Omron Corporation

Kazutaka Kaneko

Koichi Takemura

Tomofusa Shibata

Masayuki Kojima

Yoshihisa Yamanaka

Kenji Suzuki

Yoshikaga Taguchi

Yuzuru Fujie

Naoki Hashimoto

Taichi Suzuki

Yoshinori Ito

A transfer molding method includes supplying melted resin to a first metallic mold, conveying the first metallic mold onto which the resin was supplied to a position opposing a second metallic mold, performing transfer molding by sandwiching the resin between the two metallic molds, and cooling the resin after performing transfer molding. The performing transfer molding includes discharging residual air that remains in a recess via a groove portion.

Metallic mold structure, transfer molding apparatus, transfer molding method, and optical member forming apparatus

A transfer molding method has a transfer molding step of performing transfer molding to a resin sheet between a first die and a second die, which are disposed while facing each other, by heating at least one of the first and second dies, and a cooling step of cooling the resin sheet. The cooling step includes a first cooling step of cooling the resin sheet while an applied pressure is maintained at a first setting value smaller than a value of an applied pressure in the transfer molding step, and a second cooling step of cooling the resin sheet while the applied pressure is reduced to a second setting value smaller than the first setting value.

Transfer molding method and transfer molding apparatus

A transfer molding method includes an insertion step of inserting a resin sheet between a first die and a second die, which are disposed opposite each other, a sandwiching step of sandwiching the resin sheet between the first and second dies while a transfer surface of a transfer member is brought into contact with at least one of surfaces of the resin sheet, and a transfer molding step of heating at least one of the first and second dies to melt at least a surface portion of the resin sheet with which the transfer surface of the transfer member is brought into contact, and exhausting residual air remaining in a recess through a groove portion connected to the recess when a thick portion is formed by the recess formed in the transfer surface.

Die structure, transfer molding apparatus, transfer molding method, optical member, area light source device, liquid crystal display device, and mobile device

Growing community of inventors

Saitama, Japan

Kazutaka Kaneko