Shin-etsu Chemical Co., Ltd.

Other

Mitsubishi Denki Kabushiki Kaisha

Nichia Corporation

Hokko Chemical Industry Co., Ltd.

Shin-etsu Chemical Ltd., Co.

Kazutoshi Tomiyoshi

Toshio Shiobara

Takayuki Aoki

Eiichi Asano

Shoichi Osada

Hisashi Shimizu

Shigeki Ino

Koji Futatsumori

Kunio Itoh

Yusuke Taguchi

Kazuhiro Arai

Takashi Tsuchiya

Takaaki Fukumoto

Noriaki Higuchi

Tomoyoshi Tada

Manabu Narumi

Satoshi Okuse

Masayuki Umeno

Hiroyuki Takenaka

Shingo Ando

Hatsuji Shiraishi

Tarou Shimoda

Tatsuya Ishizaki

Kenji Ohashi

Masaki Hayashi

Yasuo Tarumi

Hiromasa Yamaguchi

Miyuki Wakao

Masachika Yoshino

Junichi Sawada

Koji Tsuchiya

Kenji Hagiwara

Yoshio Fujimura

Yasuo Kimura

Tadaharu Ikeda

Kenichi Totsuka

Sumiko Komiya

Hatuji Shiraishi

Manabu Marumi

Hironori Sakamoto

Koki Oitori

Masato Kanari

Yuji Kishigami

A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflective material; (D) an inorganic filler; and (E) a curing catalyst. The internal mold release agent of component (B) comprises a carboxylate ester represented by:R&#x2014;COO&#x2014;R&#x2003;&#x2003;(1)wherein Rand Rare CHand n is 1 to 30 and a compound represented by: wherein R, R, and Rare selected from H, &#x2014;OH, &#x2014;OR, and &#x2014;OCOCHwith the proviso that at least one includes &#x2014;OCOCH; R is CH(wherein n is an integer of 1 to 30), a is 10 to 30, and b is 17 to 61.

Thermosetting epoxy resin composition and semiconductor device

The present invention provides a silicone resin composition for an optical semiconductor device, comprising 

Silicone resin composition for optical semiconductor devices

A silicone resin composition comprising (A) a heat-curable organopolysiloxane having a melting point of 40-130&#xb0; C., (B) a white pigment, (C) an inorganic filler, and (D) a curing catalyst is transfer or compression moldable at elevated temperatures into a cured product having white color, heat resistance, light resistance and minimal yellowing. The cured product is suited as a case in which an optoelectronic part is enclosed.

White heat-curable silicone resin composition, optoelectronic part case, and molding method

A white thermosetting silicone resin composition for molding an optical semiconductor case and a case for an optical semiconductor such as LED are provided. The composition comprises (A) a thermosetting organopolysiloxane, (B) a white pigment, (C) an inorganic filler (excluding the white pigment), (D) a condensation catalyst, and (E) a coupling agent represented by the following formula: RSi(OR)wherein Rrepresents an organic group containing a mercapto group, a glycidyl group, or an amino group, Rrepresents a Corganic group, d represents 1 or 2, and e represents 2 or 3; wherein content of the white pigment (B) is 1 to 50% by weight in the entire composition, and total content of the white pigment (B) and the inorganic filler (C) is 70 to 93% by weight in the entire composition. When cured, it has excellent whiteness, consistency, and resistance to heat, light, yellowing, and warping.

White thermosetting silicone resin composition for molding an optical semiconductor case and optical semiconductor case

A semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, and (D) carbon black is prepared by mixing a carbon black feedstock and the curing agent with an organic solvent, filtering off coarse particles of carbon black which remain over a mesh sheet with an opening of 20 &#x3bc;m, removing the solvent from the filtrate to yield a premix of curing agent and carbon black, and kneading the premix with the remaining components.

Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device

A flame retardant epoxy resin composition for semiconductor encapsulation includes as essential components, (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a phosphazene compound of the average compositional formula (1) having a melting point of 110&#x2013;130&#xb0; C., wherein a, b and n are numbers satisfying 0&#x3c;a&#x2266;0.05n, 1.90n&#x2266;b&#x3c;2n, 2a+b=2n, and 3&#x2266;n&#x2266;6, the composition being substantially free of bromides and antimony compounds.

Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device

A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

Semiconductor encapsulating epoxy resin composition and semiconductor device

A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.

An epoxy resin composition comprising an epoxy resin, a phenolic resin curing agent, an inorganic filler, zinc molybdate on an inorganic support, and a complementary combination of two phosphazene compounds is effectively moldable, flame retardant and suitable for semiconductor encapsulation. A semiconductor device encapsulated with the cured epoxy resin composition is improved in flame retardance and moisture-proof reliability.

Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.

In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m /g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.

Epoxy resin compositions and premolded semiconductor packages

Semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a phenolic resin curing agent, a fire retardant comprising zinc molybdate carried on spherical silica having a mean particle diameter of 0.2-20 &mgr;m and a specific surface of 1-20 m /g, and an inorganic filler are able to provide cured products having excellent fire retardance. The compositions have good flow and curing properties and excellent reliability and do not pose a hazard to human health or the environment.

Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith

An epoxy resin composition comprising (A) a biphenyl skeleton epoxy resin, (B) a biphenyl skeleton phenolic resin as a curing agent, (C) molybdenum compound, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.

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Annaka, Japan

Kazutoshi Tomiyoshi