Canon Kabushiki Kaisha

Cannon Kabushiki Kaisha

Kazutaka Yanagita

Kiyofumi Sakaguchi

Kazuaki Ohmi

Takao Yonehara

Kazuaki Omi

Akira Fujimoto

Mitsuharu Kohda

Hirokazu Kurisu

Masakazu Harada

Fumio Uehara

Katsumi Nakagawa

Nobuhiko Sato

Shoji Nishida

Masaaki Iwane

Isamu Shigyo

Toshikazu Miyakogawa

Kazuhiro Nagasaka

In a method of manufacturing an image displaying apparatus which has plural spacers for defining a distance between substrates, the present invention enables to effectively perform a process of assembling the spacers in a less number of steps and improves accuracy of a spacer assembling position. In this method, in case of clamping plural spacers respectively by individual hands, positioning the plural spacers on the substrate in a lump, applying an adhesive to the positioned spacers, heat hardening the adhesive, and fixing the spacers to which the adhesive was applied to the substrate, pitches of the hands are adjusted according to heat expansion of the substrate in the pitch direction of the spacers occurred due to the heating of the adhesive.

Method of manufacturing image displaying apparatus

This invention is to provide a technique of separating bonded substrate stacks having porous layers at a high yield. A separating apparatus () has a pair of substrate holding portions (). A bonded substrate stack () is sandwiched from upper and lower sides and horizontally held by the substrate holding portions () and rotated. A jet is ejected from a nozzle () and injected into the porous layer of the bonded substrate stack (), thereby separating the bonded substrate stack () into two substrates at the porous layer. Another separating apparatus () has a pair of substrate holding portions (), a nozzle () of rejecting a fluid to the porous layer of a bonded substrate stack (), and an abrupt operation prevention mechanism () for preventing the lower substrate holding portion () from abruptly moving downward but allowing it to moderately move when separating the bonded substrate stack ().

Sample separating apparatus and method, and substrate manufacturing method

This invention is to improve the reproducibility and yield in separating a bonded substrate stack. A bonded substrate stack having a porous layer inside is held by substrate holding portionsandand a fluid is injected from a nozzle to the porous layer of the bonded substrate stack, thereby separating the bonded substrate stack at the porous layer. The variation in pressure of the fluid is suppressed within a predetermined range by a servo-driven pump.

Method and apparatus for separating sample

A detection apparatus for detecting a feature portion of a composite member having a structure in which a first member having a separation layer inside is brought into tight contact with a second member. The composite member has, as the feature portion, a portion at which a peripheral edge of the first member projects outside a peripheral edge of the second member. The apparatus includes a shift detection section which detects a shift between the peripheral edge of the first member and the peripheral edge of the second member along an outer periphery of the composite member and a determination section which determines the feature portion on the basis of a detection result by the shift detection section.

Method and apparatus for processing composite member

This invention is to provide a processing system suitable for manufacturing an SOI substrate. A processing system includes a scalar robot for conveying a bonded substrate stack held by a robot hand, and a centering apparatus, separating apparatus, inverting apparatus, and cleaning/drying apparatus disposed at substantially equidistant positions from a driving shaft of the scalar robot. When the robot hand is pivoted about the driving shaft in the horizontal plane and moved close to or away from the driving shaft, a bonded substrate stack or separated substrate is conveyed among the processing apparatuses.

Sample processing system

This invention is to appropriately separate a bonded substrate stack regardless of some distortion in the bonded substrate stack or the like. This separating apparatus includes a first nozzle which forms a jet with a large width and a second nozzle which forms a jet with a small width. When the outer portion of a bonded substrate stack is to be separated, a jet formed by the first nozzle is used. After that, when a portion inside the outer portion is to be separated, a jet formed by the second nozzle is used.

Method and apparatus for separating member

This invention is to guarantee that in separating a plate member such as a bonded substrate stack, a fluid is injected to an appropriate portion of the plate member. While a bonded substrate stack () is rotated, the vertical position of its peripheral portion is measured throughout its perimeter by a measuring device (). Then, while the vertical position of a nozzle () is dynamically adjusted on the basis of the measurement result, and at the same time, the bonded substrate stack () is rotated, the bonded substrate stack () is separated into two substrates at a porous layer by injecting a fluid ejected from the nozzle ().

Separating apparatus and processing method for plate member

When a bonded substrate stack prepared by bonding a first substrate in which a single-crystal Si layer is formed on a porous layer, and an insulating layer is formed on the single-crystal Si layer to a second substrate is to be separated at the porous layer, serrate defects at the peripheral portion of the separated substrates are prevented. A fluid is ejected from an ejection nozzle () and injected into the porous layer of a bonded substrate stack () while rotating the bonded substrate stack () about an axis (C) in a direction (R), thereby separating the bonded substrate stack () into two substrates at the porous layer. When the peripheral portion of the bonded substrate stack () is to be separated, the ejection nozzle () is located within a range (B).

Separating apparatus, separating method, and method of manufacturing semiconductor substrate

This invention is to provide an apparatus for separating a substrate having a porous layer at the porous layer. A bonded substrate stack () having a porous layer () is supported by substrate holding portions () while being rotated. High-speed, high-pressure water (jet) is ejected from a nozzle (), so the jet is injected into the bonded substrate stack (). The substrate holding portions () hold the bonded substrate stack () such that the bonded substrate stack () can expand at its central portion due to the pressure of the injected water. This efficiently applies a force (separation force) that acts outward from the inside of the bonded substrate stack ().

This invention is to support a plate member such as a bonded substrate stack in a horizontal state without coming into contact with one surface of the member and also to efficiently progress separation. Separation is executed while arranging a bonded substrate stack ( ) generated by bonding a seed substrate ( ) to a handle substrate ( ) such that the seed substrate ( ) remains on the lower side. At the first stage, the peripheral portion is separated while causing a first substrate support section ( ) to chuck and support the central portion of the lower surface of the bonded substrate stack ( ). Then, at the second stage, the central portion is separated while causing a second substrate support section ( ) to support the lower peripheral portion and side of the bonded substrate stack ( ).

Plate member separating apparatus and method

This invention is to appropriately separate a bonded substrate stack regardless of some distortion in the bonded substrate stack or the like. This separating apparatus includes a position adjusting mechanism ( ) for adjusting the position of a nozzle ( ) which ejects a fluid. A bonded substrate stack ( ) is separated while changing the level of the nozzle ( ) stepwise by the position adjusting mechanism ( ) in accordance with a program which is set in advance on the assumption that the bonded substrate stack ( ) has a distortion within a predetermined range.

This invention prevents defects generated when a bonded substrate stack having a separation layer is separated. A bonded substrate stack ( ) having a porous layer ( ) is separated in two steps of the first and second processes. In the first process, a jet is ejected to the porous layer ( ) while rotating the bonded substrate stack ( ) to partially separate the bonded substrate stack ( ) while leaving the central portion of the porous layer ( ) as an unseparated region. In the second process, the jet is ejected to the porous layer ( ) while rotation of the bonded substrate stack ( ) is stopped. A force is applied to the unseparated region from a predetermined direction to completely separate the bonded substrate stack ( ). Also, the first region (peripheral portion) and second region (central portion) of the bonded substrate stack ( ) having the porous layer ( ) are separated using a jet and ultrasonic wave, respectively. More specifically, the first region is separated by a jet ejected from a nozzle ( ) while rotating the bonded substrate stack ( ). On the other hand, the second region is separated by an ultrasonic wave generated by an ultrasonic vibrator ( ).

Sample processing apparatus and method

An ultrasonic bath ( ) is arranged below a wafer processing bath ( ). Wafers ( ) are processed while ultrasonic waves are transmitted from the ultrasonic bath ( ) to the wafer processing bath ( ). The wafers ( ) are processed while being entirely dipped into the wafer processing bath ( ) and rotated by wafer rotating rods ( ).

Growing community of inventors

Yokohama, Japan

Kazutaka Yanagita