Onkyo Corporation

Kazutaka Murayama

Sadatoshi Hisamoto

Norio Umezu

Shuichi Hiza

Yoshitaka Handa

A heatsink arrangement attached to a semiconductor device includes: a first heatsink placed in close contact with the semiconductor device; and second heatsink placed in close contact with the first heatsink, wherein the first heatsink and the second heatsink are connected to a power supply circuit for the semiconductor device via first connector and second connector, respectively. Thus, the present invention provides a heatsink arrangement for a semiconductor device used in an electric/electronic circuit that radiates less high-frequency noise even when a large current flows through the semiconductor device and that provides a high heat-radiating efficiency.

Heatsink arrangement for semiconductor device

A pulse width modulation circuit of the present invention includes: pulse generation means being provided with a first power supply and charged with a first current and a second current between which a constant current is distributed to turn ON/OFF a switching element, thereby generating a pulse from a first output section; pulse modulation means for controlling the charging while controlling a distribution ratio between the first current and the second current based on an input signal, thereby changing a pulse width of the output pulse; and first short circuit means for shorting the first output section with the first power supply when the pulse being output from the first output section transitions to a voltage of the first power supply.

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Neyagawa, Japan

Kazutaka Murayama