Showa Denko Materials Co., Ltd.

Resonac Corporation

Kazutoshi Danjoubara

Yukio Nakamura

Takeshi Saitoh

Tomio Fukuda

Minoru Kakitani

Shintaro Hashimoto

Ryohta Sasaki

Tomokazu Shimada

Shunsuke Tonouchi

In the method for adhering a resin film with an aggregate under an atmospheric pressure in which workability is excellent and spouting of the resin from an edge portion of the aggregate can be suppressed, the present invention provides a method for producing an FRP precursor with excellent resin filling property into bulk voids of the aggregate as well as a method for producing an FRP. Specifically, provided is the method for producing the FRP precursor by adhering a thermosetting resin film to one surface of an aggregate that is in a form of a sheet under an atmospheric pressure, wherein the method includes a process in which the thermosetting resin film and the aggregate are press-adhered by heating by means of a pressure roll having a temperature in a range of +5&#xb0; C. to +35&#xb0; C. relative to a temperature at which a minimum melt viscosity of the film is exhibited.

Method for manufacturing FRP precursor and method for manufacturing FRP

A thermosetting resin composition containing: (A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2), (B) a thermoplastic elastomer, and (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.

Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module

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Tokyo, Japan

Kazutoshi Danjoubara