The Furukawa Electric Co., Ltd.

Kazuya Nagashima

Atsushi Izawa

Yozo Ishikawa

Maiko Ariga

Jun Miyokawa

Kazuki Yamaoka

Osamu Suzuki

Yusuke Inaba

Taketsugu Sawamura

Nobuyuki Morita

Yoshiyuki Nousou

An optical device includes: a case; a sleeve attached to the case, the sleeve including a first through-hole penetrating between an inside and an outside of the case, and an inclined surface inclined with respect to a penetrating direction of the first through-hole, the inclined surface having an opening of the first through-hole; a first optical fiber including a core wire including a core and a clad, and a sheath configured to surround the core wire, wherein an exposed portion of the core wire not surrounded by the sheath passes through the first through-hole; and a first joining material interposed and sealed between an outer peripheral surface of the exposed portion and an inner peripheral surface of the first through-hole in the first through-hole.

Optical device and method for manufacturing optical device

An optical module includes: an optical device; an array lens member that integrally includes a plurality of parallel lens units optically connected to the optical device; and a correction optical element configured to correct light that passes through the lens units.

Optical module and optical device

An optical apparatus includes: a housing; at least one component housed in the housing, the at least one component being configured to be energized and perform at least one of outputting light, receiving light, and changing a property of light; a plurality of external connection conductors configured to penetrate through the housing; and a flexible substrate housed in the housing, the flexible substrate including an insulation layer, a plurality of conductive wires each configured to perform at least one of conduction between the component and the external connection conductors, conduction between the external connection conductors, and conduction between a plurality of the components each serving as the at least one component, a base part in which the conductive wires are covered by the insulation layer, and a plurality of arm parts protruding and extending from the base part, each including one of the conductive wires.

Optical apparatus

An optical module includes: an optical element; a housing configured to house the optical element; as electrical terminal arranged on an outer peripheral surface of the housing and electrically connected to an inside of the housing; and a positioning unit configured to determine a relative position of a wiring board electrically connected to the electrical terminal from outside of the housing, with respect to the electrical terminal.

Optical module and method of manufacturing optical module

An optical module includes: a laser device; a wavelength detector; a modulator; a modulator driver; a coherent mixer; a photoelectric element; a transimpedance amplifier; and a casing. Further, the laser device is arranged such that the laser device outputs a laser light beam in a direction opposite to a side on which the optical output unit is arranged in the casing.

Optical module

An optical module includes a box-shaped housing with an optical element mounted therein. Further, a wiring substrate is bonded to a part of a surface of a housing part of the housing, and an electric wiring, which is formed in the wiring substrate or on a surface of the wiring substrate, and an electric wiring, which is introduced into the housing part or onto a surface of the housing part, are electrically connected to each other.

An optical module includes: photoelectric elements including first terminal groups; an integrated circuit including second terminal groups and ground terminals; a carrier substrate; a housing; and a common ground pad. Further, the carrier substrate is fixed to one surface of the housing, the carrier substrate includes signal wiring parts and a ground wiring part, the ground wiring part includes terminal pattern parts, a common pattern part, and a coupling part, each of the terminal pattern parts being disposed between the corresponding signal wiring parts and electrically connected with one of the ground terminals, the common pattern part being disposed on a side where the common ground pad is provided on the carrier substrate, the coupling part electrically connecting each terminal pattern part and the common pattern part, and the ground terminals of the integrated circuit are electrically connected with the common ground pad through the ground wiring part.

The present invention provides an optical module capable of achieving downsizing and high densification, and reducing crosstalk as compared to a conventional optical module. An optical module includes: an optical device including multiple light receiving elements; a control device which transmits and receives signals to and from the optical device; and a substrate including multiple lines which allow passage of the signals. Anode terminals of the multiple light receiving elements are connected to different lines by first wires, respectively. Cathode terminals of the multiple light receiving elements are connected to different lines by second wires, respectively. Each first wire and the corresponding second wire cross each other and are disposed out of contact with each other. The wires connecting each light receiving element and the control device, namely, the wires of each channel cross each other.

Optical module for reducing crosstalk

A technology for effectively preventing deformation of a light reflector plate fabricated by forming a synthetic resin reflector plate into a three-dimensional shape enabling a thinner light reflector plate, and additionally, reducing processing costs is provided. An adhesive tape for shape-retention is adhered onto a reflector plate which is fabricated by forming predetermined areas of a light-reflecting plastic film or sheet into a three-dimensional shape.

Growing community of inventors

Tokyo, Japan

Kazuya Nagashima