Nichia Corporation

Kazuya Matsuda

Yasuo Kato

Atsushi Bando

Hiroyuki Tanaka

Naofumi Sumitani

Yuta Horikawa

Mitsuhiro Isono

Takaaki Kato

Akihiro Fujioka

Kensuke Maehara

A light emitting device includes a resin package including a first lead, a second lead, a resin portion holding the first lead and the second lead, at least one light emitting element mounted on the resin package, and a covering member covering at least a portion of an upper surface of each of the first lead, the second lead, and the resin portion. The resin portion includes at least one resin recess between the first lead and the second lead. At least a portion of the resin recess is located between a first portion of the first lead and a second portion of the second lead in a first direction, and is located between a first extended portion of the first lead and a second extended portion of the second lead in a second direction, and at least a portion of the resin recess is covered by the covering member.

Light emitting device

A metallic structure for an optical semiconductor device including a conductive base body having disposed thereon metallic layers in the following order: a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and an indium or indium alloy plated layer, wherein the indium or indium alloy plated layer has a thickness in a range of 0.002 μm or more and 0.3 μm or less.

Metallic structure for optical semiconductor device, method for producing the same, and optical semiconductor device using the same

A metallic structure for an optical semiconductor device, including a base body having disposed thereon at least in part metallic layers in the following order; a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and a silver or silver alloy plated layer, wherein the silver or silver alloy plated layer has a thickness in a range of 0.001 μm or more and 0.01 μm or less.

A light-emitting device includes: a first light-emitting element and a second light-emitting element, each configured to be independently driven; a wall portion located between the first light-emitting element and the second light-emitting element; a first light-transmissive member separated from the second light-emitting element by the wall portion and covering at least a portion of lateral surfaces of the first light-emitting element, wherein the first light-transmissive member contains a first wavelength converting member; and a second light-transmissive member covering the first light-emitting element, the second light-emitting element, and the first light-transmissive member in a plan view, wherein the second light-transmissive member contains a second wavelength converting member. A peak emission wavelength of the first wavelength converting member is longer than a peak emission wavelength of the second wavelength converting member.

Light-emitting device

A metallic structure for an optical semiconductor device, including a base body having disposed thereon at least in part metallic layers in the following order; a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and a silver or silver alloy plated layer, wherein the silver or silver alloy plated layer has a thickness in a range of 0.001 &#x3bc;m or more and 0.01 &#x3bc;m or less.

A light emitting device includes: a first light emitting element and a second light emitting element, each having a peak emission wavelength in a range of 430 nm to 480 nm; a first light transmissive member disposed on an upper face of the first light emitting element and containing a first phosphor; a second light transmissive member disposed on an upper face of the second light emitting element; and an encapsulant covering the first light transmissive member and the second light transmissive member and containing a second phosphor. The first light emitting element and the second light emitting element are configured to be independently driven. A chromaticity of light exiting from the first light transmissive member differs from a chromaticity of light exiting from the second light transmissive member.

A resin package defining a recess includes a first lead having an element-mounting region, a second lead having a wire-connecting region, and a resin body including first to third resin portions. The third resin portion surrounds the element-mounting region. Each of the first and second leads includes a first plating and a second plating covering at least a portion of the first plating. The wire-connecting region is located outward of the third resin portion. The element-mounting region is located on an outermost surface of the second plating. In a top view, the wire-connecting region is located laterally inward of a portion of the second plating of the second lead that has an outermost surface located higher than that of the first plating of the second lead.

Resin package and light emitting device

A method of manufacturing light emitting devices, the method including: providing a first structure, the providing a first structure including: providing a lead frame, the providing a lead frame including: providing a metal plate having a plurality of pairs of first and second metal parts, each of the first and second metal parts including at least one first region and at least one second region; using an electrodeposition technique, disposing a mask of a resist film on the at least one first region; disposing a first plating containing silver or silver alloy on the at least one second region; and removing the resist film; molding a resin molded body in one piece with the lead frame with parts of a lower surface of the lead frame being exposed, in which, the first structure includes an upper surface defining a plurality of recesses each having an upward-facing surface, at least parts of the first plating being located at the upward-facing surface of each of the plurality of recesses; providing a second structure, the providing a second structure including: disposing at least one light-emitting element on the first plating located at the upward-facing surface of each of the plurality of recesses; and disposing a sealing member covering the at least one light-emitting element in each of the plurality of recesses; and separating the second structure into a plurality of individual light emitting devices.

Method of manufacturing light emitting devices

A method of manufacturing a light emitting device, including: providing a first structure including: providing a lead frame which includes providing a metal plate including a plurality of pairs of first and second metal parts, each metal part including an upper surface, a lower surface, and an end surface, the end surface of the first metal part and the end surface of the second metal part of each pair are opposite to each other, and a first region including the end surface, and disposing a mask of a resist film on the first region using an electrodeposition technique, disposing a first plated layer containing gold or gold alloy on a second region including the upper surface other than the first region on at least one of the upper surface, the lower surface, and the end surface of each of the first and second metal parts using a plating technique, and removing the resist film, providing a resin molded body molded integrally with the lead frame with parts of a lower surface of the lead frame being exposed, in which the first structure includes an upper surface defining a plurality of recesses each having an upward-facing surface, the first plated layer on the upper surface of the metal part is located at the upward-facing surface of each of the plurality of recesses; providing a second structure, the providing a second structure including; disposing at least one light-emitting element on the upward-facing surface each of the plurality of recesses, disposing a sealing member covering the at least one light-emitting element in each of the plurality of recesses; and separating the second structure into a plurality of discrete light emitting devices.

Method of manufacturing light emitting device

A lead frame includes a plurality of unit structures, an outer frame, a plurality of extending portions, and a plurality of coupling portions. The unit structures each includes a first lead portion and a second lead portion aligned in a first direction, and grouped into first and second groups including a plurality of the unit structures aligned in the first direction. The extending portions each includes a first extending portion extending in the second direction and connecting the first lead portions of the unit structures in the first and second groups a second extending portion connecting the second lead portions of the unit structures in the first and second groups. The coupling portions connect all the first extending portions and the second extending portions. At least one of the extending portions located at one of ends in the first direction is not directly connected to the outer frame.

Lead frame and method of manufacturing light emitting device

A metallic structure for an optical semiconductor device including a conductive base body having disposed thereon metallic layers in the following order: a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and an indium or indium alloy plated layer, wherein the indium or indium alloy plated layer has a thickness in a range of 0.002 &#x3bc;m or more and 0.3 &#x3bc;m or less.

A light-emitting device includes: a first light-emitting element and a second light-emitting element, each having a peak emission wavelength in a range of 430 nm to 480 nm; and a sealing member covering the first light-emitting element and the second light-emitting element, the sealing member containing a first fluorescent material. The first light-emitting element and the second light-emitting element are configured to be individually driven. The sealing member includes a protruding portion at an upper surface thereof. The first light-emitting element is disposed in a first region, which is located under the protruding portion. The second light-emitting element is disposed in a second region, which is located under the upper surface of the sealing member at a position different from the first region.

A light emitting device includes: a resin package including: a first lead including: at least one notch extending from an upper surface of the first lead to a lower surface of the first lead, a first groove formed in the upper surface of the first lead, and at least one second groove connecting the first groove with the at least one notch, and a second lead, and a resin body including: a first resin portion, a second resin portion, a part of the second resin portion being disposed in the first groove, a third resin portion disposed between the first lead and the second lead, and a first resin connecting portion connecting the first resin portion with the second resin portion, at least a part of the first resin connecting portion being disposed in the at least one second groove; a light emitting element; and a light reflecting member.

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Anan, Japan

Kazuya Matsuda