Ngk Spark Plug Company, Limited

Kazushige Obayashi

Hiroki Takeuchi

Toshifumi Kojima

Hisahito Kashima

Akifumi Tosa

Kazuhisa Itakura

Takashi Oba

The present invention provides a wiring board in which electronic components are embedded by means of an embedding resin which attains a high mounting density of the electronic components in the wiring board, which exhibits excellent electrical properties such as insulating property, which prevents random reflection of light, and which reduces non-uniformity in color of the resin during curing thereof. The present invention includes a wiring board in which electronic components are embedded by use of an embedding resin having a dielectric constant of less than or equal to about 5 and tan &#x3b4; of less than or equal to about 0.08. The embedding resin preferably contains carbon black in an amount of less than or equal to about 1.4 mass %. Moreover, the embedding resin preferably contains at least a thermosetting resin and at least one inorganic filler.

Wiring board

An embedding resin for embedding an electronic part in a wiring substrate, includes at least one of a soluble resin and a soluble organic filler as a soluble component to be dissolved with an oxidizing agent.

Embedding resin, wiring substrate using same and process for producing wiring substrate using same

An embedding resin embeds an electronic part in an object and has a dielectric constant of about 5 or less and tan &dgr; of about 0.08 or less.

Embedding resin

A wiring board includes a substrate having an opening, and an electronic part placed in the opening, wherein a space left in the opening is filled with an embedding resin having a base color tone selected from black, blue, green, red, orange, yellow, and violet.

Wiring board and method for fabricating the same

The present invention is directed to a dielectric ceramic composition exhibiting a high unloaded quality factor and a small variation thereof. The dielectric ceramic composition of the invention containing Ba, Zn, and Ta, contains 100 parts by weight of a predominant component represented by xBaO&mdash;yZnO&mdash;(&frac12;)zTa O (x, y, and z represent compositional proportions by mol and satisfy x&plus;y&plus;z&equals;1), wherein x, y, and z fall within a quadrilateral region formed by connecting points A (x&equals;0.503, y&equals;0.152, z&equals;0.345), B (x&equals;0.497, y&equals;0.158, z&equals;0.345), C (x&equals;0.503, y&equals;0.162, z&equals;0.335), and D (x&equals;0.497, y&equals;0.168, z&equals;0.335) (sides AB, BD, DC, and CA being included) as shown in FIG. ; 0.2-1.6 parts by weight K as reduced to K O; and 0.7-8 parts by weight Ta as reduced to Ta O , wherein the ratio by weight of K to Ta falls within the range of 0.185-0.4. The dielectric resonator of the present invention is formed of the dielectric ceramic composition.

Dielectric porcelain composition and dielectric resonator using the same

The invention relates to a wiring circuit board including an electronic device disposed in a hole of the wiring circuit board; a resin filling the hole such that the electronic device is embedded in the resin; a wiring layer formed on the resin; and an interface between the resin and the wiring layer. This interface has a roughness in a range of 2-6 &mgr;m in terms of ten-point mean roughness.

Growing community of inventors

Nagoya, Japan

Kazushige Obayashi