Sumitomo Osaka Cement Co., Ltd.

Fujifilm Corporation

Kazuto Ando

Yoshiaki Moriya

Shintaro Hayashi

Masayuki Ishizuka

Mamoru Kosakai

Kentaro Takahashi

Mitsuhiro Moriya

Shinichi Maeta

Yuhki Kinpara

Hironori Kugimoto

Kazunori Ishimura

Hitoshi Kouno

Keigo Maki

Yuuki Kinpara

Hirokuni Kugimoto

An electrostatic chuck device comprising: a placing table having a placing surface on which a plate-shaped sample is placed, an electrostatic attraction electrode, which is located on a lower side of the placing table in such a manner that the electrode is located on a surface side opposite to the placing surface of the placing table, a base part on which at least the placing table and the electrostatic attraction electrode are mounted, a focus ring which surrounds the placing table wherein the focus ring is a continuous ring or is divided into two or more portions, and a lift pin which is movable in an up-down direction and raises the entirety of or at least a part of the focus ring from the base part.

Electrostatic chuck device having focus ring

An electrostatic chuck part of an electrostatic chuck device has an electrostatic chuck part inner peripheral surface surrounding an opening of a chuck part through-hole, and an electrostatic chuck part outer peripheral surface surrounding the electrostatic chuck part inner peripheral surface. An insulator has an insulator main body in which an insulator through-hole having an opening on the electrostatic chuck part side is formed, an insulator inner end face, and an insulator outer end face which faces the electrostatic chuck part outer peripheral surface. The insulator inner end face and the electrostatic chuck part inner peripheral surface are in contact with each other, or an adhesion layer or a plasma-resistant adhesive layer extends in a gap between the insulator inner end face and the electrostatic chuck part inner peripheral surface. The plasma-resistant adhesive layer is formed between the electrostatic chuck part outer peripheral surface and the insulator outer end face.

Electrostatic chuck device, and semiconductor manufacturing device

Provided is an electrostatic chuck device in which the attachment of particles to the rear surface of a plate-like specimen can be further suppressed by suppressing the generation source of the particles and, furthermore, an effect of cooling the plate-like specimen using a cooling gas can be improved. The electrostatic chuck device is formed by including an electrostatic chuck portion in which an upper surface () of a ceramic plate-like body () is used as a placement surface on which a wafer is placed and an electrostatic adsorption electrode is provided inside the ceramic plate-like body () or on the rear surface thereof, multiple protrusions () are formed on the upper surface (), and multiple fine protrusions () are formed in regions () excluding the multiple protrusions () in the upper surface ().

Electrostatic chuck device with multiple fine protrusions or multiple fine recesses

Provided is a ceramic member in which the difference in thermal expansion coefficient between an insulating ceramic material and an electrically conductive ceramic material is extremely small and therefore any mismatch caused in association with this difference in thermal expansion coefficient does not occur, and which does not undergo any failure such as breakage, cracking, detachment or destruction. The ceramic member () includes an electrically conductive ceramic material () which contains yttrium oxide as the main component and additionally contains a fibrous electrically conductive substance such as carbon nanotubes in an amount of 0.1 to 3 vol % inclusive and an insulation ceramic material () which contains yttrium oxide as the main component, wherein the electrically conductive ceramic material () and the insulation ceramic material () are adhered to each other in an integrated manner through an adhesive layer () which includes an inorganic adhesive material.

Ceramic member

Provided is a sintered object which has excellent resistance to corrosion by corrosive halogen gases and by the plasmas thereof and has excellent thermal conductivity and excellent electrical conductivity. The sintered object has few limitations on design, is usable in a wide range of applications, and is highly versatile. The sintered object has no frequency dependence when a high-frequency voltage is applied thereto and with which it is possible to actualize the stability of a plasma. Also provided is a method for producing the sintered object. Furthermore provided is a high-frequency transmission material which has direct-current electrical conductivity for reducing fluctuations in plasma potential and has capacitive properties that enable the material to transmit high-frequency power necessary for plasma excitation, and which has no fear of causing contamination of a sample with a metal and has resistance to corrosion by plasmas.

Sintered objects and processes for producing same

The present invention relates to an electrostatic chuck comprising a specific composite oxide sintered body, wherein in the sintered body, an L* value of a reflected color tone measured by a C light source on a 2&#xb0; angle visual field condition is 10 or more and 50 or less in a CIEL*a*b* color system prescribed in JIS Z 8729-1994 and an electrostatic chuck device comprising an electrostatic chuck member (A) having a tabular body provided with a clamping surface for clamping a sample by the electrostatic force, an internal electrode layer for clamping a sample by electrostatic force which is provided on the back face of the tabular body and an insulation layer, wherein at least the sample clamping surface of the tabular body in the electrostatic chuck member (A) comprises the composite oxide sintered body constituting the electrostatic chuck described above.

Electrostatic chuck, production method of electrostatic chuck and electrostatic chuck device

A lens-fitted photo film unit includes an electronic flash unit. A flash readiness indicator is secured to a housing, for illuminating to signal readiness of the flash unit upon charging. An attention information indicator having optical transmittance is secured to an end portion of the flash readiness indicator removably to protrude from the housing, for illuminating in response to illumination of the flash readiness indicator visibly from an object side. Also, the flash unit includes a flash light source for applying flash light to a photographic field. A flash circuit controls the flash light source. A signaling light-emitting element emits light in response to completion of charging of the flash circuit. The flash readiness indicator comprises a light conducting optical element for conducting the light from the signaling light-emitting element to an outside of the housing.

Growing community of inventors

Tokyo, Japan

Kazuto Ando