Olympus Corporation

Olympus Medical Systems Corporation

Kazuya Maeda

Yukiharu Makino

Shoichiro Kawayoke

An optical unit includes a transparent first substrate, a transparent second substrate, a transparent first projection forming a part of an optical path, and a first aperture configured by black resin filled in a periphery of the first projection between the first substrate and the second substrate.

Optical unit, manufacturing method for optical unit, and endoscope

An endoscope lens unit includes a first optical device which includes a first glass plate including a first side surface, a second optical device which includes a second glass plate including a second side surface having the same external dimension as an external dimension of the first side surface, a spacer which includes a third side surface and which defines a distance between the first glass plate and the second glass plate, and a light shielding resin which covers the first side surface, the second side surface, and the third side surface, at least part of the third side surface being located closer to an optical axis than the first side surface and the second side surface and constituting a bottom of a recess, the first glass plate and the second glass plate defining wall surfaces of the recess, the recess being filled with the light shielding resin.

Endoscope lens unit, endoscope, and manufacturing method of endoscope lens unit

An image pickup unit includes an image sensor, a first circuit board on which a first land is disposed around four first side surfaces, a second circuit board on which a second land is disposed around four second side surfaces, a movement detection sensor housed in a recess of the first circuit board, and a rectangular tube bonded to the first land and the second land and sealing the recess in an airtight manner.

Image pickup unit and endoscope

A manufacturing method of an image pickup apparatus for endoscope includes: fabricating a first optical wafer and a second optical wafer including spacers; disposing walls made of a first resin, being greater in height than the spacers, and enclosing optical paths without any gap; clamping the first optical wafer and the second optical wafer with the walls being interposed between the first optical wafer and the second optical wafer; charging a second resin around the walls; performing curing treatment on the second resin to cause the second resin to shrink, and fix the first optical wafer and the second optical wafer in a state where an interval between the first optical wafer and the second optical wafer is defined by the spacers; and cutting a bonded wafer.

Manufacturing method of image pickup apparatus for endoscope, image pickup apparatus for endoscope, and endoscope

A manufacturing method of an optical unit for endoscope includes: a process of fabricating a plurality of element wafers each including an optical element having an optical path portion and a spacer portion; a first adhesion process of fabricating a laminated wafer by adhering the element wafers with a first adhesive portion composed of a solid first adhesive disposed in a gap between the spacer portions; a second adhesion process of fabricating a bonded wafer by injecting a liquid second adhesive in the gap between the spacer portions; a curing process of performing curing treatment on the second adhesive; and a process of cutting the bonded wafer.

Manufacturing method of optical unit for endoscope, optical unit for endoscope, and endoscope

An image pickup module includes: an image pickup device provided with a plurality of electrode pads lined up on an inclined surface inclined at an acute first angle to a light receiving surface; and a flexible wiring board provided with a plurality of bond electrodes each bonded with each of the plurality of electrode pads of the image pickup device and lined up in parallel to an end side, and the image pickup module further includes a holding portion that is a triangular angle regulating portion extended from a side face of the wiring board, an angle of which formed by a first side and a second side is the first angle, and a resin member fixing the image pickup device and the wiring board, a relative angle of which is regulated to the first angle by the holding portion.

Image pickup module and manufacturing method of image pickup module

An image pickup apparatus includes an image pickup device configured such that a plurality of electrode pads are disposed in a row on an inclined surface; a wiring board configured such that a plurality of first bonded electrodes that are bonded to the plurality of electrode pads via first solder bumps, respectively, are disposed in a row on a first end portion, and a plurality of second bonded electrodes are disposed in a row on a second end portion; and a signal cable configured to be bonded to the plurality of second bonded electrodes via second solder bumps, respectively. The wiring board includes a first protective film which covers the first end portion, and a second protective film which covers the second end portion, and is of a thickness that is greater than a thickness of the first protective film and less than a height of the second solder bumps.

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Nagano, Japan

Kazuya Maeda