Ebara Corporation

Ebara Refrigeration Equipment & Systems Co., Ltd.

Kazutomo Miyazaki

Seiji Kashiwagi

Tetsuo Komai

Naoya Hanafusa

Hiroshi Ikeda

Hiromasa Miyata

Takanori Inada

Yukihiro Fukusumi

Kazumasa Hosotani

Ken Taoka

Takafumi Sekine

Motoshi Kohaku

Nobutaka Bannai

Kohei Matsumoto

Toyoji Shinohara

Keisuke Matsushima

Takeshi Eda

A sub-fab area installation apparatus capable of reducing a power consumption used in manufacturing of semiconductors is disclosed. The sub-fab area installation apparatus includes: a vacuum pump configured to evacuate a processing gas from a processing chamber of the semiconductor manufacturing equipment; a cooling unit configured to cool a first circulation liquid used in the processing chamber; a heating unit configured to heat a second circulation liquid used in the processing chamber; an abatement device configured to detoxify the processing gas discharged from the vacuum pump; and a cooling-liquid line configured to pass a cooling liquid therethrough. The cooling liquid is supplied from a cooling source. The cooling-liquid line includes: a first downstream line, a second downstream line, and a third downstream line configured to supply the cooling liquid that has passed through the abatement device, the vacuum pump, and the cooling unit to the heating unit.

Subfab area installation apparatus

A sub-fab area installation apparatus includes: a vacuum pump configured to evacuate a processing gas from a processing chamber of the semiconductor manufacturing equipment; a cooling unit configured to cool a first circulation liquid used in the processing chamber; a heating unit configured to heat a second circulation liquid used in the processing chamber; and a cooling-liquid line configured to pass a cooling liquid therethrough. The cooling liquid is supplied from a cooling source. The cooling-liquid line includes: a distribution line configured to supply the cooling liquid to the vacuum pump and the cooling unit; and a merging return line configured to merge the cooling liquid that has passed through the vacuum pump and the cooling unit and return the cooling liquid to the cooling source.

There is provided an exhaust gas processing apparatus configured to cause a processing gas to be exposed to or come into contact with a liquid and thereby detoxify the processing gas. The exhaust gas processing apparatus comprises a suction casing provided with an inlet which the processing gas is sucked into and with an outlet which the processing gas is flowed out from; a liquid tank configured to receive an outlet-side part of the suction casing and store the liquid therein; and one or multiple spray nozzles placed in the liquid tank. The outlet of the suction casing is arranged to be located above a liquid surface of the liquid stored in the liquid tank. The one or multiple spray nozzles are configured to spray the liquid from around the outlet of the suction casing to a peripheral part of the outlet.

Exhaust gas processing apparatus

A process gas suction structure for preventing a generation of products from a process gas due to a temperature drop is disclosed. The process gas suction structure includes a double tube structure, and a heating device configured to heat the double tube structure. The double tube structure includes a process-gas flow passage portion where the process gas flows, and a partition portion arranged outside of the process-gas flow passage portion.

Process gas suction structure and exhaust gas treatment apparatus

A wet abatement system which can suppress the accumulation of foreign matters in a treatment gas line is proposed. There is provided a wet abatement system for detoxifying treatment gas by bringing the treatment gas into contact with liquid. The wet abatement system includes an inlet casing having an inlet port from which the treatment gas is let in and an outlet port provided below the inlet port and through which the treatment gas flows, and a liquid film forming device provided between the inlet port and the outlet port and configured to form a liquid film on an inner wall surface of the inlet casing. A heater configured to heat the inlet casing is embedded in an interior of a wall portion of the inlet casing, the wall portion constituting a portion situated above the liquid film forming device.

Wet abatement system

An exhaust system capable of diluting a hydrogen gas to a concentration below the lower explosive limit without requiring a large amount of dilution gas while preventing an increase in a pressure of an exhaust gas in a buffer tank is disclosed. The exhaust system performs, when a main valve disposed in an exhaust line is closed, an initial exhaust operation in which a gas heavier than the hydrogen gas is discharged from a lower part of a buffer tank while an inlet valve disposed in an inlet line and a first outlet valve disposed in an outlet line are opened to introduce the exhaust gas from an equipment in a tangential direction of a buffer tank. Next, the exhaust system performs a hydrogen-gas discharge operation in which the inlet valve and the first outlet valve are closed, and the a bypass valve disposed in a bypass line and the second outlet valve disposed in a hydrogen-gas discharge line are opened to discharge the hydrogen gas stayed in an upper part of the buffer tank while flowing the exhaust gas into a bypass line.

Exhaust system and exhaust method

A burner head that constitutes a combustion chamber for an exhaust gas processing apparatus by being attached to an upper portion of a combustion chamber main body is provided. The burner head includes a chassis which has a cylindrical portion having a lower opening and in which a fastening module for removably fastening to the combustion chamber main body is provided, a fuel nozzle that blows fuel into the cylindrical portion, a combustion supporting gas nozzle that blows combustion supporting gas into the cylindrical portion, a processing gas nozzle that blows processing gas into the cylindrical portion, and a pilot burner that ignites the fuel and/or the combustion supporting gas.

Burner head for exhaust gas processing apparatus, manufacturing method of the same, combustion chamber for exhaust gas processing apparatus, and manufacturing method and maintenance method of the same

An exhaust gas treatment apparatus for treating an exhaust gas discharged from an EUV (Extreme Ultra Violet) exposure equipment by combustion treatment to make the exhaust gas harmless is disclosed. The exhaust gas treatment apparatus includes a cylindrical combustion chamber configured to combust a processing gas containing hydrogen, and a processing gas nozzle and an oxidizing gas nozzle provided on the combustion chamber and configured to blow the processing gas and an oxidizing gas, respectively, in a tangential direction to an inner circumferential surface of the combustion chamber, wherein the processing gas nozzle and the oxidizing gas nozzle are positioned in the same plane perpendicular to an axis of the combustion chamber.

Exhaust gas treatment apparatus

A hybrid stepping motor has a connector housing formed integrally with an insulator having an upper insulator and a lower insulator. The hybrid stepping motor includes a stator core and output terminals concentrically disposed outside the stator core. A wiring pattern serving as the output terminals has connector pins and land portions disposed eccentrically with respect to one another. The land portions are formed on an outer edge side of the wiring pattern. A surface, which is an uppermost surface of the wiring pattern, is located below a lowermost surface, in which jumper wires and lead wires pass, of the lower insulator. The lead wires are pulled out from a lower side, and are pulled out to guiding grooves.

A powder discharge system is installed in a circulating water tank for collecting powder generated when an exhaust gas is treated in an exhaust gas treatment apparatus. The powder discharge system includes at least one eductor provided in the circulating water tank. The eductor has a nozzle configured to throttle a flow of water supplied from a pump for pumping water in the circulating water tank, a suction port configured to suck water in the circulating water tank into the eductor by utilizing a reduction of pressure generated when the flow of water is throttled by the nozzle, and a discharge port configured to eject the water sucked from the suction port together with the water discharged from the nozzle toward a bottom of the circulating water tank.

Growing community of inventors

Tokyo, Japan

Kazutomo Miyazaki