Renesas Technology Corp.

Hitachi Tohbu Semiconductor, Ltd.

Renesas Eastern Japan Semiconductor, Inc.

Kazutoshi Takashima

Yoshihiko Kobayashi

Tsutomu Ida

Susumu Takada

Akio Ishizu

Norinaga Arai

Shiro Oba

Shigeru Haga

Iwamichi Koujiro

Yuji Kakegawa

Tomoo Matsuzawa

Koji Shida

Kenji Hanada

Masaki Nakanishi

A sensor chip and a lens mount accommodating therein the sensor chip are mounted on a surface of a wiring substrate and a lens holder accommodating a lens therein is coupled with the lens mount. On a rear surface of the wiring substrate, a logic chip, a memory chip and a passive component are mounted and they are sealed with a seal resin. An electrode pad of the sensor chip is electrically connected to an electrode on the surface of the wiring substrate via a bonding wire but a stud bump is also formed on the electrode at the surface of the wiring substrate and this stud bump is connected with the bonding wire. On the surface of the wiring substrate, a flexible substrate is bonded with an anisotropic conductive film and a bonding material. When a camera module is to be manufactured, the surface side of the wiring substrate is assembled after the rear surface side of the wiring substrate is assembled.

Manufacturing method of solid-state image sensing device

A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts () and semiconductor pellets () onto each of wiring substrates () formed on a matrix substrate () after inspection. A defect mark () is affixed to a wiring substrate () as a block judged to be defective in the inspection of the matrix substrate (), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate () with the defect mark () thereon is omitted to attain the rationalization of a manufacturing line.

Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device

Semiconductor device fabrication method and semiconductor device fabrication apparatus

Growing community of inventors

Miyota, Japan

Kazutoshi Takashima