Sumitomo Special Metals Co., Ltd.

Kazutoyo Shimizu

Naoyuki Okamoto

Makoto Fukuda

The present invention provides a method for using a rubber product or a rubber member in which at least one portion of the surface of the rubber product or the rubber member to be used in clean environments is allowed to swell by using a solvent, and then used. After at least one portion of the surface of the rubber product or the rubber member has been subjected to swelling by the solvent, it is used to handle electronic parts or the elements thereof; thus, a manufacturing method for electronic parts for manufacturing the electronic parts in clean environments is provided.

Method for using rubber product or rubber member

A method for cutting a ceramic base plate with which the process efficiency is improved, a stable cutting resistance can be maintained during the cutting process, and excellent process precision can be achieved, a wherein supporting plate which is used for the cutting of the ceramic base plate has a structure of a sealed surface layer which has been impregnated with glass components into both surfaces of the sintered porous alumina body. The supporting plate is fixed on a stage of a cutting machine along a forward direction of the rotary cutting blade through a vacuum-absorption and the ceramic base plate as a work-piece is wax-bonded to the supporting plate. While rotating the rotary cutting blade, first of all, the supporting plate is cut so that the blade is dressed/sharpened with the sintered porous alumina body. In the next step, the ceramic base plate is cut and the cutting whetstone blade cuts the supporting plate to a certain depth, so that the rotary cutting blade will contact to the ceramic base plate, then sintered porous alumina body of the supporting plate. As a result, the dressing/sharpening the blade can always be performed, and at the same time the ceramic base plate can be cut while keeping the cutting resistance at low level.

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Osaka, Japan

Kazutoyo Shimizu