Tokyo Electron Limited

Tokyo Electron Limi Ted

Kazutoshi Ishimaru

Masataka Matsunaga

Takahiro Masunaga

Takashi Koga

Masaaki Umitsuki

Fumio Sakata

Yuichi Douki

Jun Ookura

Akihiro Teramoto

Tokutarou Hayashi

Yasuharu Iwashita

Kazuhiko Ito

Michio Kinoshita

Hidekazu Kiyama

Shingo Katsuki

Hiroki Harada

Masahiro Abe

Yasutaka Soma

Takehiro Kadokura

Tooru Tokimatu

Takashige Suematsu

Shogo Hara

A substrate processing apparatus includes a transfer device configured to transfer at least one substrate as a processing target; a transfer controller configured to control the transfer device to perform a normal transfer of transferring the substrate and a high-accuracy transfer of transferring the substrate with higher positioning accuracy as compared to the normal transfer; a warm-up controller configured to control the transfer device to perform a warm-up operation, which is different from the normal transfer and the high-accuracy transfer, when necessary; and a necessity determination unit configured to make a determination that the warm-up operation is required as a beginning of the high-accuracy transfer is approaching when a duration of a stop state of the transfer device exceeds a preset reference time.

Substrate processing apparatus, substrate processing method and recording medium

A device includes a substrate holding unitconfigured to hold a substrate and be movable in a transversal direction to transfer the substrate from one module to another module; a first detecting unitconfigured to detect a position of the substrate on the substrate holding unitbefore the substrate holding unittransfers the substrate into the another module after receiving the substrate from the one module; second detecting unitsandconfigured to detect a position deviation between a position of the substrate holding unit, which is located at a temporary position set to transfer the substrate into the another module, and the temporary position; and a position determining unitconfigured to determine a transfer position where the substrate is transferred into the another module based on the position of the substrate on the substrate holding unitand the position deviation.

Substrate transfer device, substrate transfer method and recording medium

A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate to a bonding apparatus, a first holding plate configured to hold the first substrate from an upper surface side, and a second holding plate disposed below the first holding plate and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate. The substrate transfer device includes a first holding part capable of holding the first substrate from the upper surface side, and a second holding part disposed below the first holding part and capable of holding the second substrate from the lower surface side. The first holding part and the second holding part are configured to receive and hold the first substrate and the second substrate at the same time from the first holding plate and the second holding plate.

Bonding system

A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.

Substrate transfer device and bonding system

A substrate processing apparatus can align a substrate with a high precision and a high speed by monitoring a mark formed on a surface of the substrate; operating an amount of misalignment between the center of the substrate and a rotation center of a substrate support member; determining a presence of the misalignment and adjusting the substrate such that the center of the substrate coincides with the rotation center of the substrate support member.

Substrate processing apparatus and method for adjusting a substrate transfer position

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Koshi, Japan

Kazutoshi Ishimaru