Other

Sumitomo Bakelite Company Limited

Kazuto Oonami

Akira Fukuizumi

Mitsuo Sugino

Junya Kusunoki

Toyosei Takahashi

Masakazu Kawata

Rie Takayama

Seiji Oohashi

A method of manufacturing a light receiving deviceincludes: providing a resin layercontaining a photo curing resin on a transparent substratewhere a plurality of transparent substrate portionsA are integrated so that the resin layer covers the transparent substrate; selectively irradiating the resin layerwith light, followed by a developing process, so that the resin layerremains in regions of the transparent substratewhich surround portions corresponding to regions facing light receiving portionsin the transparent substrate portionsA; dividing the transparent substrateinto units of transparent substrate portionsA so that a plurality of transparent substrate portionsA are obtained; dividing the base substrateinto units of base substrate portionsA so that a plurality of base substrate portionsA are obtained; and joining the base substrate portionsA and the transparent substrate portionsA via the resin layer

Method of manufacturing light receiving device

Conductive hardening resin for a semiconductor device of the present invention contains metal powder for providing electric conduction between electrodes positioned on the front of a semiconductor chip and a wiring material including lead terminals via a conductive plate. The resin has a modulus of elasticity of 2.0&times;10 Pa or below when hardened. The resin prevents the contact resistance of the metal plate, lead terminals and semiconductor chip from increasing in the event of temperature cycling tests and a pressure cooker tests. Further, the resin frees the metal plate and chip from peel-off and corrosion, respectively.

Conductive hardening resin for a semiconductor device and semiconductor device using the same

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Tokyo, Japan

Kazuto Oonami