Hitachi Chemical Company, Ltd.

Teijin Limited

Kazutaka Masaoka

Tetsuo Yoshida

Youji Tanaka

Yukihiko Minamihira

Noriyo Kimura

Takafumi Kudo

Takafumi Kudou

Provided are a laminate film which comprises a photosensitive layer and a first film having a 5% elongation load in the longitudinal direction of the film per unit width at 80&deg; C. of 4 to 90 g/mm and a breaking elongation in the longitudinal direction of the film per unit width of 50 to 1,000%, and processes for preparing a printed wiring board, which comprises laminating the laminate film on a substrate so that the photosensitive layer and the substrate are contacted with each other; and then subjecting a resulting material to exposure and development.

Laminate film and processes for preparing printed wiring board

A photoresist layer supporting film is (A) formed from a polymer composition comprising (i) 55 to 100% by weight of a copolyester containing ethylene terephthalate units as a main recurring unit and having a melting point of 210 to 250.degree. C. and (ii) 0 to 45% by weight of polybutylene terephthalate or a copolyester containing butylene terephthalate units as a main recurring unit and having a melting point of not lower than 180.degree. C. and (B) has a plane orientation coefficient of 0.08 to 0.16. Since this supporting film is excellent in substrate shape follow-up properties and resolution, it is suitable for the preparation of a photoresist film laminate by laminating a protective film and a photoresist layer on the surface thereof.

Photoresist layer supporting film and photoresist film laminate

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Hitachi, Japan

Kazutaka Masaoka