Casio Computer Co., Ltd.

Asahi Kogaku Kogyo Kabushiki Kaisha

Kazuya Hara

Kenji Rikuna

Harumi Nakano

Eiichi Takeuchi

Hiroyasu Bito

Kazuhiro Sugiyama

Mitsunori Iima

Takanori Inoue

Atsumi Kaneko

Tatsuo Shimazaki

Yoshimi Shigenaga

Shigeyuki Kawana

Fumio Narui

Morito Tamiya

Kenji Endoh

A non-scanning type optical reading apparatus for reading patterns such as a bar code. The optical reading apparatus comprises an imaging lens for imaging a bar code as a pattern to be read, a CCD line sensor for reading the information of the image of the pattern, and a light damping mirror and/or filter that is provided between the pattern and the CCD line sensor. The central part of the light damping mirror filter is denser than the periphery to achieve a uniform distribution of light on the sensor. According to one embodiment, the filter is a bandpass filter.

Non-scanning type optical reading apparatus having illuminating

An intelligent card has a calculation function and a card holder collation function, and is formed to have the same size as that of a credit card. With the collation function, numeral data input from a key input section of the card is collated with identification data prestored in an internal integrated memory circuit. A so-called IC card itself is relatively expensive. However, the intelligent card of this invention additionally has a calculation function, and the IC card function can be provided inexpensively.

Compact type electronic information card

In an electronic memory card, an IC pellet has a number of electrode pads which are provided on one surface thereof and have a size larger than that of bonding terminals formed in the IC pellet. The IC pellett is received in a storage section of an upper inner core and is adhered on a writing substrate by an anisotropic conductive adhesive tape. Thus, internal connecting terminals formed ont he substrate are electrically connected through portions of the conductive tape to the electrode pads. The wiring substrate is mounted on a lower inner core and is received in a storage section of an intermediate inner core. Films are formed on the multi film structure of the inner core and wiring substrate and contact terminals are so provided in the film and inner core as to be connected to the internal connecting terminals.

Electronic memory card and method of manufacturing same

A card-like electronic apparatus comprises a core member an electronic assembly, an upper cover, and a lower cover. The core member includes a frame having an accommodation section for accommodating the electronic assembly, and a thick portion protruding from the frame. The electronic assembly is arranged in the accommodation section and includes a printed circuit board having a plurality of stational key contacts, an IC chip, an electronically-driven display unit, and a thin flat battery. The upper cover is arranged on one surface of said electronic assembly and includes a pressure-deformable sheet having movable key contacts aligned with said stational key contacts, key indicia aligned with the movable key contacts, and a display window aligned with the display unit. The lower cover includes a supporting plate, arranged over another surface of said electronic assembly, having a cutaway portion in which said thick portion is fitted, and which has high rigidity. An embossment is formed in such a way that each of the upper cover, the thick portion of the core member, and the lower cover has one surface recessed and other surface protruding. A magnetic stripe portion is provided on the lower cover.

Card-like electronic apparatus

An IC including an EEP-ROM is formed on a semiconductor wafer. The IC also has exposed address pads connected to the address bus of the EEP-ROM, and exposed data pads connected to the data bus of the EEP-ROM. A test probe is brought into contact with these pads, thereby performing various tests on the IC. After the IC has been tested, the wafer is diced into IC pellets. The address pads are disconnected from the address bus and/or the data pads are disconnected from the data bus. For example, the edge portions of the IC pellet on which the address pads and/or the data pads are formed are cut by dicing from the remaining portion of the IC pellet. Thereafter, the connecting pads of the IC pellet are wire-bonded to leads, and the IC pellet is sealed with a resin. Finally, the sealed IC pellet is built in an IC card body.

IC card

A card-like electronic apparatus includes a plurality of external contacts and input terminals. The apparatus further includes a memory for storing application data, a designating unit for designating the application as stored in the memory, and a display unit for displaying the designated application data. When a power control key provided on the side of a card apparatus is in an on state, the application can be changed to another application by the designating unit. The applications as designated are successively displayed by the display unit. Through this display, the application to be used at any given time can be specified.

Multiple application electronic card-like apparatus

In an electronic memory card an IC pellet has a number of electrode pads which are provided on one surface thereof and have a size larger than that of bonding terminals formed in the IC pellet. The IC pellet is received in a storage section of an upper inner core and is adhered on a wiring substrate by an anisotropic conductive adhesive tape. Thus, internal connecting terminals formed on the substrate are electrically connected through portions of the conductive tape to the electrode pads. The wiring substrate is mounted on a lower inner core and is received in a storage section of an intermediate inner core. Films are formed on the multi film structure of the inner core and wiring substrate and contact terminals are so provided in the film and inner core as to be connected to the internal connecting terminals.

Multi-layered electronic card carrying integrated circuit pellet and

A key input unit, a display unit and a solar cell are arranged on one surface of a card-like electronic calculator. This surface serves as an electronic calculator. The outer shape of the card-like electronic calculator is the same as that of a credit card. Furthermore, a magnetic stripe portion on which predetermined data is recorded, and embossed portions for displaying information are formed on the other surface of the calculator. Therefore, the calculator also serves as a credit card.

Combined electronic calculator and credit card

In compact card-like equipment having an IC chip and a power source cell, an equipment case has a multilayered structure of a pair of upper and lower sheets and a pair of upper and lower panels laminated on a frame, respectively. A flexible substrate and a paper-like cell as a primary cell are provided in the equipment case. The paper-like cell has a pair of positive and negative electrode sheets and a power generating unit interposed therebetween. A sealing member seals the peripheries of the electrode sheets of the paper-like cell. The paper-like cell is received in a receptacle space formed in the frame. The flexible substrate is received in another receptacle space formed in the frame. The electrode sheets of the paper-like cell are electrically connected to terminals of the flexible substrate by means of a film-like connecting member. This compact card-like electronic equipment such as a calculator is thin and compact in size.

Compact electronic equipment

In an intelligent card, a keyboard has numeric keys for entering identification information and a collation execution key. A solar cell, a display device and an IC chip for performing arithmetic operations and card identification are incorporated in a case. The IC chip includes a nonvolatile memory for storing predetermined identification information. The predetermined identification information is compared with the input identification information entered at the keyboard upon operation of the key, thereby performing card identification.

Intelligent card

An IC card comprises a core member having an integrated circuit pellet storing portion made of an insulating material and defined by an opening of a predetermined shape, a plurality of conductive metal foils each having one end at which integrated circuit pellet connecting portions are formed and another end at which flexible connecting terminal portions are formed, an insulating base for bearing at least the connecting terminal portions of the plurality of conductive metal foils, and an integrated circuit pellet having a memory portion and a plurality of electrode terminals which read out, to the exterior of the pellet, memory content pre-stored in the memory portion and stored in the integrated circuit pellet storing portion of the core member, the plurality of electrode terminals being bonded on the flexible integrated circuit pellet connecting portions of the plurality of conductive metal foils.

An IC card is disclosed, which comprises an IC pellet electrically connected to lead patterns via an anisotropically conductive adhesive layer. The IC pellet is also bonded to a print layer formed on an insulating film. A base sheet and another insulating film are laminated on the insulating film with the IC pellet sealed by resin in an IC pellet accommodation space formed in the base sheet.

Electronic memory card

An IC module including an integrated circuit chip and external connecting terminals connecting with the leads of the IC chip is accommodated in a cavity of a center sheet. First and second laminated structures, each of which is made of a plurality of sheets, are bonded to one and the other side surfaces of the center sheet. Each one of the first and second laminated structures has the same number of sheets and the same number of adhesive layers. Therefore, contraction and drawing forces produced by a change of environment and applied to the center sheet is counterbalanced, and warpage of the memory card is prevented.

Memory card

In an IC card, contact pads 7A and wiring patterns 7B are formed on a sheet-like structure and contact segments 7-1 to 7-8 are formed on the contact pads 7A. Main chip 5 and sub-chip 6 are mounted on the sheet-like structure. A sheet film is laminated on the sheet-like structure and the contact segments are fitted in openings of the sheet film. The sheet film has a thickness substantially equal to that of the contact segments.

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Tokyo, Japan

Kazuya Hara