligning apparatus comprising: an aligning section that aligns a first substrate and a second substrate together; an acquiring section that acquires positional information on at least one of the first substrate and the second substrate, by the time the first substrate and the second substrate which have been aligned in the aligning section are carried out from the aligning section; a judging that judges misalignment of the first substrate and the second substrate, based on information acquired by the acquiring section.

Substrate aligning apparatus, substrate bonding apparatus, substrate aligning method and substrate bonding method

A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit that stores an estimated extent of change in a position of an electrode at each chip, expected to occur as heat is applied to the chip assemblies placed on the plurality of stages during a stacking process; and a control unit that sets positions of the plurality of stages to be assumed relative to each other during the stacking process based upon the estimated extent of change in the position of the electrode at each chip provided from the storage unit and position information indicating positions of individual chips formed at the chip assemblies and controls at least one of the plurality of stages.

WH (wafer-holder) process

The terminals that oppose each other when substrates are bonded are designed to be reliably joined. Comprised in a semiconductor device design system are a numerical value acquiring part, which acquires the respective numerical values of a plurality of calculation parameters, a junction estimating part, which, in the case in which a plurality of substrates has been pressed at a prescribed pressure so that the bump front end faces come into contact, estimates whether or not the respective mutually opposing bumps will be joined based on the respective numerical values of the calculation parameters acquired by the numerical value acquiring part, and a change processing part, which, in the case in which it has been estimated by the junction estimating part that any of the bumps will not be joined, gives a warning or performs processing so as to change the numerical value of at least one calculation parameter among the plurality of calculation parameters.

System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates

Multiple-points measurement

Provided is an adhesive injection device for injecting an adhesive between the substrates of laminates which each comprise at least two substrates that face each other. The adhesive injection device is provided with: a cassette which holds multiple laminates aligned along the direction of lamination of the substrates; and an adhesive injector which injects adhesive into each inter-substrate space, as the laminates are being held in the cassette, so that the actions of injecting the adhesive into each inter-substrate space overlap chronologically. Holding multiple laminates in the cassette makes it possible to treat the multiple laminates as a unit. By injecting adhesive into each inter-substrate space, as the laminates are being held, so that the actions of injecting the adhesive into each inter-substrate space overlap chronologically, the injection of adhesive into multiple laminates is simplified, and the time required for injection can be reduced.

Adhesive injection device

Provided is a transport method comprising judging whether there is a possibility that misalignment greater than or equal to a threshold value occurs between substrates to be layered that are held by a pair of substrate holders aligned and stacked by an aligning section, the misalignment occurring when the pair of substrate holders is transported from the aligning section to a pressure applying section; and if the judgment indicates that there is the possibility of misalignment, transporting the pair of substrate holders to a region other than the pressure applying section. Whether there is the possibility of misalignment may be judged based on at least one of an acceleration of the substrate holders, an acceleration of a transporting section that transports the substrate holders, relative positions of the substrate holders, or relative positions of the transporting section and one of the pair of substrate holders.

Transport method and transport apparatus

Stacking apparatus and method for stacking integrated circuit elements

Growing community of inventors

Yokohama, Japan

Kazuya Okamoto