Fujikura Limited

Fujikura Kasei Co., Ltd.

Goo Chemical Company, Ltd.

Fujikura Co., Ltd.

Kazutoshi Koshimizu

Shinsuke Aoshima

Katsutomo Wakabayashi

Yuka Azakami

Akinori Naruse

Yusuke Iguchi

Shigeo Ota

Yuji Abe

A method for manufacturing a wiring board includes: disposing a first resist material on a substrate; forming a first resist layer by curing the first resist material; forming a resin layer on a release film; forming a conductor portion on the resin layer; covering the conductor portion by disposing a second resist material on the resin layer; forming a second resist layer by curing the second resist material; bringing the first resist layer into contact with the second resist layer, and thereafter bonding the first resist layer and the second resist layer by thermocompression bonding; and releasing the release film from the resin layer.

Method for manufacturing wiring board, wiring board, method for manufacturing molded object, molded object

An electroconductive paste according to the present invention contains a binder (A), a silver powder (B), crosslinked resin particles (C) having a glass transition temperature of 35&#xb0; C. or lower, and an organic solvent (D).

Electroconductive paste

A stretchable wiring board includes: a first stretchable substrate; an overcoat layer; and a conductor layer interposed at least partly between the first stretchable substrate and the overcoat layer. The conductor layer includes a wiring portion covered with the overcoat layer and a connection portion that has a surface exposed from the overcoat layer. The exposed surface of the connection portion is flush with a top surface of the overcoat layer.

Stretchable wiring board and method for manufacturing stretchable wiring board

A method is provided for manufacturing a wiring board that includes a conductor part including a first line and a second line wider than the first line. The method includes: a first process of forming the first line and a boundary line corresponding to at least a portion of an outline of the second line near the first line; and a second process of forming a remaining portion of the second line.

Method for manufacturing wiring board and wiring board

A touch sensor () includes: a substrate (); a net-shaped electrode () which is provided on the substrate () and includes conductive wires () arranged in a net form; and an outer edge wire () which is provided in at least a part of an outer edge of the net-shaped electrode () and is integrally formed with the net-shaped electrode. The conductive wire () includes a large-width portion which is provided in at least one of lateral parts of a connection portion and gradually widens according to approaching the outer edge wire (), and the connection portion is a portion of the conductive wire () which is connected to the outer edge wire (). Expressions (1) and (2) are satisfied:&#x2266;100 [&#x3bc;m]&#x2003;&#x2003;(1)&#x2267;&#xbd;&#x2003;&#x2003;(2). In Expressions (1) and (2), 'A' is a width of the outer edge wire (), and 'B' is a largest width of the conductive wires () in a portion where the large-width portion () is provided.

Touch sensor and production method for same

The present invention is a membrane wiring board provided with an insulating substrate, and at least one circuit portion provided on the insulating substrate and obtained by coating a circuit layer, formed by an electrically conductive paste containing electrically conductive particles, with an insulating coating layer, wherein the circuit layer contains a resin component having a gel fraction of 90% or more.

Membrane wiring board

The present invention provides an electroconductive paste for electron beam curing that allows the formation of a circuit board having an electroconductive layer that has superior hardness and bendability as well as superior adhesion to a plastic base even if used in a high-temperature environment. The present invention is an electroconductive paste for electron beam curing comprising an electroconductive powder, a radical polymerizable composition and a plasticizer, wherein the plasticizer is incorporated at a ratio of 5 parts by mass to 20 parts by mass based on 100 parts by mass of the radical polymerizable composition.

Growing community of inventors

Sakura, Japan

Kazutoshi Koshimizu