3M Innovative Properties Company

Kazuta Saito

Katsuya Takamori

Sumita Basu Mitra

Michael L Steiner

Ryota Akiyama

John D Le

Yorinobu Takamatsu

Shinya Nakajima

Sana Fujii

An optical assembly including a first optical substrate including a first major surface; a multilayer polymeric optical film disposed on the first major surface of the first optical substrate and including a plurality of polymeric layers numbering greater than about 50 in total; and a first optical bonding layer having an average thickness of less than about 0.5 microns and disposed between, and making physical contact to, the first major surface of the first optical substrate and the multilayer polymeric optical film, the first optical bonding layer bonding the first optical substrate to the multilayer polymeric optical film and including a silanated amine.

Low wave-front error optical filter film

Methods for preparing multi-layer optical laminates include placing an optical film that is free form an adhesive layer between first and second glass substrates that are free of an adhesive layer, placing this laminate under vacuum, and then heating the laminate under pressure to a temperature above the softening temperature of the optical film. The glass substrates are free of an adhesive layer but may include a silane surface treatment. The resulting multi-layer laminate is optically clear and does not show scattering of reflected light by the optical film.

Method for preparing multi-layer optical laminates

A member peeling method includes a step for preparing a first member having a first main face and an outer edge thereof and a second member having a second main face and an outer edge thereon, a step for disposing a photothermal conversion layer on at least one portion of the outer edge on the first main face, a step for mutually joining the first main face and the second main face via an adhesive layer, a step for irradiating a laser light to the photothermal conversion layer, and a step for at least partially peeling the first member from the second member by applying a force to an outer peripheral portion of either of the first member or the second member in a direction away from the other member.

Member peeling method, member processing method, and method for manufacturing semiconductor chip

To provide a method of producing segmented chips preventing the chips from being damaged by the chip jumping or by the contact of the neighboring chips while the back surfaces thereof are being ground. A method of producing segmented chips by grinding the back surface of a material to be ground which includes a plurality of chips segmented into individual chips by at least partly cutting the chips in the direction of thickness thereof along the boundaries of the chips, wherein the gaps among the individual chips are filled with a liquid adhesive, the material to be ground is laminated on a rigid support material in a manner that the back surface thereof is exposed, and the adhesive is cured or solidified to form a laminate of the material to be ground having the plurality of chips, the adhesive solid material and the rigid support material arranged in this order; the laminate is ground from the back surface side of the material to be ground, the rigid support member is removed from the laminate, a flexible adhesive sheet is adhered onto the adhesive solid material, and the individual chips are picked up and recovered.

Method of producing segmented chips

The invention provides a two-part adhesive composition making it possible to mutually bond disk substrates within a relatively short time and to produce an optical disk, and an optical disk having a metal film, corrosion of which is restricted under a high-temperature high-humidity condition, and which is produced by using the two-part adhesive composition. A two-part adhesive composition of the invention comprises first and second parts each containing urethane acrylate having a polytetramethylene glycol skeleton and an acrylate having a hydroxyl group in its molecule, wherein the first part further contains a diacyl peroxide and the second part further contains a tertiary amine. Organic peroxide is preferably diacyl peroxide and a setting promoter is preferably a tertiary amine. Either one, or both, of the first and second parts may further contain a photo-polymerization initiator.

Adhesive composition and optical disk using the composition

A bonded optical disk comprising first and second transparent substrates bonded with a light-permeable, pressure sensitive adhesive layer and at least one information recording layer wherein the pressure sensitive adhesive layer has been formed from a pressure sensitive adhesive precursor, having a viscosity of 10 to 5000 cps and being applied onto at least one of the first substrate and the second substrate by radiation curing and has a gel fraction of not less than 50% and a storage modulus of 1.0&times;10,to 1.0&times;10,dyn/cm,at 25&deg; C., or in place of the pressure sensitive adhesive layer, an adhesive layer derived from a radiation curable adhesive precursor having a viscosity of 500 to 10000 cps, and the adhesive precursor is subjected to a higher pressure than an atmospheric pressure, prior to being irradiated, as well as a method and an apparatus for producing a bonded optical disk.

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Tokyo, Japan

Kazuta Saito