Sanyo Electric Co., Ltd.

Kazutoshi Motegi

Sadamichi Takakusaki

Motoichi Nezu

Masahiko Mizutani

Mitsuru Noguchi

In preferred embodiments, a method of manufacturing a hybrid integrated circuit device is provided, in which a plurality of circuit substratesare manufactured from a single metal substrateA' by dicing. In some embodiments, the method includes: preparing a metal substrateA&#x2032; having an insulating layerformed on the top surface thereof; forming a plurality of conductive patternson the top surface of insulating layer; forming groovesin lattice form on the rear surface of metal substrateB&#x2032;; mounting hybrid integrated circuits onto conductive patterns; and separating individual circuit substrateswith, for example, a rotatable cutter.

Methods for manufacturing a hybrid integrated circuit device

In preferred embodiments, a compact a hybrid integrated circuit devicecan be provided. A conductive patternis formed on the top surface of a circuit substrate, on the top surface of which an insulating layerhas been provided. Conductive patternis formed over the entirety of the top surface of the circuit substrate. Specifically, conductive patternis also formed at parts withinmm from the peripheral ends of circuit substrate. Also, a heat sinkA or other circuit elementwith some height can be positioned near a peripheral end part of circuit substrate. By arranging hybrid integrated circuit device, the degree of integration of hybrid integrated circuit is improved. Thus, in a case where the same circuit as a prior-art example is formed, the size of the entire hybrid integrated circuit device can be made small.

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Ota, Japan

Kazutoshi Motegi