Fujitsu Corporation

Fujitsu Semiconductor Limited

Kazutoshi Ohta

Tsutomu Horie

Kenji Hashimoto

An electro-static discharge protection circuit includes: a PNPN junction, a P-type side of the PNPN junction being coupled to a terminal, an N-type side of the PNPN junction being coupled to ground; and a P-type metal oxide semiconductor transistor, a source and a gate of the P-type metal oxide semiconductor transistor being coupled to an N-type side of a PN junction whose P-type side coupled to the ground, and a drain of the P-type metal oxide semiconductor transistor being coupled to the terminal.

Electro-static discharge protection circuit and semiconductor device

An inspection device for photomasks and products fabricated using the same, capable of reducing the time from inspection to repair. A reference data generator generates reference data that is based on design data and includes sensitivity class codes that differentiate designated pattern functions such as signal lines and power supply lines by means of inspection sensitivity. Then an inspection sensitivity setter allocates the desired inspection sensitivity for each sensitivity class code. An image acquiring unit photographs a subject of inspection (e.g., photomask or wafer), and a comparator detects a defect by comparing the photographed image with the reference data. When a defect is found, a reference data extractor extracts the region of the reference data that corresponds to the defect location. A defect registration determinator refers to the sensitivity class codes for the region and determines whether to register the defect. This reduces the number of defects that are registered.

Device and method for inspecting photomasks and products fabricated using the same

A positional accuracy measurement pattern is formed such that the position of an edge portion required to have high positional accuracy in a device pattern and the position of the pattern center of the positional accuracy measurement pattern are arranged on the same straight line in accordance with a direction in which the high positional accuracy is necessary. On the basis of the pattern center of the positional accuracy measurement pattern and the difference between the measurement value and the design value of the pattern dimension, the positional accuracy (the difference between the measurement value and the design value) of an edge portion of the device pattern is calculated.

Reticle, and pattern positional accuracy measurement device and method

Pattern data of a designed circuit, including a plurality of feature data is verified according to given rules (S ). If feature data not meeting the rules exists, contents of the feature data are outputted as an error (S ), and if a designer considers the error is not problematic (false error) in view of characteristics of the circuit (S ), he inputs the error information indicating the error is false to add it to a file including the pattern data (S ). The file is read to perform processing on feature data to obtain exposure data for manufacturing a mask, and the feature data processed is verified according to given rules. If any feature data not meeting the rule exists, it is judged whether the contents of the feature data are included in the error information. If it is judged to be included, further judged whether the error is false. If false, the process is continued to repeat for the rest data.

Method and apparatus for verifying mask pattern data according to given rules

Each layer of a display device is divided into many shot areas. Suspected division area is then set so that corresponding areas for all of the layers are included in it. All of the layers are then divided at one time along the suspected division area. Finally, a portion in the suspected division area that is not included in shot area of any layer is provided with a light-resistant coating.

Layout designing method of a display device

A method and an apparatus for projecting and exposing a photomask pattern of a master mask onto a plurality of re-exposing substrates using first and second pluralities of positioning markers, marked on the master mask and a standard marker substrate, respectively, and a condensing optical system for optically aligning the mounting positions of the master mask and the re-exposing substrate and exposing the photomask pattern onto the re-exposing substrate, where the master mask and the re-exposing substrate are placed at the conjugate points of the condensing optical system. In an embodiment in which the focus length of the condensing optical system is long, the standard marker substrate is fixed in close proximity to the re-exposing substrate on the optical axis of the condensing optical system to produce a shadow image of the second positioning markers on the re-exposing substrate. In a second embodiment, in which the focus length of the condensing optical system may be long or short, the condensing optical system is separated into two condensing optical parts which are optically connected in series at a optically relaying node, and the standard marker substrate is positioned at the optically relaying node.

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Kawasaki, Japan

Kazutoshi Ohta