Fujifilm Corporation

Fuji Photo Film Company, Limited

Fujifilm Corportation

Kazuto Shimada

Tomotaka Tsuchimura

Yushi Kaneko

Toru Fujimori

Yoichi Maruyama

Kazuto Kunita

Toshihide Ezoe

Tadahiro Sorori

Hideki Takakuwa

Takahiro Goto

Kazuya Oota

Hidekazu Oohashi

Masahiro Mori

Morio Yagihara

Tetsuya Kamimura

Ippei Nakamura

Satoshi Hoshi

Ikuo Kawauchi

Kazuhiro Fujimaki

Naotsugu Muro

Takashi Sato

Kunihiko Kodama

Yoshiharu Yabuki

Toshiaki Aoai

Shinichiro Sonoda

Masaomi Makino

Shuji Hirano

Naonori Makino

Koji Wariishi

Shigeaki Nimura

Daisuke Sasaki

Masaru Yoshikawa

Yu Iwai

Atsushi Sugasaki

Toshifumi Inno

Yuichiro Enomoto

Yuki Hirai

Ryoji Goto

Norio Aoshima

Hiroyuki Einaga

Makoto Kubota

Hirotaka Takishita

Taeko Nakashima

Kimi Ikeda

Tomoyoshi Mitsumoto

Takuya Tsuruta

Keisuke Arimura

Kosuke Yamashita

Daisuke Arioka

Keiji Yamamoto

Yasuhito Oshima

Yuzo Nagata

Kaoru Aoyagi

Kyohei Arayama

Hirokazu Kyota

Akihiro Endo

Atsuyasu Nozaki

Satoshi Tanaka

Hiroshi Taguchi

Masatoshi Yumoto

Satoru Murayama

Kazuomi Inoue

Seongmu Bak

Toshiyuki Saie

Takahiro Okawara

Yuki Nara

Kyouhei Arayama

Gaku Kumada

Rena Mukaiyama

Koreshige Ito

Yuko Tada

Tatsuya Tanaka

Kotaro Asano

Naoki Sato

Yukio Abe

Shuichi Odagiri

There are provided a method of manufacturing a cured film, including a first exposure step of exposing a part of a photocurable film formed from a photocurable resin composition, a development step of developing the photocurable film after the exposure with a developing solution to obtain a pattern, and a second exposure step of exposing the pattern with light including light having a wavelength different from a wavelength of light used in the first exposure step, where the photocurable resin composition has a specific constitution, a photocurable resin composition that is used in the method of manufacturing the cured film, a method of manufacturing a laminate including the method of manufacturing a cured film, and a method of manufacturing an electronic device, which includes the method of manufacturing the cured film.

Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device

There is provided a manufacturing method for a thermal conductive layer, with which a thermal conductive layer having a thermal diffusivity of 3.0×10msor more is manufactured on a support by using a composition for forming a thermal conductive layer, the composition containing a resin, a filler, and a solvent and having a concentration of solid contents of less than 90% by mass, the manufacturing method including a discharge step of discharging the composition toward the support; and a solvent amount reduction step of reducing a solvent amount in the composition such that a first solvent amount reduction time taken after the composition is discharged until the concentration of solid contents in the composition reaches 90% by mass on the support is 10 seconds or more for each position on the support.

Manufacturing method for thermal conductive layer, manufacturing method for laminate, and manufacturing method for semiconductor device

The present invention relates to a thermal conductive layer that includes at least one filler, has a thermal diffusivity of 5.0&#xd7;10msor more, and has a volume resistivity of 1.0&#xd7;10&#x3a9;&#xb7;cm or more. Further, the present invention relates to a photosensitive layer to which the thermal conductive layer is applied, a photosensitive composition, a manufacturing method for a thermal conductive layer, and a laminate and a semiconductor device.

Thermal conductive layer, photosensitive layer, photosensitive composition, manufacturing method for thermal conductive layer, and laminate and semiconductor device

Provided is a coloring composition with which a film capable of allowing transmission of infrared light in a state where noise generated from visible light is small can be formed. In addition, also provided are a film, a color filter, a pattern forming method, a method for manufacturing a color filter, a solid image pickup element, and an infrared sensor in which the coloring composition is used. The coloring composition includes a coloring material that shields light in a visible range; and an infrared absorber. It is preferable that the coloring material that shields light in the visible range includes two or more chromatic colorants and that a combination of the two or more chromatic colorants forms black. Alternatively, it is preferable that the coloring material that shields light in the visible range includes an organic black colorant. It is preferable that the organic black colorant is at least one selected from the group consisting of a perylene compound and a bisbenzofuranone compound.

Coloring composition, film, color filter, pattern forming method, method for manufacturing color filter, solid image pickup element, and infrared sensor

A curable composition includes: an &#x3b1;-type oxytitanium phthalocyanine pigment; and a curable compound. A method of manufacturing a curable composition includes a step of dispersing an &#x3b1;-type oxytitanium phthalocyanine pigment and a pigment other than an oxytitanium phthalocyanine pigment in the presence of a solvent. A film, an infrared cut filter, and an infrared transmitting filter are formed using the curable composition. A pattern forming method includes: a step of forming a curable composition layer on a support using the curable composition; and a step of forming a pattern on the curable composition layer using a photolithography method or a dry etching method. The device is a solid image pickup element, an infrared sensor, or an image display device including the film.

Curable composition, method of manufacturing curable composition, film, infrared cut filter, infrared transmitting filter, pattern forming method, and device

Provided are: a color filter for an image sensor in which an infrared filter having no particulate defects or the like can be laminated adjacent to an image pickup element and in which the total thickness of an image sensor can be significantly reduced; an image sensor including the color filter for an image sensor; and a method of manufacturing the color filter for an image sensor. The color filter for an image sensor includes: two or more absorbing color filters that absorb light components having different wavelength ranges; and a cholesteric reflecting layer in which a right circularly polarized light cholesteric layer having right circularly polarized light reflecting properties and a left circularly polarized light cholesteric layer having left circularly polarized light reflecting properties are laminated.

Color filter for image sensor, image sensor, and method of manufacturing color filter for image sensor

An infrared absorbing composition which is used for forming an infrared cut filter in a solid image pickup element having the infrared cut filter includes at least one infrared absorber having an absorption maximum at a wavelength of 650 nm or longer which is selected from polymethine colorants.

Infrared absorbing composition, infrared cut filter, laminate, pattern forming method, solid image pickup element

A coloring composition includes colorants and a resin, in which a ratio A/B of a minimum value A of an absorbance in a wavelength range of 400 to 830 nm to a maximum value B of an absorbance in a wavelength range of 1000 to 1300 nm is 4.5 or higher.

Coloring composition, film, color filter, pattern forming method, method of manufacturing color filter, solid image pickup element, and infrared sensor

A coloring composition includes colorants, polymerizable compounds, and a resin, in which a ratio P/M of a mass P of the colorants to a mass M of the polymerizable compounds is 0.05 to 0.35, a content of the polymerizable compounds is 25 to 65 mass % with respect to a total solid content of the coloring composition, a ratio A/B of a minimum value A of an absorbance in a wavelength range of 400 nm or longer and shorter than 580 nm to a minimum value B of an absorbance in a wavelength range of 580 nm to 770 nm is 0.3 to 3, and a ratio C/D of a minimum value C of an absorbance in a wavelength range of 400 nm to 750 nm to a maximum value D of an absorbance in a wavelength range of 850 nm to 1300 nm is 5 or higher.

A photosensitive resin composition contains a polymer compound having a constitutional unit represented by the following Formula A-1 as a constitutional unit A and at least one constitutional unit among constitutional units represented by the following Formulas B-1 to B-6 as a constitutional unit B in the main chain, and an infrared absorbing material. 

Photosensitive resin composition, lithographic printing plate precursor and method for producing lithographic printing plate

An infrared ray absorbing composition kit comprises: a composition containing a copper compound or pigment having a maximum absorption wavelength in the wavelength range of 700 nm to 1000 nm; and a composition containing a metal oxide having a maximum absorption wavelength in the wavelength range of 800 nm to 2000 nm.

Infrared ray absorbing composition or infrared ray absorbing composition kit, infrared ray cut filter using the same, method for producing the infrared ray cut filter, camera module, and method for producing the camera module

An infrared ray cutoff filter including two or more high refractive index layers with a refractive index ranging from 1.65 to 2.00 and two or more low refractive index layers with a refractive index ranging from 1.20 to 1.45. At least one layer of the two or more high refractive index layers and the two or more low refractive index layers contains a dye having a maximum absorption wavelength in a range of 600 nm to 820 nm, and the two or more low refractive index layers are a plurality of kinds of layers which have different film thickness within a range of 50 nm to 250 nm.

Infrared ray cutoff filter

The present invention provides a green coloring composition for use in a color filter, which can form a green colored film having low incident-angle dependence and improves the color-separation properties of a solid-state imaging device including the colored film; and a colored film, a color filter, and a solid-state imaging device. The green coloring composition for use in a color filter of the present invention is a green coloring composition for use in a color filter, containing a green colorant, a near-infrared absorbent, and a polymerizable compound, in which when the green coloring composition for use in a color filter is used to form a colored film having a film thickness of 0.8 &#x3bc;m, the maximum value of the transmittance at a wavelength from 400 nm to 450 nm of the colored film is 5% or less, the maximum value of the transmittance at a wavelength from 500 nm to 600 nm of the colored film is 70% or more, the minimum value of the transmittance at a wavelength from 650 nm to less than 700 nm of the colored film is 20% or less, and the minimum value of the transmittance at a wavelength from 700 nm to 900 nm of the colored film is 30% or less.

Green coloring composition for use in color filter, colored film, color filter, and solid-state imaging device

There is provided a curable resin composition which is capable of being coated so as to have a film thickness of 20 &#x3bc;m or more and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, and the infrared ray cut filter having a dye-containing layer having a film thickness of 20 &#x3bc;m or more formed from the curable resin composition, and a production method of image sensor chip comprising a step of coating the curable resin composition on a glass substrate to form a dye-containing layer, and a step of adhering the glass plate having the dye-containing layer formed on a solid-state imaging device substrate.

Curable resin composition, production method of image sensor chip using the same, and image sensor chip

A curable resin composition, for forming a first optical member of an optical member set, the optical member having the first optical member and a second optical member covered with the first optical member, the first optical member being formed by curing a siloxane resin, comprising: a siloxane resin, a surfactant, and a solvent, the siloxane resin and the surfactant being contained in the solvent, the surfactant having a polyoxyalkylene structure, the siloxane resin being defined in 65% by mass to 100% by mass thereof having a particular polysilsesquioxane structure.

Curable resin composition containing siloxane resin having polysilsesquioxane structure, optical member set, method of producing the same, and solid state imaging device using the same

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Shizuoka, Japan

Kazuto Shimada