Teikoku Tsushin Kogyo Co., Ltd.

Kazutaka Nakagome

Naoki Fukuda

Shinji Mizuno

Shinichi Suzuki

Kozo Morita

Takashi Shinoki

Daisuke Makino

Katsutoshi Yanoshita

Koji Mitsui

An electronic component substrate (-) includes an insulating base () and a flexible circuit board () mounted on the insulating base (). The flexible circuit board () is a synthetic resin film provided thereon with terminal patterns () and a conductor pattern () whose surface is slidingly contacted with a slider. The insulating base () is a synthetic resin molded piece. The flexible circuit board () is insert-molded to the insulating base (). The electronic component substrate (-) is produced by preparing the flexible circuit board () and first and second mold members () having a cavity (C) with a shape that corresponds to the external shape of the electronic component substrate (-). Then, the flexible circuit board () is accommodated in the cavity (C) between the first and second mold members (), and the cavity (C) is filled with a molten molding resin. After the molding resin has solidified, the first and second mold members () are removed.

Electronic parts board and method of producing the same

Growing community of inventors

Kanagawa, Japan

Kazutaka Nakagome