Mitsubishi Denki Kabushiki Kaisha

Renesas Technology Corp.

Renesas Electronics Corporation

Other

Mitsubushi Denki Kabushiki Kaisha

Reneses Technology Corp.

Kazutami Arimoto

Masaki Tsukude

Hiroki Shimano

Yoshio Matsuda

Kiyohiro Furutani

Kazuyasu Fujishima

Shigeki Tomishima

Tsukasa Ooishi

Koichiro Mashiko

Hideto Hidaka

Takeshi Fujino

Mikio Asakura

Fukashi Morishita

Takahiro Tsuruda

Noriaki Matsumoto

Tadato Yamagata

Katsumi Dosaka

Mitsuya Kinoshita

Tetsushi Tanizaki

Hideyuki Noda

Shigehiro Kuge

Mako Kobayashi

Teruhiko Amano

Tadaaki Yamauchi

Takeshi Hashizume

Masanori Hayashikoshi

Toshinori Morihara

Akira Yamazaki

Tadashi Nishimura

Hiroshi Miyamoto

Hiroshi Kimura

Michihiro Yamada

Shinji Kawai

Kazunori Saito

Hiroki Sugano

Koji Nii

Makoto Yabuuchi

Shigeru Mori

Naoya Watanabe

Kenichi Yasuda

Yoshikazu Morooka

Kazunari Inoue

Katsuhiro Suma

Isamu Hayashi

Toshifumi Kobayashi

Yasuhiro Ishizuka

Hidehiro Fujiwara

Narumi Sakashita

Kazunori Saitoh

Seizou Furubeppu

Tsukasa Oishi

Tsukasa Ohishi

An ePLX unit includes a logic unit having an SRAM and a MUX, and a switch unit having an SRAM and a TG for establishing wiring connection in the logic unit. When a composite module is set in the first mode, an Add/Flag control unit uses the SRAMs as a data field and a flag field, respectively, to autonomously control the read address of each of the data field and the flag field in accordance with a control flag stored in the flag field. Furthermore, when the composite module is set in the second mode, the Add/Flag control unit writes configuration information into each of the SRAMs to reconfigure a logic circuit. Consequently, the granularity of the circuit configuration can be rendered variable, which allows improvement in flexibility when configuring a function.

Semiconductor programmable device

By using a fact that a bit error in an on-chip embedded memory occurs at a random address, means for creating a chip-unique ID and utilizing this ID are provided. A controller having received a verification request from outside instructs a variable power supply circuit to decrease a voltage supplied to a memory to be lower than that at the normal operation time. When the voltage supplied to the memory is stabilized, the controller requests a memory test to a memory BIST. By using an address where an error occurs due to a result of the memory test, the controller creates the chip-unique ID and uses the ID as a response to the verification request.

Semiconductor device

A pair of operator cells each having a series-coupled circuit of first and second transistors is used as a storage unit. To-be-retrieved data and retrieval data are respectively stored in the first and second transistors, and mutually complementary data items are stored in the operator cells of the storage unit. The operator cells supply currents according to the result of an AND operation between the stored data items to corresponding bit lines, and the read data from the storage unit corresponds to the result of an EXOR operation between the retrieval data and the to-be-retrieved data. The currents flowing in the corresponding bit lines are amplified with sense amplifier circuits to drive local match lines. In the individual sub-blocks of an operator cell array, data items having different pattern lengths can be stored. The potentials of the local match lines are selected according to the data pattern lengths, and match retrieval is performed for the data items having the different pattern lengths.

Semiconductor signal processing apparatus

A unit operator cell includes a plurality of SOI (Silicon on Insulator) transistors, write data is stored in a body region of at least two SOI transistors, and the storage SOI transistors are connected in series with each other to a read port or each of the storage SOI transistors is singly connected to the read port. Therefore, an AND operation result or a NOT operation result of data stored in the unit operator cells can be obtained, and operation processing can be performed only by writing and reading data. A semiconductor signal processing device that can perform logic operation processing and arithmetic operation processing at high speed is implemented with low power consumption and a small occupation area.

Semiconductor signal processing device

The present invention aims at providing a semiconductor memory device that can be manufactured by a MOS process and can realize a stable operation. A storage transistor has impurity diffusion regions, a channel formation region, a charge accumulation node, a gate oxide film, and a gate electrode. The gate electrode is connected to a gate line and the impurity diffusion region is connected to a source line. The storage transistor creates a state where holes are accumulated in the charge accumulation node and a state where the holes are not accumulated in the charge accumulation node to thereby store data '1' and data '0', respectively. An access transistor has impurity diffusion regions, a channel formation region, a gate oxide film, and a gate electrode. The impurity diffusion region is connected to a bit line.

Semiconductor memory device

In a content addressable memory device, before search operations in two TCAM cells connected to first and second match lines, respectively, a memory controller connects the first match line to a power source and connects the second match line to a ground, and then connects the first and second match lines to each other so as that electric potentials of the first and second match lines are the same as each other.

Content addressable memory device having match line equalizer circuit

A memory cell mat is divided into a plurality of entries, and an arithmetic logic unit is arranged corresponding to each entry. Between the entries and the corresponding arithmetic logic units, arithmetic/logic operation is executed in bit-serial and entry-parallel manner. Where parallel operation is not very effective, data is transferred in entry-serial and bit-parallel manner to a group of processors provided at a lower portion of the memory mat. In this manner, a large amount of data can be processed at high speed regardless of the contents of operation or data bit width.

Semiconductor device and semiconductor signal processing apparatus

A CAM (Content Addressable Memory) cell includes first and second data storage portions storing data, horizontal port write gates for storing data applied through a match line pair in the data storage portions in a data write through a horizontal port, and search/read gates for driving the match lines of the match line pair in accordance with the data stored in the data storage portions in a search operation and in a data read through the horizontal port. The match lines are used as horizontal bit line pair, or signal lines for accessing the horizontal port. As the first and second data storage portions are used, it becomes possible to store ternary data, and accordingly, a write mask function of inhibiting a data write at a destination of data transfer is realized. Further, as the CAM cell is used, an arithmetic/logic operation following a search process can be executed selectively, and high speed data writing/reading becomes possible.

By activating a word line and a bit line in parallel with a storage transistor set to OFF, the potential conditions of the charge line, and the word line, and the bit line are controlled so that the potential of a body region is increased by a leak current flowing from a connecting node to the body region in a period until the storage transistor is turned ON.

One memory cell is formed of a first port access transistor, a second port access transistor and a storage transistor coupled commonly to these access transistors. The first port access transistor is coupled to a first electrode of the storage transistor, and the second port access transistor is coupled to a third electrode of the storage transistor. These first and second port access transistors enter a selected state when first and second port word lines are selected, respectively, to couple corresponding second and third electrodes of the corresponding storage transistor to first and second port bit lines, respectively. A dual-port memory cell of which scalability can follow miniaturization in a process can be provided.

When data '1' is stored in a memory cell, a bit line is driven to an H level (control line drive potential) and the other bit line is driven to an L level (reference potential) when a sense operation is completed. When a verify write operation is initiated, a charge line is driven from an H level (power supply potential) to an L level (reference potential). By the GIDL current from a source line, accumulation of holes is initiated again for a storage node subsequent to discharge of holes, whereby the potential of the storage node rises towards an H level (period &#x3b1;). When the charge line is driven to an H level from an L level, the potential of the storage node further rises (period &#x3b2;).

During a stand-by state in which power supply is cut off, a high-voltage power supply control circuit isolates a global negative voltage line transmitting a negative voltage and a local negative voltage line provided corresponding to each respective sub array block from each other and isolates a global ground line and a local ground line transmitting a ground voltage from each other. These local ground line and local negative voltage line are charged to a high voltage level through a high voltage line before cut-off from the corresponding power supply. A leakage current path from a word line to the negative voltage line or the ground line is cut off, so that the word line in a non-selected state can reliably be maintained at a non-selection voltage. Thus, in a low power consumption stand-by mode, data stored in a memory cell can be held in a stable manner.

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Hyogo, Japan

Kazutami Arimoto