Kabushiki Kaisha Toshiba

Kazushige Kanda

Kenichi Imamiya

Tamio Ikehashi

Hiroshi Nakamura

Koji Hosono

Ken Takeuchi

Takashi Mori

Takuya Futatsuyama

Naoya Tokiwa

Koichi Kawai

Shigeo Ohshima

Toshiaki Edahiro

Yuki Okukawa

Toshihiro Suzuki

Katsuaki Isobe

Akira Umezawa

Toshiki Hisada

Takahiko Sasaki

Tomonori Kurosawa

Toshihiko Himeno

Kazuaki Kawaguchi

Yoshiharu Hirata

Masaki Ichikawa

Kazuhiko Kakizoe

Yoshiaki Hashiba

A semiconductor memory device includes a bit line, an active region formed in a semiconductor substrate, a plug formed on the active region and connecting the bit line to the active region, a memory cell which includes a first gate insulating film on the active region, a charge storage layer on the first gate insulating film, a first insulating film on the charge storage layer, and a control gate electrode on the first insulating film, a select transistor formed between the plug and the memory cell on the active region and including a second gate insulating film on the active region, a first electrode layer on the second gate insulating film, a second insulating film on the first electrode layer, and a second electrode layer on the second insulating film, and a wiring formed above the active region between the plug and the second electrode layer of the select transistor.

Semiconductor memory device

A semiconductor memory device is provided, including a memory cell array having a plurality of memory cells; an internal circuit having a function required in a storage operation of the memory cell array; a parameter storage unit configured to store a certain parameter and to have a storage place specified by a parameter address, the certain parameter designating an operation of the internal circuit; a command register configured to store a command instructing an operation of the internal circuit; and a converting circuit configured to adjust at least one of the parameter address and the command that differ between products or between standards to the internal circuit.

Semiconductor memory device and method of setting operation environment therein

According to one embodiment, a semiconductor memory device includes a plurality of memory cell arrays each includes a plurality of memory cells, the plurality of memory cell arrays being stacked on a semiconductor substrate to form a three-dimensional structure, and a data input/output circuit includes a first address buffer and a second address buffer configured to store a first address and a second address of the plurality of memory cells, and a controller configured to perform control to time-divisionally output the first address and the second address to a first address bus and a second address bus in data input/output.

Semiconductor memory device and control method of the same

According to the embodiments, a first write enable signal that changes with a constant period and a second write enable signal that changes at a time portion in which a limit time between activation/deactivation control of word lines and activation/deactivation control of bit lines is checked are input, a plurality of core control signals in which a time interval with which the core control signals change is locally shorter than a period of the first write enable signal based on the first write enable signal and the second write enable signal that are input is generated, and an operation verification of the resistive random access memory is performed by using the generated core control signals, whereby a cycle time in an arbitrary test cycle is locally and arbitrary adjusted.

Test device and test method for resistive random access memory and resistive random access memory device

Provided is a semiconductor memory device including: multiple bit lines arranged in parallel to one another; multiple sense-amplifier bit lines arranged away from end portions of the bit lines; a fourth sense-amplifier bit line formed with a wire of a first layer arranged below the bit lines; selection transistors with a pair of gate electrodes arranged in a direction normal to the first to sixth bit lines; a first wire arranged below the bit lines and the sense-amplifier bit lines, and having an end portion extending to below the third bit line and connected to the bit line; a third wire formed with a layer of the gate electrode used as a wire, the third wire including a first end portion positioned below the fourth sense-amplifier bit line and connected to the fourth sense-amplifier bit line, and a second end portion positioned below the second sense-amplifier bit line; and a fourth wire formed with a wire of the first layer and arranged between the third wire and the second sense-amplifier bit line to connect the third wire to the second sense-amplifier bit line.

According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array, and a control circuit. The memory cell array includes plural memory cells arranged in rows and columns and each including a diode and resistance-change element. The control circuit tests the diodes for the respective memory cells. The control circuit tests the diode at least at one of times before and after one of a write operation, erase operation and read operation with respect to the memory cell is performed.

Nonvolatile semiconductor memory device capable of testing diodes and manufacturing method thereof

A semiconductor device includes a reset sequence circuit, a latch circuit, and a reset control circuit. The reset sequence circuit is activated by receiving an externally input signal when a reset operation is started and outputs a first trigger signal. The latch circuit is capable of holding selection information on circuits capable of being reset. The selection information is externally input. The reset control circuit outputs a reset signal on the basis of the selection information held in the latch circuit in response to a power-on reset signal and the first trigger signal output from the reset sequence circuit.

Semiconductor device having reset command

A semiconductor integrated circuit device related to an embodiment of the present invention includes an address register which includes an internal selection circuit connected with a control circuit, a signal generation instruction circuit which instructs the control circuit so that a predetermined internal control signal is generated, a latch circuit, a plurality of which are arranged corresponding to a number of bits of test parameter data, the latch circuit latching test result data which is provided from the data program/read circuit and outputting the test result data to the selection circuit and externally, the control circuit generating an internal control signal which activates the selection circuit at a timing at which a fixed value data of the test parameter data is changed, and the selection circuit controlling a test so that a fixed value data of the test parameter data is changed.

Semiconductor integrated circuit device

According to one embodiment, a semiconductor memory device includes a memory cell array includes memory cells, lines provided to correspond to the memory cells, a first decoder configured to select a first line as an inspection target from the lines, a second decoder configured to select a second line for generating a reference voltage from the lines, a driver configured to charge the first and second lines, a discharging circuit configured to simultaneously discharge the first and second lines, and a sense amplifier configured to compare a voltage of the first line with a voltage of the second line to detect a defect of the first line while the first line is discharged.

Semiconductor memory device and inspecting method of the same

The present invention provides a method for writing data to a non-volatile memory device having first wirings and second wirings intersecting one another and memory cells arranged at each intersection therebetween, each of the memory cells having a variable resistive element and a rectifying element connected in series. According to the method, the second wirings are charged to a certain voltage not less than a rectifying-element threshold value, prior to a rise in a selected first wiring. Then, a selected first wiring is charged to a voltage required for writing or erasing, after which a selected second wiring is discharged.

Non-volatile memory device and method for writing data thereto

A method of programming a non-volatile memory device with memory cells formed of variable resistance elements and disposed between word lines and bit lines, includes: previously charging a selected word line and a selected bit line together with a non-selected word line and a non-selected bit line up to a certain voltage; and further charging the selected word line and the non-selected bit line up to a program voltage higher than the certain voltage and a program-block voltage, respectively, and simultaneously discharging the selected bit line.

Method of programming a non-volatile memory device

A nonvolatile semiconductor memory device having a plurality of word lines and a plurality of bit lines and a plurality of sense amplifiers, each amplifier being connected to one of the plurality of bit lines respectively and a memory cell array including a memory cell region including a plurality of memory strings having a plurality of electrically reprogrammable memory cells connected in series, each of the memory cells having two or more storage states, said plurality of memory cells being connected to a corresponding word line of the plurality of word lines respectively, the plurality of memory strings being connected to a corresponding bit line of the plurality of bit lines respectively, and at the time of programming all of the plurality of bit lines are selected, the number of the storage states being different in two of the memory cells which are adjacent on the same bit line.

Nonvolatile semiconductor memory device in which an amount of data to be stored in a memory cell is allocated to every other word line units of one word line

According to one embodiment, a nonvolatile memory device includes: a memory cell array including memory cells each having a variable resistance element for nonvolatilely storing data identified by an electrically rewritable resistance value; a first data latch storing write and erase data to be written on a given group of memory cells of the memory cell array for a write and erase operation; and a second data latch storing reference data for performing a compensation operation of the given group to compensate write and erase disturbance accompanied by the write or erase operation.

Growing community of inventors

Kawasaki, Japan

Kazushige Kanda