Canon Kabushiki Kaisha

Cannon Kabushiki Kaisha

Kazuya Ishiwata

Yasuyuki Watanabe

Yoshimi Uda

Shinsaku Kubo

Naoya Nishida

Tatsuo Murata

Masaaki Suzuki

Takashi Enomoto

Yuichi Masaki

Toshifumi Yoshioka

Hiroaki Toshima

Noriyuki Nakai

Yuko Yokoyama

Yoshio Suzuki

Shuji Yamada

Masayuki Shimamune

Mutsuo Mitsui

Tadayasu Meguro

Masafumi Moriya

Chiori Mochizuki

Kazunori Katakura

Yoshihiro Yanagisawa

Tadashi Mihara

Hideaki Takao

Takayuki Ishii

Akio Yoshida

Akira Unno

Tetsuro Saito

Sunao Mori

Yukitoshi Ohkubo

Yoshinori Shimamura

Chikako Tsujita

Akihiko Nagano

Masato Yamanobe

Nobuhiro Ito

Junko Sato

Hajime Sakata

Etsuro Kishi

Ryoji Fujiwara

Kenji Onuma

Toshiharu Uchimi

Mamo Matsumoto

Shigeharu Iijima

Fumikazu Kobayashi

Tomoyuki Umezawa

Masao Yamanobe

Naoki Matsuzaki

Adherence between a sealing material and a glass substrate is assured, thereby improving airtightness of a hermetic container. A manufacturing method of the hermetic container has: an assembling step of sealing a first glass substrate and a second glass substrate through a circumferential sealing material having plural straight line portions and plural coupling portions which connect the plural straight line portions so as to define an internal space between the first glass substrate and the second glass substrate; and a sealing step of maintaining the internal space to a negative pressure to an outside after the assembling step, applying such local force as to compress the coupling portions of the circumferential sealing material in a thickness direction of the sealing material, and heating and melting the sealing material by irradiating local heating light to the sealing material, to seal the first glass substrate and the second glass substrate.

Hermetic container and manufacturing method of the same

A method for manufacturing an electronic substrate structure comprising a substrate, a glass layer, and a conductive layer. This method may include the steps of arranging the glass layer on the substrate, arranging the conductive layer that includes a precious metal particle on the glass layer while directly contacting the glass layer, and heating the glass layer together with the conductive layer at a temperature that is lower than a softening point of the glass layer so that the particle is put into the glass layer. The particle has a diameter of not less than 1 &#x3bc;m and not more than 10 &#x3bc;m.

Manufacturing method of substrate, manufacturing method of wiring board, wiring board, electronic device, electron source, and image display apparatus

A wiring board has a substrate having a groove on its surface, a first wiring placed in the groove, a plurality of bonding members located at mutually separated positions and each of which bonds the first wiring and the substrate. A gap is located between the first wiring and the surface of the groove.

Wiring board with groove in which wiring can move, image display apparatus, and image reproducing apparatus

An airtight container includes a first substrate and a second substrate facing the first substrate and joined thereto using joint members. The first substrate has a groove extending on a surface of the first substrate and a wiring provided along a direction of the extended groove. The wiring includes a section inside and along the groove and a section outside the groove and extending from the section inside the groove, and the first substrate includes joint members provided on and across the section of the wiring outside the groove. In addition, a frame is joined on the second substrate by second joint members and is interposed between the first substrate and the second substrate. The frame is joined to the first substrate by the first joint members.

Airtight container and display device using the airtight container, and manufacturing method therefor

A method of manufacturing a wiring board comprising preparing a substrate having a groove and an adjacent area; the substrate being of a wiring board also comprising a first wiring having first and second portions provided in first and second areas, respectively, making a contact angle of the second area different from a contact angle of a third area which is another part of the adjacent area, surrounding the second area together with the groove; and applying conductive paste to at least the first and second areas.

Method for manufacturing wiring board for an image display

As a substrate having a fine line and capable of suppressing crack generation in the substrate and peeling of the fine line, the invention discloses a configuration in which plural recesses are arranged on the fine line, and particularly a configuration in which the interval of the plural recesses does not exceed 200 &#x3bc;m. There is also disclosed a configuration in which the plural recesses are arranged along a direction crossing the longitudinal direction of the fine line.

Substrate having fine line, electron source and image display apparatus

To provide an electron source including: a wiring board having: a substrate provided with a groove on its surface; a first conductive member which is arranged along the groove in the groove; and a second conductive member which is arranged above the first conductive member crossing the first conductive member; and an electron-emitting device which is arranged on the wiring board and is electrically connected to the first conductive member and the second conductive member; wherein a particle is arranged between the first conductive member and an inner wall of the groove.

Electron source, image display apparatus, image reproducing apparatus, wiring board, and electronic device

To provide an electron source including: a wiring board having: a substrate having a groove on its surface; a conductive wire containing a metal which is arranged along the groove in the groove; and a wiring which is arranged above the wire crossing the wire; and an electron-emitting device which is arranged on the wiring board and is electrically connected to the conductive wire and the wiring; wherein the wire has an oxide layer of the metal contained in the wire on its surface.

Electron source, image display apparatus, image reproducing apparatus, wiring board, and manufacturing method of wiring board

In a method of manufacturing an electron-emitting device, an electroconductive film formed on a substrate is subjected to a clean processing to remove a foreign matter from the electroconductive film, and thereafter, energization is conducted on the electroconductive film, to form an electron-emitting region. Accordingly, there is provided an electron-emitting device which avoids a formation defect of the electron-emitting region due to the existence of the foreign matter and which has satisfactory characteristics without fluctuation.

Method of manufacturing electron-emitting device, electron source, and image display device

A method for forming patterned insulating elements on a substrate includes a plurality of exposure steps of exposing a photosensitive paste provided on the substrate through at least one mask having a predetermined pattern; a developing step of developing the exposed photosensitive paste to form a precursor pattern; and a firing step of firing the precursor pattern to form the patterned insulating elements. This method is applied to a method for forming an electron source and a method for forming an image display device including the electron source.

Method for forming patterned insulating elements and methods for making electron source and image display device

In a production method of an electron source wherein a plurality of electron-emitting devices are connected by and driven by matrix wirings, the upper wiring of the matrix wiring is partially removed at a short circuit region at a cross portion between the matrix wirings, thereby removing the short circuit and effectively repairing an electrical connecting relation of the matrix wirings.

Production method of electron source and image display

A manufacturing method for a wiring substrate for a display panel having a plurality of wiring electrodes thereon includes the step of forming wirings in an orthogonal projection area of an image forming member onto the wiring substrate by photolithography using a photo paste. In addition, wires are formed in an area where the frame member is disposed by pattern printing using paste ink for printing.

Method of manufacturing a wiring substrate for a display panel

A covering layer for insulating between column wirings and device electrodes is formed in a region including each cross point of the column wirings and row wirings and under the column wirings. Thus, when an electron source plate in which a large number of electron-emitting devices are wired in passive matrix is formed, a defect resulting from an interaction between the device electrodes and the column wirings at the time of wiring formation is reduced to improve insulation reliability. Therefore, a high quality image is obtained by a large size and higher density pixel arrangement in an image-forming apparatus using the electron source plate.

Electron source plate, image-forming apparatus using the same, and fabricating method thereof

An electron source forming substrate comprises an insulating material film provided on a substrate surface, where an electron-emitting device is arranged. The insulating material film contains a metallic oxide and has a vacancy, so that the vacancy suppresses diffusion of Na from a substrate thereunder, thereby electron-emitting characteristic is maintained stable without adverse effect due to Na even after long time operation.

Electron source forming substrate, and electron source and image display apparatus using the same

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Kanagawa, Japan

Kazuya Ishiwata